Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies CY7C1361C-100AXC

Name: CY7C1361C-100AXC
Brand: Infineon Technologies
SKU: CY7C1361C-100AXC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: CY7C1361C-100AXC

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 100-LQFP

Datasheet:: CY7C1361C-100AXC.pdf

Description:: IC SRAM 9MBIT PAR 100TQFP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,116

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

CY7C1361C-100AXC from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with 256K × 36 organization, designed for high-speed cache and buffer interfacing in microprocessor systems. It operates at 100 MHz with 8.5 ns clock-to-output access time, supports 3.3 V core (±5%/+10%) and 2.5/3.3 V I/O supplies, and features Intel Pentium-compatible burst addressing via ADSP/ADSC strobes.

For engineers reviewing the CY7C1361C-100AXC datasheet, CY7C1361C-100AXC pinout, CY7C1361C-100AXC application, or CY7C1361C-100AXC equivalent, key selection criteria include synchronous burst timing, dual-voltage I/O flexibility, JTAG boundary-scan support, and TQFP-100 package compatibility with CE1/CE2/CE3 chip enables.

Technical Context

This SRAM implements a synchronous flow-through architecture where address, data, and control inputs are registered on the rising edge of CLK. Burst sequences-interleaved or linear-are selected by the MODE pin and advanced using ADV, ADSP, or ADSC signals, enabling 2-1-1-1 access rates without external pipelining logic.

All writes are synchronous and self-timed; reads support asynchronous OE control. The device integrates a 2-bit on-chip burst counter, byte-write registers per data nibble (BW_A–BW_D), and IEEE 1149.1-compliant JTAG for boundary-scan testing, with dedicated TDI/TDO/TCK/TMS pins in BGA/FBGA packages.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	9 Mbit (256K × 36 organization)
Max Clock Frequency	100 MHz - defines maximum sustained burst throughput
Access Time (t_CO)	8.5 ns - guaranteed clock-to-output delay for timing-critical read paths
Core Supply (V_DD)	3.3 V ±5% / +10% - accommodates industrial voltage tolerance without regulation overhead
I/O Supply (V_DDQ)	2.5 V or 3.3 V - enables direct interface to mixed-voltage SoC buses
Burst Mode Control	MODE pin selects Intel Pentium interleaved or linear sequence - ensures compatibility with legacy x86 cache controllers
Package	Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) - RoHS-compliant, surface-mount compatible with standard reflow profiles

Pinout & Package

The CY7C1361C-100AXC is supplied in a Pb-free 100-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, measuring 14 mm × 20 mm × 1.4 mm. Pin functions are validated per Figure 1 (A version, 3-chip-enable configuration) in datasheet 38-05541 Rev. *U.

Pin/Terminal	Circuit Role	Design Meaning
CLK	Clock input	Positive-edge-triggered master timing reference for all synchronous inputs
ADSP / ADSC	Address strobe (processor / controller)	Initiates burst sequence; determines which address register captures first address
ADV	Address advance	Controls internal burst address increment during multi-cycle accesses
CE1 / CE2 / CE3	Chip enable inputs	Three independent enables allow depth expansion across multiple SRAMs without glue logic
OE	Output enable	Asynchronous control for output buffer tri-state - decouples read timing from clock domain
ZZ	Deep sleep mode	Reduces standby current to ≤40 mA (commercial/industrial) when asserted low
MODE	Burst sequence selector	High = interleaved (Pentium), Low = linear - matches specific CPU cache controller protocol
BW_A–BW_D	Byte write enables	Independent 9-bit write masking per data port (DQA–DQD), enabling partial-word updates

Key Features

Feature	Design Value
Synchronous flow-through architecture	Eliminates pipeline stall cycles in burst reads/writes, enabling deterministic 2-1-1-1 access rate
User-selectable burst sequence	Hardware-mode pin (MODE) guarantees protocol alignment with Intel Pentium or custom controllers without firmware overhead
Dual-voltage I/O (2.5 V / 3.3 V)	Permits direct connection to both legacy 3.3 V and modern low-power 2.5 V bus interfaces without level shifters
JTAG boundary-scan (IEEE 1149.1)	Enables PCB-level interconnect test and debug without physical probe access to high-density TQFP pins
Separate processor/controller address strobes	ADSP and ADSC inputs allow coexistence of CPU and cache controller on shared memory bus with independent timing control

Applications

High-Performance CPU Cache Buffer

Network Packet Buffer

Use Scenario: L2 cache buffer between x86-compatible microprocessor and main memory subsystem.

IC Role / Device Role / Timing Role: Synchronous flow-through SRAM providing zero-wait-state burst reads aligned to Pentium interleaved addressing.

