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Infineon Technologies CY7C1360C-200BGCT
- Part No.:
- CY7C1360C-200BGCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
CY7C1360C-200BGCT.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,743
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Product details
Overview
CY7C1360C-200BGCT from Infineon Technologies (formerly Cypress) is a 9-Mbit pipelined synchronous SRAM with 256K × 36 organization, supporting 200 MHz bus operation, 3.3 V core supply (VDD), and 2.5 V/3.3 V I/O (VDDQ). It features registered inputs/outputs, 3.0 ns clock-to-output time, and IEEE 1149.1 JTAG boundary scan - deployed in high-speed network packet buffers and CPU cache coherency subsystems.
For engineers reviewing the CY7C1360C-200BGCT datasheet, CY7C1360C-200BGCT pinout, CY7C1360C-200BGCT application, or CY7C1360C-200BGCT equivalent, key selection criteria include burst mode compatibility (Intel Pentium® interleaved/linear), synchronous self-timed write support, byte-write granularity control (BWA–BWD), and TQFP/BGA package availability with CE1–CE3 chip enable flexibility.
Technical Context
This SRAM implements a two-bit internal burst counter synchronized to CLK's rising edge, enabling deterministic address generation via ADV, ADSP, and ADSC strobes. All address, data, and control inputs (including CE1–CE3, BWE, GW) are registered on-chip to ensure timing predictability across 200 MHz operation.
It supports asynchronous OE and ZZ (sleep) control while maintaining synchronous read/write pipelines. The memory array is partitioned for 36-bit-wide access with dedicated DQP parity bits per byte lane, and I/O voltage separation (VDDQ) allows mixed-voltage system interfacing without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 configuration) |
| Max Clock Frequency | 200 MHz - enables 200 MT/s sustained throughput with pipelined addressing |
| Access Time | 3.0 ns - clock-to-output delay at 200 MHz, critical for tight CPU/SOC timing budgets |
| Core Supply Voltage | 3.3 V ± 0.3 V (VDD) - standard LVTTL-compatible core rail |
| I/O Supply Voltage | 2.5 V or 3.3 V (VDDQ) - supports interoperation with both 2.5 V and 3.3 V logic families |
| Burst Mode | User-selectable Intel Pentium® interleaved or linear sequence - matches legacy processor bus protocols |
| Power Dissipation | 220 mA max operating current - defines thermal budget for dense memory subsystems |
Pinout & Package
Package: 119-ball BGA (14 × 22 × 2.4 mm), Pb-free, with 2-chip-enable (CE1, CE2) configuration and integrated JTAG TAP (TCK/TMS/TDI/TDO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Positive-edge-triggered system clock | Synchronizes all registered inputs/outputs; determines maximum 200 MHz operational frequency |
| ADSP / ADSC | Address strobe (processor/controller) | Triggers registration of address and chip enables on next CLK edge; selects master strobe source |
| ADV | Address advance control | Enables internal burst counter to generate sequential addresses during pipelined reads/writes |
| CE1, CE2 | Chip enable inputs | Active-low enables; CE1 primary, CE2 secondary - supports depth expansion with multiple devices |
| BWA–BWD | Byte write enable inputs | Individually gate 4 × 9-bit data lanes; enable partial writes without read-modify-write overhead |
| DQA–DQD, DQPA–DQPD | Data I/O and parity outputs | 36-bit data + 4-bit parity (9-bit/byte); VDDQ-referenced for 2.5 V/3.3 V interface compatibility |
| ZZ | Deep power-down input | Asynchronous entry to low-current sleep mode (<40 µA standby), independent of clock state |
Key Features
| Feature | Design Value |
|---|---|
| Registered pipelined interface | Eliminates external latch requirements and simplifies timing closure for 200 MHz bus designs |
| Synchronous self-timed writes | Removes need for external write pulse generation; write duration determined internally by device |
| User-selectable burst sequence | Hardware-mode pin (MODE) configures Intel Pentium® interleaved or linear addressing for legacy compatibility |
| Separate VDDQ supply | Enables direct connection to 2.5 V ASIC/FPGA I/O banks without external level translation circuitry |
| JTAG boundary scan (IEEE 1149.1) | Supports automated PCB test and interconnect verification in high-density memory modules |
Applications
| Network Packet Buffering | CPU Cache Coherency |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfaced directly to switch fabric ASICs via 200 MHz synchronous bus. Use Value: 3.0 ns clock-to-output and pipelined burst access reduce packet queuing latency by up to 12% versus non-pipelined alternatives. |
Use Scenario: Maintaining snoop filter state and directory entries in multi-core x86 server processors. IC Role / Device Role / Timing Role: Shared tag RAM accessed concurrently by multiple CPU cores using interleaved burst addressing. Use Value: CE1/CE2 depth expansion and MODE-pin burst selection ensure compatibility with Intel Front Side Bus timing protocols. |
| Telecom Line Card Memory | Industrial Real-Time Controller |
|
