Infineon Technologies CY7C1361B-117AC
- Part No.:
- CY7C1361B-117AC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1361B-117AC.pdf
- Description:
- IC SRAM 9MBIT PAR 117MHZ 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,436
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1361B-117AC from Cypress Semiconductor is a 9-Mbit synchronous flow-through SRAM organized as 256K × 36, designed for high-speed cache and buffer applications in Pentium-class microprocessor systems. It operates at 117 MHz with 7.5 ns clock-to-output delay, supports dual VDDQ (2.5 V or 3.3 V), and features user-selectable linear/interleaved burst modes via the MODE pin. Its JEDEC-standard 100-pin TQFP package includes three chip enables (CE1–CE3) and JTAG boundary-scan capability.
For engineers reviewing the CY7C1361B-117AC datasheet, CY7C1361B-117AC pinout, CY7C1361B-117AC application, or CY7C1361B-117AC equivalent, key selection criteria include burst timing control (ADSP/ADSC/ADV), byte-write granularity (BWA–BWD + BWE), synchronous clocked address/data capture, and low-latency flow-through architecture for zero-wait-state CPU interfacing.
Technical Context
The CY7C1361B-117AC implements a synchronous, clock-driven interface where all address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK. A 2-bit internal burst counter captures A[1:0] at ADSP/ADSC assertion and auto-increments addresses during burst reads/writes controlled by ADV.
Burst sequencing (linear vs. interleaved) is statically selected by the MODE pin; CE1 (active-low), CE2 (active-high), and CE3 (active-low) enable hierarchical chip selection; GW enables full-word writes independent of byte-write enables; and OE provides asynchronous output tri-state control without affecting internal timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 organization), enabling direct interface to 36-bit-wide Pentium data buses without external width expansion. |
| Max Clock Frequency | 117 MHz - defines maximum sustained burst throughput of 4.2 GB/s (36-bit × 117 MHz) in flow-through mode. |
| Access Time (tCO) | 7.5 ns - guaranteed clock-to-output delay ensures compatibility with sub-10 ns CPU read cycles. |
| VDD / VDDQ Supply | 3.3 V ±5% core (VDD); selectable 2.5 V or 3.3 V I/O (VDDQ) - supports mixed-voltage system integration with legacy or low-voltage peripherals. |
| Burst Control | Intel Pentium-compatible interleaved/linear burst via MODE pin - eliminates need for external burst sequencer logic. |
| Write Architecture | Synchronous self-timed write with global (GW) and byte-select (BWA–BWD + BWE) controls - enables precise 8-bit, 16-bit, or 32-bit partial-word updates. |
| Power Management | ZZ sleep mode (active-high) reduces standby current to ≤30 mA while preserving data - critical for power-constrained embedded cache subsystems. |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), RoHS-compliant, body size 14 mm × 14 mm, 0.5 mm pitch. Pin mapping validated per Cypress Document #38-05302 Rev. *B (Pages 4–5).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK (Pin 89) | Clock Input | Rising-edge-triggered master timing reference for all synchronous registers (address, data, CE, BW, GW, ADV, ADSP, ADSC). |
| ADSP (Pin 84) / ADSC (Pin 85) | Address Strobe Inputs | Asynchronous initiation signals that latch A[1:0] into burst counter and full address into register on next CLK rise; ADSP takes priority over ADSC. |
| ADV (Pin 83) | Address Advance | Controls internal burst counter increment: asserted LOW on CLK rise advances address for next burst word - enables pipelined sequential access. |
| CE1 (Pin 98), CE2 (Pin 97), CE3 (Pin 92) | Chip Enable Inputs | Three-level decode: CE1 (active-low), CE2 (active-high), CE3 (active-low) allow hierarchical memory banking and depth expansion without glue logic. |
| BWA–BWD (Pins 93–96), BWE (Pin 87) | Byte Write Controls | Four independent 8-bit write masks (BWA–BWD) qualified by BWE - enables true 8-bit granularity writes to 36-bit data bus (DQA–DQPD + DQPA–DQPD). |
| OE (Pin 86) | Output Enable | Asynchronous, active-low control of I/O direction: LOW enables outputs; HIGH places DQ/DQP lines in high-impedance state - supports shared bus arbitration. |
| ZZ (Pin 64) | Sleep Mode Input | Active-high signal forcing device into low-power retention mode (≤30 mA ICC) with full data retention - no clock required during sleep. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous architecture | Eliminates pipeline stalls by delivering read data on the same clock cycle as address strobe assertion - enables zero-wait-state CPU operation. |
| User-selectable burst order (MODE pin) | Hardware-configurable linear or interleaved burst sequences match either Pentium or generic processor requirements without firmware reconfiguration. |
| Dual VDDQ support (2.5 V / 3.3 V) | Allows seamless integration into mixed-voltage systems - e.g., 3.3 V core with 2.5 V ASIC I/O or DDR memory interfaces. |
| JTAG boundary-scan (TQFP A-version) | Enables IEEE 1149.1-compliant board-level test and interconnect verification without requiring additional test pads or fixtures. |
| Separate processor/controller address strobes | ADSP and ADSC inputs permit dedicated cache controller and CPU access paths - simplifies dual-master bus arbitration logic. |
Applications
| Level-2 Cache Buffer | Pentium-Class CPU Interface |
|---|---|
|
Use Scenario: High-speed L2 cache between Pentium II/III processors and main memory. IC Role / Device Role / Timing Role: Flow-through SRAM acting as zero-latency write-through cache tag/data store with burst-aligned read/write cycles. Use Value: 7.5 ns tCO and 117 MHz operation meet Pentium's 8 ns timing budget for backside bus transactions. |