Use Value: 8.5 ns t_CO and 2-1-1-1 access rate eliminate pipeline bubbles, sustaining >800 MB/s bandwidth at 100 MHz.

Use Scenario: Temporary storage for variable-length Ethernet frames in Layer 2 switch ASIC.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer supporting concurrent ingress/egress DMA transfers.

Use Value: Dual-voltage I/O allows direct interface to 2.5 V packet parser and 3.3 V MAC controller, reducing BOM count.

Industrial PLC Real-Time Data Log

Radar Signal Processing FIFO

Use Scenario: Cyclic data capture from analog I/O modules in deterministic motion control systems.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as time-stamped acquisition buffer with burst write capability.

Use Value: ZZ sleep mode reduces idle power to ≤40 mA, extending thermal margin in sealed enclosures.

Use Scenario: First-in-first-out buffer for digitized RF samples in automotive radar front-end.

IC Role / Device Role / Timing Role: Flow-through SRAM absorbing high-rate ADC output bursts with minimal latency jitter.

Use Value: 100 MHz clocking and 8.5 ns t_CO ensure sub-10 ns timing resolution for phase-coherent signal processing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS61WV25632ALL-10BLI	256K × 32 organization, 10 ns access, 3.3 V only I/O, no JTAG	Lacks burst mode control and MODE pin; requires external logic for Pentium-compatible sequencing	Select when cost-sensitive designs accept reduced feature set and omit boundary-scan testability
MT55LSD25632D1PG-100:G	256K × 32, 100 MHz, 3.3 V core/I/O, no ZZ sleep mode	No deep-sleep function; higher standby current (75 mA vs. 40 mA); no ADSC/ADSP separation	Prefer for space-constrained designs needing FBGA footprint but tolerating higher static power

Compared with IS61WV25632ALL-10BLI and MT55LSD25632D1PG-100:G, the CY7C1361C-100AXC uniquely delivers Intel-compatible burst control, JTAG testability, and dual-voltage I/O in a single TQFP package-critical for legacy CPU interface and production test coverage.

Availability

CY7C1361C-100AXC is available at Aetrix Electronics and suitable for high-speed CPU cache buffers, network packet buffers, and industrial real-time data loggers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1361C-100AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensor, and memory solutions for industrial, automotive, and communications markets.

The CY7C1361C belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for high-bandwidth, low-latency interfacing with x86 and RISC microprocessors in cache and buffering applications.

FAQ

What is the function of the MODE pin on CY7C1361C-100AXC?

The MODE pin selects burst address sequence type: HIGH configures interleaved addressing (compatible with Intel Pentium processors), while LOW enables linear addressing. This hardware-selectable mode eliminates software configuration overhead and ensures deterministic timing alignment with host controller protocols.

Does CY7C1361C-100AXC support JTAG boundary-scan in the TQFP package?

No-JTAG pins (TDI, TDO, TCK, TMS) are only present in the 119-ball BGA and 165-ball FBGA packages. The 100-pin TQFP variant (including -100AXC) omits JTAG functionality; boundary-scan capability is package-dependent and not implemented in this TQFP configuration.

Can VDDQ be operated at 2.5 V while VDD remains at 3.3 V?

Yes-VDDQ may be independently set to 2.5 V or 3.3 V while VDD is maintained at 3.3 V ±5%/+10%. This dual-supply flexibility allows direct interfacing with mixed-voltage system buses without external level translators, as confirmed in the "Electrical Characteristics" section of datasheet 38-05541 Rev. *U.

What is the purpose of separate ADSP and ADSC inputs?

ADSP (Address Strobe Processor) and ADSC (Address Strobe Controller) provide independent burst initiation triggers-one for CPU-initiated accesses and one for cache controller or DMA engine requests. This separation enables concurrent memory arbitration without timing conflicts, supporting complex multi-master bus architectures.

CY7C1361C-100AXC Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: 100-LQFP

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Synchronous, SDR

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 100 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 8.5 ns

Voltage - Supply:: 3.135V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 100-TQFP (14x20)

CY7C1361C-100AXC FAQ

1.How can I place an order for CY7C1361C-100AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1361C-100AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1361C-100AXC reliable?

The price and inventory of CY7C1361C-100AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361C-100AXC is usually 5 days.

3.What payment methods are accepted for CY7C1361C-100AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1361C-100AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1361C-100AXC?

CY7C1361C-100AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1361C-100AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1361C-100AXC?

For technical support, including CY7C1361C-100AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361C-100AXC requirements.

6.How does Aetrix verify that CY7C1361C-100AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1361C-100AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361C-100AXC meets industry standards.

7.What is the process for return or replacement of CY7C1361C-100AXC?

All CY7C1361C-100AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361C-100AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1361C-100AXC part is unused and in its original packaging.

Return procedure for CY7C1361C-100AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…