Infineon Technologies CY7C1361C-100AXCT
- Part No.:
- CY7C1361C-100AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1361C-100AXCT.pdf
- Description:
- IC SRAM 9MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,919
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Product details
Overview
CY7C1361C-100AXCT from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with 256K × 36 organization, designed for high-speed cache and buffer interfacing in microprocessor systems. It operates at 100 MHz with 8.5 ns clock-to-output access time, supports 3.3 V core (±5%/+10%) and 2.5/3.3 V I/O supplies, and features Intel Pentium-compatible interleaved/linear burst addressing via MODE pin.
For engineers reviewing the CY7C1361C-100AXCT datasheet, CY7C1361C-100AXCT pinout, CY7C1361C-100AXCT application, or CY7C1361C-100AXCT equivalent, key selection criteria include burst sequence control (MODE), dual VDDQ support, JTAG boundary scan compliance, and TQFP-100 package compatibility with CE1/CE2/CE3 chip enables.
Technical Context
This SRAM implements synchronous flow-through architecture with positive-edge-triggered CLK registration of all address, data, and control inputs (ADSP, ADSC, ADV, CE1–CE3, BWx, BWE, GW). Burst addressing is managed by a 2-bit on-chip counter that auto-increments after initial address capture, enabling 2-1-1-1 access rate.
Asynchronous OE and ZZ (sleep mode) pins operate independently of clock; output drivers are JEDEC JESD8-5 compliant; IEEE 1149.1 JTAG boundary scan is integrated and configurable via TAP controller with TDI/TDO/TCK/TMS pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 bits), fixed organization for wide-data-path buffering |
| Max Clock Frequency | 100 MHz - defines maximum sustained burst throughput in synchronous systems |
| Access Time (tCO) | 8.5 ns - guaranteed clock-to-valid-output delay under commercial conditions |
| Core Supply (VDD) | 3.3 V ±5% / +10% - accommodates industrial rail tolerance without external regulation |
| I/O Supply (VDDQ) | 2.5 V or 3.3 V - enables interoperability with mixed-voltage SoC interfaces |
| Burst Mode Control | MODE pin selects Intel Pentium interleaved (HIGH) or linear (LOW) addressing sequence |
| Package | Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) - RoHS-compliant, surface-mount compatible |
Pinout & Package
Package: Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body height, 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Positive-edge-triggered master timing reference for all synchronous registers |
| ADSP / ADSC | Address strobe (processor / controller) | Initiates burst sequence; determines which address register captures first address |
| ADV | Address advance | Controls internal address increment during burst; active-high, edge-sensitive |
| MODE | Burst sequence selector | HIGH = Intel Pentium interleaved; LOW = linear - configures address generation logic |
| CE1 / CE2 / CE3 | Chip enable inputs | Three independent enables for depth expansion or bank selection in multi-SRAM systems |
| OE | Output enable | Asynchronous, active-low control of output drivers - enables bus sharing without clock dependency |
| ZZ | Deep power-down | Asynchronous sleep mode entry; reduces standby current to ≤60 mA (automotive) or ≤40 mA (commercial) |
| VDDQ | I/O power supply | Separate 2.5 V or 3.3 V rail for DQ/DQP pins - isolates I/O noise from core logic |
Key Features
| Feature | Design Value |
|---|---|
| Synchronous flow-through architecture | Eliminates pipeline stalls in burst reads/writes; supports 2-1-1-1 access pattern for CPU cache lines |
| User-selectable burst sequence | Hardware MODE pin directly configures address order-no firmware overhead or configuration register required |
| Dual VDDQ support | Enables direct interface to 2.5 V ASICs or 3.3 V FPGAs without level shifters or external translators |
| JTAG boundary scan (IEEE 1149.1) | Full pin-level testability in assembled systems; supports production ICT and board-level diagnostics |
| Separate processor/controller address strobes | ADSP and ADSC allow independent burst initiation from CPU or cache controller-reduces arbitration logic |
Applications
| High-Performance CPU Cache Buffer | Network Packet Buffer |
|---|---|
Use Scenario: L2 cache tag/data buffer between x86-compatible processor and memory controller. IC Role / Device Role / Timing Role: Synchronous flow-through SRAM providing sub-10 ns read latency and burst-aligned write capability. Use Value: Enables 100 MHz bus operation with deterministic 2-1-1-1 access timing-eliminates wait states in Pentium-class pipelines. | Use Scenario: Temporary storage for ingress/egress packet headers and metadata in Layer 2/3 switches. IC Role / Device Role / Timing Role: Wide-port (36-bit) buffer supporting parallel header parsing and forwarding decision logic. Use Value: 256K × 36 organization matches typical 128-byte packet descriptor + 64-byte payload alignment-reducing external memory accesses. |
