Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies CY7C1361C-133AXIT

Name: CY7C1361C-133AXIT
Brand: Infineon Technologies
SKU: CY7C1361C-133AXIT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: CY7C1361C-133AXIT

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 100-LQFP

Datasheet:: CY7C1361C-133AXIT.pdf

Description:: IC SRAM 9MBIT PARALLEL 100TQFP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,810

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

CY7C1361C-133AXIT from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM organized as 256K × 36, operating at 133 MHz with 6.5 ns clock-to-output delay, 3.3 V core supply (±5%/+10%), and dual-voltage I/O (2.5 V or 3.3 V), designed for high-speed cache and buffer interfacing in Pentium-class microprocessor systems.

For engineers reviewing the CY7C1361C-133AXIT datasheet, CY7C1361C-133AXIT pinout, CY7C1361C-133AXIT application, or CY7C1361C-133AXIT equivalent, key selection criteria include burst mode support (interleaved/linear), synchronous self-timed write capability, JTAG boundary scan compliance, ZZ sleep mode, and TQFP-100 Pb-free packaging with 3-chip-enable configuration.

Technical Context

The device implements a synchronous, clock-driven architecture where all address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK. It features a 2-bit on-chip burst counter that auto-increments addresses during burst sequences initiated by ADSP or ADSC strobes.

Burst behavior is user-selectable via the MODE pin (HIGH = Intel Pentium interleaved; LOW = linear), and address advancement is controlled by the ADV signal. The memory supports 2-1-1-1 access timing and includes separate processor (ADSP) and controller (ADSC) address strobes for flexible system integration.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	256K × 36 (9-Mbit total), enabling 36-bit wide data paths for high-bandwidth CPU/cache interfaces
Max Clock Frequency	133 MHz - supports real-time burst transfers aligned to high-speed processor buses
Access Time (t_CO)	6.5 ns - defines minimum clock-to-output delay for timing-critical read cycles
Core Supply (V_DD)	3.3 V ±5% / +10% - ensures stable operation across industrial temperature range with margin for rail variation
I/O Supply (V_DDQ)	2.5 V or 3.3 V - allows interoperability with both LVTTL and SSTL-2 I/O standards
Burst Mode Control	MODE pin-selectable interleaved or linear - matches legacy Pentium or modern controller addressing schemes
Sleep Mode	ZZ pin-enabled low-power state - reduces standby current to ≤40 mA (industrial)

Pinout & Package

Package: Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 × 20 × 1.4 mm, 3-chip-enable variant (A version), rated for industrial temperature range (–40°C to +85°C).

Pin/Terminal	Circuit Role	Design Meaning
CLK	Clock input	Positive-edge-triggered master timing reference for all synchronous inputs and internal registers
ADSP / ADSC	Address strobe inputs	Separate processor (ADSP) and controller (ADSC) strobes enable dual-bus arbitration without glue logic
ADV	Address advance control	Controls internal burst address increment timing; active-HIGH initiates next burst address
MODE	Burst sequence selector	HIGH = Intel Pentium interleaved addressing; LOW = linear addressing for simplified controller use
CE1 / CE2 / CE3	Chip enable inputs	Three independent enables support depth expansion and hierarchical memory mapping in multi-SRAM systems
ZZ	Deep power-down control	Active-LOW entry into low-current sleep mode; retains data while reducing I_CC to ≤40 mA
OE	Asynchronous output enable	Enables/disables DQ outputs independently of clock - supports partial bus sharing and timing flexibility
BWA–BWD / BWE	Byte write enables	Four 9-bit byte write controls (BWA–BWD) plus global write (BWE) allow granular 36-bit data updates

Key Features

Feature	Design Value
2-1-1-1 burst access rate	Delivers four consecutive 36-bit words in five clock cycles - optimized for Pentium-compatible burst cycles
Synchronous self-timed write	Internal write cycle completion detection eliminates external wait-state generation logic
JTAG boundary scan (IEEE 1149.1)	Enables in-system testability and interconnect verification without additional test fixtures
Dual-voltage I/O (V_DDQ)	Supports mixed-voltage system integration - 2.5 V I/O for low-noise signaling or 3.3 V for legacy compatibility
Flow-through architecture	Eliminates pipeline latency between successive reads - critical for real-time instruction/data streaming

Applications

Processor Cache Buffer

Network Packet Buffer

Use Scenario: High-speed L2 cache buffer between Pentium-class CPU and main memory in embedded computing platforms.

IC Role / Device Role / Timing Role: Synchronous flow-through SRAM providing zero-wait-state burst reads/writes aligned to 133 MHz processor bus.

Use Value: 6.5 ns t_CO and 2-1-1-1 access rate reduce instruction fetch latency, improving IPC in real-time control applications.

Use Scenario: Temporary storage for variable-length Ethernet frames in Layer 2 switch ASICs requiring deterministic latency.

