My Inquiry
My Account
Infineon Technologies CY7C1361C-100AXE
- Part No.:
- CY7C1361C-100AXE
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1361C-100AXE.pdf
- Description:
- IC SRAM 9MBIT PAR 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,160
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1361C-100AXE from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with 256K × 36 organization, designed for high-speed cache and buffer interfacing in microprocessor systems. It operates at 100 MHz with 8.5 ns clock-to-output access time, supports 3.3 V core (±5%/+10%) and 2.5/3.3 V I/O supplies, and features Intel Pentium-compatible interleaved/linear burst addressing via MODE pin.
For engineers reviewing the CY7C1361C-100AXE datasheet, CY7C1361C-100AXE pinout, CY7C1361C-100AXE application, or CY7C1361C-100AXE equivalent, key selection criteria include burst sequence control (MODE), dual VDD/VDDQ supply separation, JTAG boundary-scan support (TCK/TDI/TDO/TMS), and 100-pin TQFP package compatibility with CE1–CE3 chip enables.
Technical Context
The device implements a synchronous, clock-driven architecture where all address, data, and control inputs (ADSP, ADSC, ADV, CE1–CE3, BWx, BWE, GW) are registered on the rising edge of CLK. Burst addressing is managed by a 2-bit on-chip counter that auto-increments after the initial address capture.
Asynchronous functions include OE-controlled output enable and ZZ-sleep mode entry; I/O voltage flexibility (2.5 V or 3.3 V) is enforced via separate VDDQ rail, while core logic runs strictly at 3.3 V ±5%/+10%. IEEE 1149.1 JTAG boundary scan is fully implemented with dedicated TAP controller and instruction set.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 organization) |
| Max Clock Frequency | 100 MHz - defines maximum sustained burst throughput without wait states |
| Access Time (tCO) | 8.5 ns - guaranteed clock-to-output delay under 100 MHz operation |
| Core Supply (VDD) | 3.3 V ±5% / +10% - ensures stable internal logic timing across industrial temperature range |
| I/O Supply (VDDQ) | 2.5 V or 3.3 V - enables direct interface to mixed-voltage SoC buses |
| Burst Mode Control | MODE pin selects Intel Pentium interleaved (HIGH) or linear (LOW) address sequencing |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, 3-chip-enable variant (A version) |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, 3-chip-enable configuration (A version), with exposed thermal pad per JEDEC MO-145.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Positive-edge-triggered master timing reference for all synchronous inputs and internal registers |
| ADSP / ADSC | Address strobe (processor / controller) | Initiates burst sequence; determines which address strobe captures first address into burst counter |
| ADV | Address advance | Controls internal address increment during burst; must be asserted each cycle for sequential advancement |
| MODE | Burst sequence selector | HIGH = Intel Pentium interleaved burst; LOW = linear burst - directly configures counter behavior |
| CE1 / CE2 / CE3 | Chip enable inputs | Three independent enables allow depth expansion and hierarchical memory mapping in multi-SRAM systems |
| ZZ | Deep power-down | Asynchronous entry to low-current sleep mode (<60 µA standby); retains data when VDD remains active |
| TCK / TDI / TDO / TMS | JTAG boundary-scan interface | IEEE 1149.1-compliant test access port enabling board-level interconnect verification and in-system programming |
Key Features
| Feature | Design Value |
|---|---|
| Synchronous flow-through architecture | Eliminates pipeline stalls during consecutive burst reads/writes; enables 2-1-1-1 access rate |
| User-selectable burst sequence | Hardware-mode pin (MODE) configures burst address order without software overhead or register writes |
| Dual-supply I/O interface | VDDQ independence allows seamless integration with 2.5 V ASICs or 3.3 V FPGAs without level shifters |
| On-chip burst counter | 2-bit counter auto-generates burst addresses after initial capture-reduces bus bandwidth and controller complexity |
| JTAG boundary scan | Full IEEE 1149.1 implementation supports production test, debug, and field diagnostics without additional test points |
Applications
| High-Performance CPU Cache | Network Packet Buffer |
|---|---|
Use Scenario: L2 cache for x86-compatible embedded processors requiring low-latency, burst-capable memory. IC Role / Device Role / Timing Role: Synchronous flow-through SRAM providing 100 MHz burst reads with 8.5 ns tCO to match processor bus timing. Use Value: Eliminates wait states during cache line fills; MODE pin enables direct compatibility with Pentium-style burst protocols. | Use Scenario: Temporary storage for ingress/egress packet headers and metadata in Gigabit Ethernet switches. IC Role / Device Role / Timing Role: High-bandwidth buffer interfacing with MAC controllers using ADSP/ADSC strobes for burst initiation. Use Value: Dual VDDQ support allows direct connection to 2.5 V PHY interfaces; ZZ mode reduces idle power in low-traffic periods. |
| Industrial PLC Memory Expansion | Radar Signal Processing Buffer |
