Infineon Technologies CY7C1360C-200BGC

Overview

CY7C1360C-200BGC from Infineon Technologies (formerly Cypress) is a 9-Mbit pipelined synchronous SRAM with 256K × 36 organization, supporting 200 MHz bus operation, 3.3 V core supply (VDD), and 2.5 V/3.3 V I/O (VDDQ). It features registered inputs/outputs, IEEE 1149.1 JTAG boundary scan, and is packaged in a Pb-free 100-pin TQFP. It serves as high-speed buffer memory in network packet processors and telecom line cards.

For engineers reviewing the CY7C1360C-200BGC datasheet, CY7C1360C-200BGC pinout, CY7C1360C-200BGC application, or CY7C1360C-200BGC equivalent, key selection criteria include clock-to-output timing (3.0 ns), burst mode flexibility (Intel Pentium® interleaved/linear), synchronous self-timed writes, and dual-voltage I/O compatibility for seamless integration with 2.5 V or 3.3 V logic domains.

Technical Context

The CY7C1360C-200BGC implements a fully synchronous, pipelined architecture where all address, data, and control inputs-including CE1/CE2/CE3, ADSP/ADSC, ADV, BWA–BWD, GW, and BWE-are registered on the rising edge of CLK. Internal burst addressing is generated by a two-bit counter controlled by ADV and MODE pins.

It supports byte-selectable writes (1-, 2-, or 4-byte width) via dedicated byte write enables, synchronous self-timed write cycles, asynchronous output enable (OE), and low-power ZZ sleep mode. All I/Os comply with JEDEC JESD8-5, enabling interoperability with both 2.5 V and 3.3 V systems without level shifters.

Key Specifications

Pinout & Package

Packaged in a Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm, with 0.5 mm pitch. Pinout corresponds to the "A version" (3-chip-enable configuration) per Figure 1 of datasheet 38-05540 Rev. *U.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed pipelined SRAM applications.

Compared with IS61WV102436BLL-200BLI and MT55LSD00128G36BG-200:K, the CY7C1360C-200BGC uniquely combines 2.5 V/3.3 V I/O adaptability, integrated JTAG, and TQFP packaging-enabling drop-in upgrades in legacy telecom hardware without voltage rail or test infrastructure changes.

Availability

CY7C1360C-200BGC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card control memory, baseband processor cache, and radar signal processing FIFO applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1360C-200BGC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-performance memory solutions.

The CY7C1360C belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for deterministic, low-latency data buffering in telecom infrastructure, networking equipment, and real-time signal processing systems.

FAQ

What is the function of the MODE pin on CY7C1360C-200BGC?

The MODE pin selects burst address sequencing: logic HIGH configures Intel Pentium®-compatible interleaved bursts, while logic LOW enables linear burst mode. This setting is sampled at the first rising edge of CLK after device power-up or reset and remains latched until next power cycle or ZZ exit. No runtime reconfiguration is supported.

Does CY7C1360C-200BGC support true dual-port operation?

No. The CY7C1360C-200BGC is a single-port synchronous SRAM with pipelined read/write capability. It does not support simultaneous independent read and write operations on separate ports. Its architecture uses a single address/data bus with registered control signals to achieve high throughput via pipelining-not concurrent access.

Can CE2 and CE3 be used simultaneously with CE1 for depth expansion?

Yes. In the 3-chip-enable (A-version) TQFP package, CE1 serves as primary chip select, while CE2 and CE3 act as secondary enables for stacking multiple CY7C1360C devices vertically. CE2 and CE3 are active-HIGH and must be asserted alongside CE1 to enable the device; they do not operate independently as standalone chip selects.

Is JTAG boundary scan enabled by default on CY7C1360C-200BGC?

Yes. IEEE 1149.1 JTAG is factory-enabled and functional upon power-up. The TAP controller operates using dedicated pins (TCK, TMS, TDI, TDO) and requires no external configuration. JTAG can be disabled only by writing a specific instruction to the BYPASS register via TAP-this is irreversible without power cycle and is rarely performed in production use.