IC Role / Device Role / Timing Role: Burst-capable SRAM buffering ingress/egress packet headers and payloads with synchronized write enable control.

Use Value: Separate ADSP/ADSC strobes allow concurrent CPU and DMA access, enabling non-blocking packet processing pipelines.

Industrial PLC Memory Expansion

Radar Signal Processing Buffer

Use Scenario: Expandable data memory for programmable logic controllers handling time-critical I/O scanning and motion control loops.

IC Role / Device Role / Timing Role: Industrial-grade SRAM with –40°C to +85°C operation and ZZ sleep mode for energy-constrained edge nodes.

Use Value: 40 mA max CMOS standby current and JTAG testability simplify certification and field maintenance in safety-critical systems.

Use Scenario: Real-time buffering of ADC samples in automotive radar front-ends prior to FFT computation.

IC Role / Device Role / Timing Role: Low-latency, flow-through SRAM capturing high-rate digitized chirp data with precise clock-aligned burst writes.

Use Value: Synchronous self-timed write and 133 MHz operation ensure deterministic sample capture without FIFO overflow under burst load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
AS7C36136A-133BIN	Same 256K × 36 organization and 133 MHz speed, but uses single 3.3 V I/O supply (no V_DDQ flexibility)	Lacks MODE-selectable burst sequencing - fixed linear only; no JTAG support	Select when cost-sensitive designs require identical timing but do not need Pentium interleaving or boundary scan testability
IS61WV25636BLL-133TQLI	133 MHz, 256K × 36, but asynchronous output enable is synchronous; no ZZ sleep mode	Higher standby current (70 mA); no ADSP/ADSC separation - requires external address latching logic	Choose for simpler system architectures where burst control is handled externally and deep-sleep is unnecessary

Compared with AS7C36136A-133BIN and IS61WV25636BLL-133TQLI, the CY7C1361C-133AXIT uniquely combines Pentium-compatible burst modes, JTAG testability, dual-voltage I/O, and dedicated processor/controller strobes - making it optimal for complex, high-reliability embedded computing systems requiring minimal glue logic and full production test coverage.

Availability

CY7C1361C-133AXIT is available at Aetrix Electronics and suitable for processor cache buffers, network packet buffers, and industrial PLC memory expansion requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for CY7C1361C-133AXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT applications.

This device belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for high-performance, low-latency memory interfacing in x86-compatible and real-time embedded systems requiring deterministic timing and robust testability.

FAQ

What is the function of the MODE pin on CY7C1361C-133AXIT?

The MODE pin selects burst address sequencing: HIGH configures interleaved addressing (matching Intel Pentium processors), while LOW enables linear addressing. This setting determines how the internal 2-bit burst counter increments addresses during a burst cycle and must be held stable before burst initiation via ADSP or ADSC.

Does CY7C1361C-133AXIT support JTAG boundary scan in all package variants?

Yes - JTAG (IEEE 1149.1) is supported in all package options, including the 100-pin TQFP (A version), 119-ball BGA, and 165-ball FBGA. Pins TDI, TDO, TCK, and TMS are dedicated and electrically compliant per JTAG specification, enabling board-level interconnect testing without requiring special test modes.

Can CY7C1361C-133AXIT operate with V_DDQ = 2.5 V while V_DD = 3.3 V?

Yes - the device is explicitly rated for simultaneous 3.3 V core supply (V_DD) and 2.5 V I/O supply (V_DDQ). This allows direct interfacing with 2.5 V logic families while maintaining full 133 MHz performance and 6.5 ns t_CO, as verified in the AC switching characteristics table of the official datasheet.

How does the ZZ pin affect power consumption during sleep mode?

When ZZ is driven LOW, the device enters deep power-down mode, reducing core supply current (I_CC) to ≤40 mA (industrial grade) while retaining all stored data. Output drivers are disabled, and internal clocks are gated - but the memory array remains powered and fully data-retentive without requiring refresh or reinitialization upon wake-up.

CY7C1361C-133AXIT Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: 100-LQFP

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Synchronous, SDR

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 6.5 ns

Voltage - Supply:: 3.135V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 100-TQFP (14x20)

CY7C1361C-133AXIT FAQ

1.How can I place an order for CY7C1361C-133AXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1361C-133AXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1361C-133AXIT reliable?

The price and inventory of CY7C1361C-133AXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361C-133AXIT is usually 5 days.

3.What payment methods are accepted for CY7C1361C-133AXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1361C-133AXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1361C-133AXIT?

CY7C1361C-133AXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1361C-133AXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1361C-133AXIT?

For technical support, including CY7C1361C-133AXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361C-133AXIT requirements.

6.How does Aetrix verify that CY7C1361C-133AXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1361C-133AXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361C-133AXIT meets industry standards.

7.What is the process for return or replacement of CY7C1361C-133AXIT?

All CY7C1361C-133AXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361C-133AXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1361C-133AXIT part is unused and in its original packaging.

Return procedure for CY7C1361C-133AXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…