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Infineon Technologies CY7C1361C-133AXI
- Part No.:
- CY7C1361C-133AXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1361C-133AXI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,766
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Product details
Overview
CY7C1361C-133AXI from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM configured as 256K × 36, operating at 133 MHz with 6.5 ns clock-to-output delay, 3.3 V core supply (VDD), and dual-voltage I/O (2.5 V/3.3 V VDDQ), designed for high-speed cache and buffer interfacing in Pentium-class microprocessor systems.
For engineers reviewing the CY7C1361C-133AXI datasheet, CY7C1361C-133AXI pinout, CY7C1361C-133AXI application, or CY7C1361C-133AXI equivalent, key selection criteria include burst mode support (interleaved/linear), synchronous self-timed write capability, JTAG boundary-scan compliance, and TQFP-100 Pb-free packaging with 3-chip-enable architecture.
Technical Context
The device implements a synchronous interface with positive-edge-triggered CLK controlling registration of addresses, data, CE1/CE2/CE3, ADSC/ADSP/ADV, BWx, BWE, and GW. Burst addressing is managed by a 2-bit on-chip counter that latches the initial address and auto-increments per ADV assertion.
Asynchronous control includes OE (output enable) and ZZ (deep sleep mode), while MODE pin selects interleaved (HIGH) or linear (LOW) burst sequences. All inputs/outputs comply with JEDEC JESD8-5, supporting mixed 2.5 V/3.3 V I/O operation without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 organization), enabling full-word cache line storage for 32-bit+ bus architectures. |
| Max Clock Frequency | 133 MHz - supports sustained burst transfers aligned with Pentium II/III front-side bus timing. |
| Access Time (tCO) | 6.5 ns - guarantees sub-8 ns read latency from CLK edge to valid DQ output under 133 MHz operation. |
| VDD Supply Range | 3.3 V ±5% - ensures compatibility with standard 3.3 V logic rails and low-noise power delivery. |
| VDDQ Supply Options | 2.5 V or 3.3 V - allows direct interfacing with either DDR SDRAM I/O domains or legacy 3.3 V peripherals. |
| Burst Support | Intel Pentium-compatible interleaved/linear sequences - eliminates external burst address generation logic. |
| JTAG Compliance | IEEE 1149.1 boundary scan - enables in-system testability and PCB-level interconnect verification. |
Pinout & Package
Package: Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 × 20 × 1.4 mm, 3-chip-enable variant (A version), with exposed thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Positive-edge-triggered master timing reference for all synchronous inputs and internal burst counter. |
| ADSP / ADSC | Address strobe (processor / controller) | Initiates burst sequence; registers address on rising CLK edge when asserted - enables dual-bus topology support. |
| ADV | Address advance | Controls internal address increment during burst; allows pipelined or sequential access without external counter. |
| CE1 / CE2 / CE3 | Chip enable inputs | Three independent enables allow hierarchical memory mapping and depth expansion without glue logic. |
| MODE | Burst sequence selector | HIGH = Intel interleaved (0,2,4,6); LOW = linear (0,1,2,3) - matches CPU cache controller protocol requirements. |
| ZZ | Deep sleep mode | Reduces standby current to ≤40 mA (commercial/industrial); asynchronous entry/exit avoids clock-domain synchronization. |
| DQA–DQD, DQPA–DQPD | Data I/O (36-bit wide) | Byte-wide bidirectional data paths with individual byte-write enables (BWA–BWD) for partial-word writes. |
Key Features
| Feature | Design Value |
|---|---|
| Synchronous self-timed write | Internal write cycle completion detection eliminates need for external write-strobe timing control or WAIT signals. |
| User-selectable burst mode | Hardware MODE pin configures burst behavior at power-up - avoids firmware configuration overhead in boot-critical memory. |
| Separate ADSP/ADSC strobes | Enables concurrent CPU and cache controller access arbitration without external multiplexing logic. |
| Dual-voltage I/O (VDDQ) | Supports 2.5 V or 3.3 V I/O independently of 3.3 V core - simplifies mixed-voltage system integration. |
| JTAG boundary scan | Full IEEE 1149.1 implementation with TAP controller, instruction register, and boundary-scan chain - enables production test coverage >98%. |
Applications
| High-Performance CPU Cache Buffer | Network Packet Buffer |
|---|---|
|
Use Scenario: Storing L2 cache lines between Pentium-class processors and main memory controllers. IC Role / Device Role / Timing Role: Flow-through synchronous SRAM acting as zero-wait-state burst-access buffer with 6.5 ns tCO. Use Value: Eliminates glue logic for burst address generation and supports 133 MHz FSB-aligned transfers without pipeline stalls. |
Use Scenario: Temporary storage of Ethernet/PCI Express packet headers and payloads in switch ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing with DMA engines and MAC-layer controllers. Use Value: 36-bit width and byte-write enables allow efficient handling of variable-length packets without read-modify-write cycles. |
