Infineon Technologies CY7C1361A-100BGC

Overview

CY7C1361A-100BGC from Cypress Semiconductor is a 256K × 36-bit synchronous flow-through burst SRAM with 100 MHz clock speed, 8.0 ns access time, and 3.3 V core supply. It implements pipelined address registration, interleaved/linear burst modes, and byte-selectable write control (BWa–BWd) for high-bandwidth memory interfacing in network packet buffers and real-time DSP subsystems.

For engineers reviewing the CY7C1361A-100BGC datasheet, CY7C1361A-100BGC pinout, CY7C1361A-100BGC application, or CY7C1361A-100BGC equivalent, key selection criteria include burst sequence control (MODE), depth-expansion chip enables (CE/CE2), JTAG test support (TMS/TDI/TCK/TDO), and low-power ZZ mode operation - all confirmed in the official Rev. *C datasheet.

Technical Context

This SRAM uses synchronous, positive-edge-triggered CLK to register addresses (A0–A1), data inputs (DQa–DQd), and control signals (CE, ADSC, ADSP, ADV, BWa–BWd, BWE, GW). Address pipelining via ADSP/ADSC enables overlapping address setup and data transfer, reducing effective latency across consecutive burst cycles.

Burst operation is internally generated using a two-bit counter controlled by ADV and MODE pins; linear or interleaved sequences are selected statically. Write cycles are self-timed and support 1–4 byte granularity via independent byte write enables, with global write (GW) enabling full 36-bit writes independent of byte controls.

Key Specifications

Pinout & Package

Package: 119-ball PBGA (14 mm × 22 mm, ball pitch 1.27 mm), RoHS-compliant, with dedicated VCCQ and VSS planes for I/O noise isolation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IS61WV25636BLL-10BLI and CY7C1371-100BGC, CY7C1361A-100BGC uniquely delivers integrated burst sequencing, address pipelining, and JTAG testability in a single 119-ball PBGA - enabling compact, high-reliability, and test-ready memory subsystems without external glue logic.

Availability

CY7C1361A-100BGC is available at Aetrix Electronics and suitable for network switching, DSP acceleration, and telecom line card applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for CY7C1361A-100BGC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.

CY7C1361A belongs to Cypress's Synchronous Burst SRAM product line, engineered specifically for low-latency, high-throughput buffering in packet-processing and real-time control subsystems where deterministic timing and burst efficiency are critical.

FAQ

What is the function of the MODE pin on CY7C1361A-100BGC?

The MODE pin selects the internal burst address sequence: a logic LOW configures linear burst (0,1,2,3), while NC or HIGH selects interleaved burst (0,2,1,3). This matches CPU cache line layouts or DMA engine expectations without software intervention. The pin is static - set once at power-up or configuration time - and has no effect outside burst cycles.

Does CY7C1361A-100BGC support 2.5 V I/O operation?

Yes - VCCQ can be supplied at either 3.3 V or 2.5 V, allowing direct interface with 2.5 V logic families without level shifters. Core VCC remains fixed at 3.3 V ±5%/+10%. Input thresholds remain LVTTL-compatible regardless of VCCQ setting, and all I/Os (except CLK, OE, ZZ) are 5 V tolerant when VCCQ = 2.5 V.

How does CE2 differ between package versions of CY7C1361A-100BGC?

CE2 is active HIGH and available only on the TQFP "A" version (100-pin), used for depth expansion with staggered deselect timing to eliminate bus contention. It is not present on the 119-ball PBGA (BGC) or TQFP "AJ" versions - those rely solely on CE for chip selection. Pin 92 on the A-version TQFP is dedicated to CE2; it is NC on other variants.

Can CY7C1361A-100BGC operate without JTAG signals connected?

Yes - TMS, TDI, TCK, and TDO are only functional during boundary-scan test mode and have no impact on normal memory operation. On BG/AJ packages, these pins may be left unconnected or tied to VSS/VCC per board layout requirements. They are not bonded in the "A" package version, so no connection is needed or possible.