| Industrial PLC Real-Time Data Log | Automotive ADAS Pre-Processing Buffer |
Use Scenario: Cyclic logging of sensor inputs and actuator commands in deterministic real-time control loops. IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM interfaced to ARM Cortex-R or TriCore MCU via synchronous bus. Use Value: ZZ sleep mode reduces idle power to ≤40 mA-critical for fanless, thermally constrained enclosures. | Use Scenario: Frame buffering between camera sensor interface and vision DSP in lane-departure warning systems. IC Role / Device Role / Timing Role: High-reliability SRAM with automotive-grade temperature range (–40°C to +125°C) and neutron soft-error immunity. Use Value: JTAG boundary scan enables in-system verification of signal integrity on safety-critical video data paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV25636BLL-10BLI | 10 ns tCO, 256K × 36, 3.3 V only VDDQ, no JTAG, 119-ball BGA | Lacks MODE-selectable burst; requires external burst sequencing logic | Choose when JTAG testability is unnecessary and BGA footprint is preferred |
| MT55LSD25636DZ-100:G | 100 MHz, 256K × 36, 1.8 V VDDQ only, no ZZ mode, 165-ball FBGA | Lower I/O voltage incompatible with 2.5 V legacy interfaces; no deep-sleep option | Choose only for new designs targeting 1.8 V ecosystems and FBGA assembly |
Compared with IS61WV25636BLL-10BLI and MT55LSD25636DZ-100:G, CY7C1361C-100AXCT uniquely combines MODE-configurable burst addressing, dual-VDDQ flexibility, and integrated JTAG-making it optimal for upgrade paths from Pentium-era systems requiring testability and voltage compatibility.
Availability
CY7C1361C-100AXCT is available at Aetrix Electronics and suitable for high-speed CPU cache buffers, network packet processing engines, and automotive ADAS pre-processing subsystems requiring stable component supply across extended product lifecycles.
Supply support for CY7C1361C-100AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for industrial, automotive, and communications markets.
CY7C1361C belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for low-latency, burst-oriented interfacing with high-performance microprocessors and cache controllers.
FAQ
What is the function of the MODE pin on CY7C1361C-100AXCT?
The MODE pin selects burst address sequencing: HIGH configures Intel Pentium-style interleaved addressing (e.g., 0, 8, 4, 12), while LOW enables linear addressing (e.g., 0, 1, 2, 3). This hardware-selectable behavior eliminates software configuration overhead and ensures deterministic timing in cache coherency protocols.
Does CY7C1361C-100AXCT support both 2.5 V and 3.3 V I/O interfaces simultaneously?
No-VDDQ must be set to either 2.5 V or 3.3 V, not both. The device uses a single VDDQ rail to power all DQ and DQP pins; mixing voltages on this rail violates absolute maximum ratings and may damage the part. System design must select one I/O voltage during power-up.
Can CE2 and CE3 be used independently for depth expansion?
Yes-CE2 and CE3 are fully independent chip enables, each controlling separate memory segments. When used with CE1, they enable 3-way depth expansion (e.g., stacking three 256K × 36 devices to form 768K × 36). CE3 is only available on the 3-CE TQFP variant (A version), not the 2-CE AJ version.
Is JTAG boundary scan enabled by default on CY7C1361C-100AXCT?
JTAG is implemented but disabled by default at power-on. It must be activated via the TAP controller using the TEST pin (if present) or through specific power-up sequencing per the datasheet's "Disabling the JTAG Feature" section. No external pull-up/down is required to enable it-activation is purely state-machine driven.
CY7C1361C-100AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1361C-100AXCT FAQ
1.How can I place an order for CY7C1361C-100AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1361C-100AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1361C-100AXCT reliable?
The price and inventory of CY7C1361C-100AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361C-100AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1361C-100AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1361C-100AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1361C-100AXCT?
CY7C1361C-100AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1361C-100AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1361C-100AXCT?
For technical support, including CY7C1361C-100AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361C-100AXCT requirements.
6.How does Aetrix verify that CY7C1361C-100AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1361C-100AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361C-100AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1361C-100AXCT?
All CY7C1361C-100AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361C-100AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1361C-100AXCT part is unused and in its original packaging.
Return procedure for CY7C1361C-100AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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