Infineon Technologies CY7C1360C-200AXCT

Overview

CY7C1360C-200AXCT from Infineon Technologies (formerly Cypress) is a 9-Mbit pipelined synchronous SRAM with 256K × 36 organization, supporting 200 MHz bus operation, 3.3 V core supply (VDD), and 2.5 V/3.3 V I/O (VDDQ). It features registered inputs/outputs, 3.0 ns clock-to-output time, and IEEE 1149.1 JTAG boundary scan - deployed in high-speed network packet buffers and telecom line card control planes.

For engineers reviewing the CY7C1360C-200AXCT datasheet, CY7C1360C-200AXCT pinout, CY7C1360C-200AXCT application, or CY7C1360C-200AXCT equivalent, key selection criteria include burst mode compatibility (Intel Pentium® interleaved/linear), synchronous self-timed write support, byte-write granularity (1–4 bytes), and TQFP-100 Pb-free packaging with dual chip-enable options.

Technical Context

This SRAM implements a two-bit internal burst counter synchronized to CLK's positive edge, enabling deterministic address generation via ADV, ADSP, and ADSC strobes. All address, data, and control inputs (CE1/CE2/CE3, BWx, GW, BWE) are registered on-chip for precise timing alignment.

It supports asynchronous OE and ZZ (sleep) control while maintaining synchronous read/write pipelines. The memory array is partitioned into four 9-bit-wide I/O groups (A–D), each with dedicated DQ/DQP pins and independent byte-write drivers, enabling concurrent 36-bit access with sub-nanosecond skew control.

Key Specifications

Pinout & Package

Package: Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body, 0.5 mm pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar pipelined SRAM applications.

Compared with IDT72V2115L15PF and IS61WV102436B, CY7C1360C-200AXCT uniquely combines 200 MHz operation, hardware-configurable burst sequencing, JTAG testability, and active-low sleep mode - making it optimal for latency-critical, testable, and thermally constrained embedded systems.

Availability

CY7C1360C-200AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card control, radar signal processing, and industrial PLC motion control requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1360C-200AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-performance memory solutions.

CY7C1360C belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered for deterministic, high-throughput data buffering in networking, telecom, and real-time embedded systems where timing predictability and bus protocol fidelity are critical.

FAQ

What is the function of the MODE pin on CY7C1360C-200AXCT?

The MODE pin selects burst address sequence behavior: logic HIGH configures Intel Pentium®-compatible interleaved addressing (e.g., 0, 2, 4, 6), while logic LOW enables linear addressing (e.g., 0, 1, 2, 3). This hardware-selectable mode eliminates software overhead and ensures cycle-accurate compatibility with legacy CPU bus controllers.

Does CY7C1360C-200AXCT support 2.5 V-only I/O operation?

Yes - VDDQ may be supplied at 2.5 V ±0.2 V while VDD remains at 3.3 V ±0.3 V. All I/O pins (DQx, DQP x, OE, etc.) meet JEDEC JESD8-5 specifications for 2.5 V LVTTL, enabling direct interfacing with 2.5 V FPGAs and ASICs without level translation.

How does the ZZ (sleep) pin reduce power consumption?

When ZZ is driven LOW asynchronously, the device disables internal clocks, input registers, and output drivers, reducing CMOS standby current to less than 5 µA. Recovery to active operation requires one clock cycle after ZZ returns HIGH - no initialization sequence is needed.

Can CE2 and CE3 be used simultaneously for depth expansion?

Yes - CE2 and CE3 serve as secondary chip enables for stacking multiple CY7C1360C devices to increase total memory depth. CE3 is only available in the "A" version TQFP and 165-ball FBGA packages; the "AJ" TQFP variant uses CE1/CE2 only. Pin compatibility must be verified per package variant.