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Infineon Technologies CY7C1361C-100AXCT

Part No.:
CY7C1361C-100AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1361C-100AXCT.pdf
Description:
IC SRAM 9MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,919

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Product details

Overview

CY7C1361C-100AXCT from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with 256K × 36 organization, designed for high-speed cache and buffer interfacing in microprocessor systems. It operates at 100 MHz with 8.5 ns clock-to-output access time, supports 3.3 V core (±5%/+10%) and 2.5/3.3 V I/O supplies, and features Intel Pentium-compatible interleaved/linear burst addressing via MODE pin.

For engineers reviewing the CY7C1361C-100AXCT datasheet, CY7C1361C-100AXCT pinout, CY7C1361C-100AXCT application, or CY7C1361C-100AXCT equivalent, key selection criteria include burst sequence control (MODE), dual VDDQ support, JTAG boundary scan compliance, and TQFP-100 package compatibility with CE1/CE2/CE3 chip enables.

Technical Context

This SRAM implements synchronous flow-through architecture with positive-edge-triggered CLK registration of all address, data, and control inputs (ADSP, ADSC, ADV, CE1–CE3, BWx, BWE, GW). Burst addressing is managed by a 2-bit on-chip counter that auto-increments after initial address capture, enabling 2-1-1-1 access rate.

Asynchronous OE and ZZ (sleep mode) pins operate independently of clock; output drivers are JEDEC JESD8-5 compliant; IEEE 1149.1 JTAG boundary scan is integrated and configurable via TAP controller with TDI/TDO/TCK/TMS pins.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density9 Mbit (256K × 36 bits), fixed organization for wide-data-path buffering
Max Clock Frequency100 MHz - defines maximum sustained burst throughput in synchronous systems
Access Time (tCO)8.5 ns - guaranteed clock-to-valid-output delay under commercial conditions
Core Supply (VDD)3.3 V ±5% / +10% - accommodates industrial rail tolerance without external regulation
I/O Supply (VDDQ)2.5 V or 3.3 V - enables interoperability with mixed-voltage SoC interfaces
Burst Mode ControlMODE pin selects Intel Pentium interleaved (HIGH) or linear (LOW) addressing sequence
PackagePb-free 100-pin TQFP (14 × 20 × 1.4 mm) - RoHS-compliant, surface-mount compatible

Pinout & Package

Package: Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body height, 0.5 mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
CLKClock inputPositive-edge-triggered master timing reference for all synchronous registers
ADSP / ADSCAddress strobe (processor / controller)Initiates burst sequence; determines which address register captures first address
ADVAddress advanceControls internal address increment during burst; active-high, edge-sensitive
MODEBurst sequence selectorHIGH = Intel Pentium interleaved; LOW = linear - configures address generation logic
CE1 / CE2 / CE3Chip enable inputsThree independent enables for depth expansion or bank selection in multi-SRAM systems
OEOutput enableAsynchronous, active-low control of output drivers - enables bus sharing without clock dependency
ZZDeep power-downAsynchronous sleep mode entry; reduces standby current to ≤60 mA (automotive) or ≤40 mA (commercial)
VDDQI/O power supplySeparate 2.5 V or 3.3 V rail for DQ/DQP pins - isolates I/O noise from core logic

Key Features

FeatureDesign Value
Synchronous flow-through architectureEliminates pipeline stalls in burst reads/writes; supports 2-1-1-1 access pattern for CPU cache lines
User-selectable burst sequenceHardware MODE pin directly configures address order-no firmware overhead or configuration register required
Dual VDDQ supportEnables direct interface to 2.5 V ASICs or 3.3 V FPGAs without level shifters or external translators
JTAG boundary scan (IEEE 1149.1)Full pin-level testability in assembled systems; supports production ICT and board-level diagnostics
Separate processor/controller address strobesADSP and ADSC allow independent burst initiation from CPU or cache controller-reduces arbitration logic

Applications

High-Performance CPU Cache BufferNetwork Packet Buffer

Use Scenario: L2 cache tag/data buffer between x86-compatible processor and memory controller.

IC Role / Device Role / Timing Role: Synchronous flow-through SRAM providing sub-10 ns read latency and burst-aligned write capability.

Use Value: Enables 100 MHz bus operation with deterministic 2-1-1-1 access timing-eliminates wait states in Pentium-class pipelines.

Use Scenario: Temporary storage for ingress/egress packet headers and metadata in Layer 2/3 switches.

