Infineon Technologies CY7C1360C-200AXC

Overview

CY7C1360C-200AXC from Infineon Technologies (formerly Cypress) is a 9-Mbit pipelined synchronous SRAM with 256K × 36 organization, supporting 200 MHz bus operation, 3.3 V core supply (VDD), and 2.5 V/3.3 V I/O (VDDQ). It delivers 3.0 ns clock-to-output time and implements registered inputs/outputs for high-speed burst-mode memory interfacing in network packet buffers and high-end FPGA co-processor caches.

For engineers reviewing the CY7C1360C-200AXC datasheet, CY7C1360C-200AXC pinout, CY7C1360C-200AXC application, or CY7C1360C-200AXC equivalent, key selection criteria include synchronous burst timing compliance, byte-write control granularity (BWA–BWD), dual-chip-enable support, and TQFP-100 Pb-free packaging with JTAG boundary scan.

Technical Context

The device uses a positive-edge-triggered CLK to register all synchronous inputs-including addresses, CE1/CE2/CE3, ADSP/ADSC/ADV, BWE/BWX, and GW-enabling deterministic pipelined access. Burst addressing is generated internally via a two-bit counter controlled by ADV, supporting Intel Pentium®-compatible interleaved or linear sequences.

It supports synchronous self-timed writes with programmable byte-width (1–4 bytes), asynchronous OE for output control, and ZZ pin for low-power sleep mode. All I/Os are JEDEC JESD8-5 compliant, and the part integrates IEEE 1149.1 JTAG boundary scan for production testability.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, with three chip enables (CE1, CE2, CE3) and full JTAG boundary-scan support.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IS61WV102436BLL-200TQLI and MT55LSD25636PZ-200:G, the CY7C1360C-200AXC uniquely combines 2.5 V/3.3 V I/O flexibility, deep-sleep (ZZ) mode, and integrated JTAG in a Pb-free TQFP-making it optimal for industrial upgrades and telecom replacements requiring backward-compatible footprint and debug capability.

Availability

CY7C1360C-200AXC is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and telecom line card memory applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1360C-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for legacy Cypress memory and interface devices.

This part belongs to the Cypress Synchronous SRAM product line, designed specifically for high-speed deterministic memory interfacing in networking, telecom, and real-time embedded systems where pipelined access and burst predictability are critical.

FAQ

What is the function of the MODE pin on CY7C1360C-200AXC?

The MODE pin selects burst address sequence behavior: logic HIGH configures Intel Pentium®-compatible interleaved addressing, while logic LOW selects linear burst mode. This hardware-selectable feature eliminates software configuration overhead and ensures deterministic timing alignment with host processors that expect specific burst patterns.

Does CY7C1360C-200AXC support partial-word writes without read-modify-write cycles?

Yes. The device supports true byte-selectable writes via four independent byte write enable pins (BWA–BWD), allowing 1-, 2-, or 4-byte updates per clock cycle. Each byte lane operates independently, and global write (GW) can override all byte enables to write all 36 bits simultaneously.

Can CY7C1360C-200AXC operate with 2.5 V I/O while maintaining 3.3 V core supply?

Yes. VDDQ is independently powered and accepts either 2.5 V or 3.3 V, while VDD remains fixed at 3.3 V. This dual-voltage I/O capability allows direct interfacing with both 2.5 V ASICs and 3.3 V FPGAs without external level shifters, reducing BOM count and signal integrity risk.

Is JTAG boundary scan functional on the CY7C1360C-200AXC in TQFP package?

Yes. The 100-pin TQFP package includes full IEEE 1149.1 JTAG support with dedicated TCK, TMS, TDI, and TDO pins. Boundary scan functionality is enabled by default and does not require fuse programming or external configuration-supporting automated test and interconnect verification in production.