Infineon Technologies CY7C1361C-100AXET

Overview

CY7C1361C-100AXET from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with 256K × 36 organization, designed for high-speed cache and buffer interfacing in microprocessor systems. It operates at 100 MHz with 8.5 ns clock-to-output access time, supports 3.3 V core (±5%/+10%) and 2.5/3.3 V I/O supplies, and features Intel Pentium-compatible burst addressing via ADSP/ADSC strobes.

For engineers reviewing the CY7C1361C-100AXET datasheet, CY7C1361C-100AXET pinout, CY7C1361C-100AXET application, or CY7C1361C-100AXET equivalent, key selection criteria include synchronous burst timing, dual-voltage I/O support, JTAG boundary-scan capability, and TQFP-100 packaging with three chip enables.

Technical Context

The device implements a synchronous, clock-driven architecture where all address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK. A 2-bit on-chip burst counter captures the initial address and auto-increments for subsequent burst cycles, supporting both interleaved and linear sequences selected by the MODE pin.

Burst initiation is controlled by either ADSP (processor address strobe) or ADSC (controller address strobe), with address advancement governed by the ADV signal. Write operations are self-timed and synchronous, while output enable (OE) and sleep mode (ZZ) operate asynchronously to allow flexible timing control in multi-master bus environments.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), 14 × 20 × 1.4 mm, Pb-free, with three chip enables (CE1, CE2, CE3) and JTAG test access pins (TCK, TMS, TDI, TDO).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IS61WV102436BLL-10BLI and MT48LC32M32B2-7E:G, the CY7C1361C-100AXET uniquely delivers guaranteed 8.5 ns synchronous access, dual-VDDQ support, and JTAG testability in a manufacturable TQFP package - making it irreplaceable for timing-critical, testable, mixed-voltage embedded cache designs.

Availability

CY7C1361C-100AXET is available at Aetrix Electronics and suitable for processor cache buffers, network packet buffers, and automotive ADAS pre-processing systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1361C-100AXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for automotive, industrial, and communications markets.

This device belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for high-bandwidth, low-latency interfacing with x86 and embedded microprocessors requiring burst-mode cache coherence without external timing logic.

FAQ

What is the function of the MODE pin on CY7C1361C-100AXET?

The MODE pin selects burst address sequencing: HIGH configures Intel Pentium-style interleaved addressing (0,2,4,6,1,3,5,7), while LOW enables linear addressing (0,1,2,3,4,5,6,7). This hardware-selectable mode ensures direct compatibility with legacy CPU burst protocols without software configuration or additional logic.

Does CY7C1361C-100AXET support 2.5 V I/O operation with a 3.3 V core supply?

Yes - VDD is rated 3.3 V ±5%/+10% for core logic, while VDDQ accepts either 2.5 V or 3.3 V independently. This dual-voltage I/O capability allows direct interfacing to 2.5 V ASICs or FPGAs without level shifters, maintaining signal integrity and reducing system power.

How does the ZZ (sleep) mode reduce power consumption?

In ZZ mode (active-low), the device enters deep power-down, reducing CMOS standby current to ≤40 mA (commercial/industrial) or ≤60 mA (automotive). All internal clocks and outputs are disabled, but data retention is maintained - enabling rapid wake-up (<50 ns) for event-driven applications like radar burst capture.

Is JTAG boundary scan supported on the 100-pin TQFP package?

Yes - the 100-pin TQFP (A version) includes dedicated TCK, TMS, TDI, and TDO pins compliant with IEEE 1149.1. This enables full boundary-scan testing of solder joints and interconnects, critical for high-reliability manufacturing of dense, fine-pitch PCB assemblies.