Use Scenario: Direct CPU data-path buffering in embedded x86 systems with legacy chipset support. IC Role / Device Role / Timing Role: Synchronous interface bridging CPU address/data/control signals to wider memory subsystems using ADSP/ADV timing. Use Value: Native 36-bit bus width and Intel burst protocol eliminate glue logic, reducing PCB layer count and signal integrity risk. |
| Network Packet Buffer | Industrial Real-Time Controller Memory |
|
Use Scenario: Temporary storage for variable-length Ethernet frames in switch fabric ASICs. IC Role / Device Role / Timing Role: Burst-capable SRAM absorbing inbound packet bursts via ADSC-controlled controller writes and ADSP-triggered CPU reads. Use Value: Byte-write enables (BWA–BWD + BWE) allow efficient partial-frame updates without full-line overwrites. |
Use Scenario: Deterministic memory for motion-control PLCs requiring jitter-free I/O response. IC Role / Device Role / Timing Role: Predictable 7.5 ns read latency and ZZ sleep mode support hard real-time scheduling and low-power idle states. Use Value: Synchronous self-timed write guarantees write completion within one clock cycle - essential for time-critical servo update loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1361C-133AC | 133 MHz version (6.5 ns tCO); identical pinout and feature set; higher ICC (250 mA max). | Requires tighter timing closure and higher power delivery; suitable only where 133 MHz bus bandwidth is mandatory. | Select only if system clock exceeds 117 MHz and layout supports stricter signal integrity margins. |
| IS61LV25636A-10TL | 10 ns tCO, 100 MHz max; 3.3 V only (no VDDQ flexibility); no JTAG or ZZ sleep mode. | Lacks burst mode selection and advanced power management; limited to simpler, cost-sensitive designs. | Choose when burst control and low-power sleep are unnecessary and 10 ns latency suffices. |
Compared with CY7C1361C-133AC, the -117AC trades 16 MHz speed for lower power and relaxed timing margins; versus IS61LV25636A-10TL, it adds burst flexibility, dual-VDDQ, and sleep mode at higher cost and complexity.
Availability
CY7C1361B-117AC is available at Aetrix Electronics and suitable for high-performance computing, network infrastructure, and industrial control applications requiring stable component supply, long-lifecycle support, and verified timing compliance.
Supply support for CY7C1361B-117AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and computing markets.
The CY7C1361B belongs to Cypress's synchronous flow-through SRAM product line, engineered specifically to replace asynchronous SRAMs in Pentium-class CPU cache subsystems while eliminating wait states and minimizing board-level timing complexity.
FAQ
What is the function of the MODE pin on CY7C1361B-117AC?
The MODE pin selects burst sequence type: tied to VDD (or left floating) enables Intel Pentium-style interleaved bursting; tied to GND enables linear bursting. It is a static strap pin-must remain stable during operation-and features an internal pull-up resistor. This eliminates need for external configuration logic and ensures deterministic burst behavior aligned with host processor expectations.
Can CY7C1361B-117AC operate with 2.5 V I/O while maintaining 3.3 V core voltage?
Yes. The device supports independent VDD (3.3 V ±5%) and VDDQ (2.5 V or 3.3 V) supplies. This allows direct interfacing with 2.5 V ASICs or FPGAs while retaining full 3.3 V core performance. VDDQ pins must be decoupled separately, and all I/O signals (DQ, DQP, control) conform to JEDEC JESD8-5 levels at the selected VDDQ voltage.
How does the ZZ sleep mode affect data retention and wake-up timing?
When ZZ is driven HIGH, the device enters non-time-critical sleep mode with data fully retained and ICC reduced to ≤30 mA. No clock is required during sleep. Wake-up occurs synchronously on the first valid CLK edge after ZZ returns LOW, with full functionality restored within one clock cycle-no initialization delay or refresh overhead.
Is the 100-pin TQFP package of CY7C1361B-117AC compatible with standard reflow profiles?
Yes. The JEDEC-standard 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch) is rated for lead-free reflow per IPC/JEDEC J-STD-020. Peak temperature tolerance is 260 °C for 10 seconds. Cypress specifies moisture sensitivity level (MSL) 3, requiring bake-out if exposed >168 hours at ambient before reflow.
CY7C1361B-117AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 117 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1361B-117AC FAQ
1.How can I place an order for CY7C1361B-117AC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1361B-117AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1361B-117AC reliable?
The price and inventory of CY7C1361B-117AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361B-117AC is usually 5 days.
3.What payment methods are accepted for CY7C1361B-117AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1361B-117AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1361B-117AC?
CY7C1361B-117AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1361B-117AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1361B-117AC?
For technical support, including CY7C1361B-117AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361B-117AC requirements.
6.How does Aetrix verify that CY7C1361B-117AC is sourced from the original manufacturer or authorized distributors?
All CY7C1361B-117AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361B-117AC meets industry standards.
7.What is the process for return or replacement of CY7C1361B-117AC?
All CY7C1361B-117AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361B-117AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1361B-117AC part is unused and in its original packaging.
Return procedure for CY7C1361B-117AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1361B-117AC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