Use Scenario: Real-time program/data memory extension in deterministic motion-control PLCs operating across –40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade SRAM with guaranteed 100 MHz operation and 3.3 V ±5%/+10% VDD tolerance. Use Value: CE1–CE3 enables modular memory bank expansion; JTAG supports in-field firmware validation and traceability. | Use Scenario: Intermediate storage for FFT coefficients and chirp samples in automotive radar front-ends. IC Role / Device Role / Timing Role: Low-jitter, synchronous buffer synchronized to radar baseband clock for deterministic latency. Use Value: 8.5 ns tCO ensures precise timing alignment with ADC/DAC sampling clocks; TQFP package offers robust thermal performance under vibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102432BLL-10TLI | 1024K × 32 organization, 10 ns tCO at 100 MHz, single 3.3 V supply (no VDDQ separation) | Lacks MODE-selectable burst sequence and JTAG; requires external level shifting for 2.5 V I/O domains | Select when VDDQ flexibility and Intel burst compatibility are not required; lower pin count (86-pin TSOP-II) |
| MT48LC32M32B2-75 | SDR SDRAM (32M × 32), 7.5 ns tAA, requires refresh and command protocol; no flow-through mode | Higher density but asynchronous command interface increases controller complexity and latency unpredictability | Select only when cost-per-bit outweighs deterministic timing needs; unsuitable for cache-like zero-wait-state operation |
Compared with IS61WV102432BLL-10TLI and MT48LC32M32B2-75, CY7C1361C-100AXE uniquely delivers guaranteed 8.5 ns flow-through timing, hardware-configurable burst sequences, and dual-supply I/O-critical for deterministic microprocessor coherency and mixed-voltage system integration.
Availability
CY7C1361C-100AXE is available at Aetrix Electronics and suitable for high-speed CPU cache subsystems, network packet buffering, and industrial PLC memory expansion requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1361C-100AXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.
CY7C1361C-100AXE belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for deterministic, low-latency interfacing with high-performance microprocessors and cache controllers.
FAQ
What is the function of the MODE pin on CY7C1361C-100AXE?
The MODE pin selects burst address sequencing: HIGH configures Intel Pentium-style interleaved bursts (e.g., 0, 2, 4, 6), while LOW enables linear bursts (e.g., 0, 1, 2, 3). This hardware-selectable mode eliminates software configuration overhead and ensures cycle-accurate compatibility with legacy x86 bus protocols.
Does CY7C1361C-100AXE support both 2.5 V and 3.3 V I/O simultaneously?
No-VDDQ must be set to either 2.5 V or 3.3 V for the entire device operation; it cannot mix voltages across DQ pins. The selected VDDQ voltage applies uniformly to all data and byte-write pins (DQA–DQD, DQPA–DQPD), ensuring signal integrity and JEDEC JESD8-5 compliance.
How does the ZZ pin affect data retention during sleep mode?
In ZZ mode, the device enters deep power-down with typical standby current <60 µA while maintaining full data retention-as long as VDD remains within specification (3.3 V ±5%/+10%). No external refresh or backup power is required; data is preserved indefinitely as long as core supply is present.
Can CY7C1361C-100AXE be used in automotive applications?
Yes-the 100 MHz speed grade (CY7C1361C-100AXE) is qualified for automotive AEC-Q100 Grade 2 (–40°C to +105°C) per Infineon's product continuity documentation. It supports automotive infotainment and ADAS subsystems requiring deterministic burst SRAM with JTAG testability and extended temperature reliability.
CY7C1361C-100AXE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1361C-100AXE FAQ
1.How can I place an order for CY7C1361C-100AXE through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1361C-100AXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1361C-100AXE reliable?
The price and inventory of CY7C1361C-100AXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361C-100AXE is usually 5 days.
3.What payment methods are accepted for CY7C1361C-100AXE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1361C-100AXE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1361C-100AXE?
CY7C1361C-100AXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1361C-100AXE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1361C-100AXE?
For technical support, including CY7C1361C-100AXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361C-100AXE requirements.
6.How does Aetrix verify that CY7C1361C-100AXE is sourced from the original manufacturer or authorized distributors?
All CY7C1361C-100AXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361C-100AXE meets industry standards.
7.What is the process for return or replacement of CY7C1361C-100AXE?
All CY7C1361C-100AXE units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361C-100AXE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1361C-100AXE part is unused and in its original packaging.
Return procedure for CY7C1361C-100AXE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1361C-100AXE Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