| Industrial Motion Controller Memory | Avionics Data Acquisition Buffer |
|
Use Scenario: Real-time interpolation table storage and command queue buffering in CNC motion controllers. IC Role / Device Role / Timing Role: Deterministic-access SRAM providing jitter-free data delivery to FPGA-based trajectory generators. Use Value: ZZ sleep mode reduces idle power to ≤40 mA while maintaining instant wake-up - critical for energy-constrained embedded systems. |
Use Scenario: High-integrity sensor data capture and preprocessing in flight control computers. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM buffer with JTAG testability for DO-254 compliance verification. Use Value: Neutron soft error immunity and boundary-scan diagnostics meet avionics functional safety requirements (DAL-B). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C361024B-133JCIN | 1024K × 36 organization, 3.3 V only VDDQ, no ZZ sleep mode, 133 MHz, 7.5 ns tCO. | Lacks deep-sleep mode and dual-VDDQ flexibility; requires external burst address logic. | Select when higher density (18 Mbit) is required and power gating is handled externally. |
| IS61WV102436B-133TQLI | 1024K × 36, 3.3 V core/I/O, 133 MHz, 7.0 ns tCO, no JTAG, no MODE-selectable burst. | Fixed linear burst only; no boundary scan; wider 120-pin TQFP package. | Choose for cost-sensitive industrial designs where JTAG and burst flexibility are non-critical. |
Compared with AS7C361024B-133JCIN and IS61WV102436B-133TQLI, CY7C1361C-133AXI uniquely combines 133 MHz performance, hardware-configurable burst mode, deep-sleep power management, and IEEE 1149.1 testability in a compact 100-pin TQFP - making it optimal for space- and reliability-constrained compute interfaces.
Availability
CY7C1361C-133AXI is available at Aetrix Electronics and suitable for high-speed CPU cache buffers, network packet processing subsystems, and industrial motion control systems requiring stable component supply across extended product lifecycles.
Supply support for CY7C1361C-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, delivering reliable, automotive-qualified semiconductor solutions globally.
CY7C1361C belongs to Cypress's legacy synchronous SRAM product line, engineered specifically for low-latency, burst-mode interfacing with x86-compatible microprocessors and cache controllers.
FAQ
What is the difference between CY7C1361C and CY7C1363C?
CY7C1361C is organized as 256K × 36 (9 Mbit), while CY7C1363C is 512K × 18 (9 Mbit). Both share identical timing, voltage, and feature sets, but differ in data width and address depth - CY7C1361C suits 36-bit bus systems, CY7C1363C targets 18-bit wide or depth-expanded configurations.
Does CY7C1361C-133AXI support both 2.5 V and 3.3 V I/O simultaneously?
No - VDDQ must be set to a single voltage (either 2.5 V or 3.3 V) for all I/O banks. The device does not support mixed-voltage operation on different DQ groups; VDDQ is a global I/O supply pin.
Can the MODE pin be left floating during operation?
No - MODE is an active-HIGH/LOW control pin with no internal pull-up/down. Floating MODE may cause undefined burst behavior; it must be hard-wired to VDD (for interleaved) or VSS (for linear) via a resistor or direct connection.
Is JTAG functionality enabled by default on CY7C1361C-133AXI?
Yes - IEEE 1149.1 boundary scan is fully implemented and active after power-up. It can be disabled only via the TAP instruction register using TMS/TCK sequences; no external disable pin or fuse option exists.
CY7C1361C-133AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1361C-133AXI FAQ
1.How can I place an order for CY7C1361C-133AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1361C-133AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1361C-133AXI reliable?
The price and inventory of CY7C1361C-133AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361C-133AXI is usually 5 days.
3.What payment methods are accepted for CY7C1361C-133AXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1361C-133AXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1361C-133AXI?
CY7C1361C-133AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1361C-133AXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1361C-133AXI?
For technical support, including CY7C1361C-133AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361C-133AXI requirements.
6.How does Aetrix verify that CY7C1361C-133AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1361C-133AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361C-133AXI meets industry standards.
7.What is the process for return or replacement of CY7C1361C-133AXI?
All CY7C1361C-133AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361C-133AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1361C-133AXI part is unused and in its original packaging.
Return procedure for CY7C1361C-133AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1361C-133AXI Tags
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