Use Scenario: Frame buffering and header processing in OC-192 SONET/SDH line cards. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic access to ATM cell payloads under strict jitter constraints. Use Value: ZZ sleep mode reduces idle power to <40 µA, meeting NEBS Level 3 thermal limits for sealed chassis deployments. |
Use Scenario: Storing motion control trajectory tables and I/O status snapshots in CNC machine controllers. IC Role / Device Role / Timing Role: Deterministic-access memory mapped into real-time OS kernel space with guaranteed 3.0 ns read response. Use Value: Asynchronous OE and synchronous pipelining allow mixed-criticality access - background logging and hard real-time servo updates share same bus. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C36256P-20TC | 256K × 36, 200 MHz, 3.3 V only (no VDDQ separation), no JTAG, 100-pin TQFP only | Lacks VDDQ flexibility and boundary scan; suitable only where 3.3 V I/O is universal and test coverage is handled externally | Select when cost sensitivity outweighs mixed-voltage support and production testability requirements |
| IS61WV25636BLL-200BLI | 256K × 36, 200 MHz, 3.3 V core/I/O, no burst mode selection, no ZZ sleep, 119-ball BGA | Fixed linear burst only; no deep power-down; requires external clock gating for low-power states | Choose when JTAG and sleep mode are unnecessary and board layout favors BGA-only footprint |
Compared with AS7C36256P-20TC and IS61WV25636BLL-200BLI, the CY7C1360C-200BGCT uniquely combines VDDQ voltage flexibility, hardware-configurable burst modes, IEEE 1149.1 testability, and asynchronous sleep - making it optimal for complex, mixed-voltage, high-assurance systems.
Availability
CY7C1360C-200BGCT is available at Aetrix Electronics and suitable for network packet buffering, CPU cache coherency subsystems, and telecom line card memory requiring stable component supply across extended product lifecycles.
Supply support for CY7C1360C-200BGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for the former Cypress SRAM portfolio.
The CY7C1360C belongs to the Pipelined SRAM product line, engineered specifically for high-throughput, low-latency memory interfacing in networking, computing, and telecommunications infrastructure equipment.
FAQ
What is the function of the MODE pin on CY7C1360C-200BGCT?
The MODE pin selects between Intel Pentium®-compatible interleaved burst addressing (MODE = HIGH) and linear burst addressing (MODE = LOW). This hardware configuration eliminates software overhead for burst sequence control and ensures deterministic timing alignment with legacy processor buses.
Does CY7C1360C-200BGCT support true 2.5 V I/O operation?
Yes - when VDDQ is supplied at 2.5 V ± 0.2 V, all DQ/DQP pins operate at 2.5 V logic levels with guaranteed AC/DC specifications. The device maintains full 200 MHz performance and 3.0 ns access time under 2.5 V I/O conditions, as verified in the official Infineon datasheet Rev. *U.
Can CE2 and CE3 be used simultaneously for depth expansion?
No - CE2 and CE3 are mutually exclusive enable inputs. CE2 is used in 2-CE configurations (e.g., 119-ball BGA), while CE3 is reserved for 3-CE variants (e.g., 100-pin TQFP-A and 165-ball FBGA). The datasheet explicitly states CE3 is unavailable in the 119-ball BGA package.
Is JTAG boundary scan enabled by default on CY7C1360C-200BGCT?
JTAG is factory-enabled and functional upon power-up; no configuration fuse or initialization sequence is required. TCK, TMS, TDI, and TDO pins operate per IEEE 1149.1 at 3.3 V or 2.5 V (matching VDDQ), and the TAP controller responds to standard instructions including SAMPLE/PRELOAD, EXTEST, and IDCODE.
CY7C1360C-200BGCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
CY7C1360C-200BGCT FAQ
1.How can I place an order for CY7C1360C-200BGCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1360C-200BGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1360C-200BGCT reliable?
The price and inventory of CY7C1360C-200BGCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1360C-200BGCT is usually 5 days.
3.What payment methods are accepted for CY7C1360C-200BGCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1360C-200BGCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1360C-200BGCT?
CY7C1360C-200BGCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1360C-200BGCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1360C-200BGCT?
For technical support, including CY7C1360C-200BGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1360C-200BGCT requirements.
6.How does Aetrix verify that CY7C1360C-200BGCT is sourced from the original manufacturer or authorized distributors?
All CY7C1360C-200BGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1360C-200BGCT meets industry standards.
7.What is the process for return or replacement of CY7C1360C-200BGCT?
All CY7C1360C-200BGCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1360C-200BGCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1360C-200BGCT part is unused and in its original packaging.
Return procedure for CY7C1360C-200BGCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1360C-200BGCT Tags
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