IC Role / Device Role / Timing Role: Wide-port (36-bit) buffer supporting parallel header parsing and forwarding decision logic.

Use Value: 256K × 36 organization matches typical 128-byte packet descriptor + 64-byte payload alignment-reducing external memory accesses.

Industrial PLC Real-Time Data LogAutomotive ADAS Pre-Processing Buffer

Use Scenario: Cyclic logging of sensor inputs and actuator commands in deterministic real-time control loops.

IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM interfaced to ARM Cortex-R or TriCore MCU via synchronous bus.

Use Value: ZZ sleep mode reduces idle power to ≤40 mA-critical for fanless, thermally constrained enclosures.

Use Scenario: Frame buffering between camera sensor interface and vision DSP in lane-departure warning systems.

IC Role / Device Role / Timing Role: High-reliability SRAM with automotive-grade temperature range (–40°C to +125°C) and neutron soft-error immunity.

Use Value: JTAG boundary scan enables in-system verification of signal integrity on safety-critical video data paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV25636BLL-10BLI10 ns tCO, 256K × 36, 3.3 V only VDDQ, no JTAG, 119-ball BGALacks MODE-selectable burst; requires external burst sequencing logicChoose when JTAG testability is unnecessary and BGA footprint is preferred
MT55LSD25636DZ-100:G100 MHz, 256K × 36, 1.8 V VDDQ only, no ZZ mode, 165-ball FBGALower I/O voltage incompatible with 2.5 V legacy interfaces; no deep-sleep optionChoose only for new designs targeting 1.8 V ecosystems and FBGA assembly

Compared with IS61WV25636BLL-10BLI and MT55LSD25636DZ-100:G, CY7C1361C-100AXCT uniquely combines MODE-configurable burst addressing, dual-VDDQ flexibility, and integrated JTAG-making it optimal for upgrade paths from Pentium-era systems requiring testability and voltage compatibility.

Availability

CY7C1361C-100AXCT is available at Aetrix Electronics and suitable for high-speed CPU cache buffers, network packet processing engines, and automotive ADAS pre-processing subsystems requiring stable component supply across extended product lifecycles.

Supply support for CY7C1361C-100AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for industrial, automotive, and communications markets.

CY7C1361C belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for low-latency, burst-oriented interfacing with high-performance microprocessors and cache controllers.

FAQ

What is the function of the MODE pin on CY7C1361C-100AXCT?

The MODE pin selects burst address sequencing: HIGH configures Intel Pentium-style interleaved addressing (e.g., 0, 8, 4, 12), while LOW enables linear addressing (e.g., 0, 1, 2, 3). This hardware-selectable behavior eliminates software configuration overhead and ensures deterministic timing in cache coherency protocols.

Does CY7C1361C-100AXCT support both 2.5 V and 3.3 V I/O interfaces simultaneously?

No-VDDQ must be set to either 2.5 V or 3.3 V, not both. The device uses a single VDDQ rail to power all DQ and DQP pins; mixing voltages on this rail violates absolute maximum ratings and may damage the part. System design must select one I/O voltage during power-up.

Can CE2 and CE3 be used independently for depth expansion?

Yes-CE2 and CE3 are fully independent chip enables, each controlling separate memory segments. When used with CE1, they enable 3-way depth expansion (e.g., stacking three 256K × 36 devices to form 768K × 36). CE3 is only available on the 3-CE TQFP variant (A version), not the 2-CE AJ version.

Is JTAG boundary scan enabled by default on CY7C1361C-100AXCT?

JTAG is implemented but disabled by default at power-on. It must be activated via the TAP controller using the TEST pin (if present) or through specific power-up sequencing per the datasheet's "Disabling the JTAG Feature" section. No external pull-up/down is required to enable it-activation is purely state-machine driven.

CY7C1361C-100AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1361C-100AXCT FAQ

1.How can I place an order for CY7C1361C-100AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1361C-100AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1361C-100AXCT reliable?

The price and inventory of CY7C1361C-100AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361C-100AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1361C-100AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1361C-100AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1361C-100AXCT?

CY7C1361C-100AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1361C-100AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1361C-100AXCT?

For technical support, including CY7C1361C-100AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361C-100AXCT requirements.

6.How does Aetrix verify that CY7C1361C-100AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1361C-100AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361C-100AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1361C-100AXCT?

All CY7C1361C-100AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361C-100AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1361C-100AXCT part is unused and in its original packaging.

Return procedure for CY7C1361C-100AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1361C-100AXCT Tags

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