Infineon Technologies CY7C1361KVE33-133AXI
- Part No.:
- CY7C1361KVE33-133AXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1361KVE33-133AXI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,099
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Product details
Overview
CY7C1361KVE33-133AXI from Cypress Semiconductor is a 9-Mbit (256K × 36) synchronous flow-through SRAM designed for high-speed secondary cache in Pentium-class microprocessor systems. It supports 133 MHz bus operations, delivers 6.5 ns clock-to-output delay, operates on 3.3 V core supply (VDD) with selectable 2.5 V/3.3 V I/O (VDDQ), and implements user-selectable linear or interleaved burst sequences via the MODE pin.
For engineers reviewing the CY7C1361KVE33-133AXI datasheet, CY7C1361KVE33-133AXI pinout, CY7C1361KVE33-133AXI application, or CY7C1361KVE33-133AXI equivalent, key selection criteria include synchronous burst timing compliance, dual-voltage I/O flexibility, ZZ sleep mode support, and TQFP-100 package compatibility with legacy Pentium cache controller interfaces.
Technical Context
The device uses a positive-edge-triggered CLK to register all synchronous inputs-including address (A[1:0]), chip enables (CE1/CE2/CE3), burst controls (ADSP/ADSC/ADV), and write enables (BWX/BWE/GW). A 2-bit on-chip wraparound burst counter captures initial address bits and auto-increments for subsequent burst cycles.
Burst order is statically selected by the MODE pin: HIGH (or floating) enables Intel Pentium-style interleaved addressing; LOW selects linear sequence. Asynchronous OE enables output tristating independent of clock, while ZZ provides non-time-critical sleep with data retention and internal pull-down.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 9 Mbit (256K × 36 words), enabling full 36-bit data path for Pentium-compatible cache subsystems |
| Max clock frequency | 133 MHz - defines maximum sustained burst throughput without wait states |
| Access time (tCDV) | 6.5 ns - guaranteed clock-to-output delay under worst-case VDD/VDDQ/temperature conditions |
| VDD supply range | 3.3 V ±5% to +10% - ensures stable core operation across industrial voltage tolerances |
| VDDQ options | 2.5 V or 3.3 V - allows direct interface to either 2.5 V logic or legacy 3.3 V bus drivers |
| Burst control | User-selectable linear/interleaved via MODE pin - matches processor-specific burst protocol requirements |
| Sleep mode | Asynchronous ZZ input with internal pull-down - reduces standby current while preserving data integrity |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), lead-free, RoHS-compliant, with dedicated VDD/VSS and VDDQ/VSSQ power/ground pairs for noise isolation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Positive-edge-triggered master timing reference for all registered inputs and burst counter advancement |
| ADSP / ADSC | Address strobe inputs | ADSP initiates processor-originated accesses; ADSC supports cache controller-initiated bursts; ADSP takes priority when both asserted |
| ADV | Burst address advance | Sampled on CLK rise to increment internal 2-bit counter and generate next burst address |
| MODE | Burst sequence selector | Static strap pin: HIGH/floating = interleaved (Pentium), LOW = linear; must remain stable during operation |
| ZZ | Asynchronous sleep enable | Active-HIGH entry to low-power sleep mode with data retention; internal pull-down ensures safe default LOW state |
| OE | Asynchronous output enable | Controls I/O direction independently of clock; outputs tristated when HIGH, active when LOW |
| DQs / DQPX | Common I/O data lines | 36-bit bidirectional data bus (DQA–DQD) plus 4 parity bits (DQPA–DQPD); direction controlled by OE and write cycle detection |
| BWA–BWD, BWE, GW | Byte write controls | BWX selects individual 9-bit bytes; BWE enables byte writes; GW overrides all BWx to perform full-word write |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous architecture | Eliminates pipeline stalls in burst reads by delivering data on same clock edge as address capture |
| Self-timed synchronous write | On-chip timing circuitry automates write completion-no external write pulse width management required |
| Dual-voltage I/O (VDDQ) | Enables seamless integration with mixed-voltage system buses without level-shifting components |
| Separate ADSP/ADSC strobes | Supports heterogeneous memory controllers-processor and cache controller can independently initiate bursts |
| JEDEC JESD8-5 compatibility | Ensures interoperability with standard 2.5 V/3.3 V logic families and avoids signal integrity issues |
Applications
| Intel Pentium L2 Cache Subsystem | High-Speed Network Packet Buffer |
|---|---|
Use Scenario: Secondary cache for Intel Pentium processors requiring burst-mode access with strict tCDV timing. IC Role / Device Role / Timing Role: Flow-through SRAM providing 36-bit data path and 133 MHz burst reads with 6.5 ns clock-to-output. Use Value: Eliminates glue logic between processor and cache; supports native Pentium interleaved burst protocol via MODE pin configuration. | Use Scenario: Temporary storage for variable-length Ethernet/ATM frames in line-rate switching ASICs. IC Role / Device Role / Timing Role: Synchronous buffer accepting burst writes from ingress pipeline and supporting concurrent burst reads to egress scheduler. Use Value: Dual-voltage I/O (VDDQ) allows direct connection to 2.5 V packet parser logic while maintaining 3.3 V core stability. |
| Industrial Motion Controller FIFO | Legacy PCI Bus Memory Expansion |
Use Scenario: Real-time command queue between FPGA motion sequencer and servo drive interface. IC Role / Device Role / Timing Role: Low-latency, deterministic-access SRAM acting as dual-port FIFO with separate read/write burst control. Use Value: Asynchronous ZZ sleep mode reduces power during idle motion phases without losing queued commands. | Use Scenario: Adding 9-Mbit synchronous memory to legacy PCI add-in cards with 3.3 V signaling. IC Role / Device Role / Timing Role: Plug-in memory module supporting PCI bus timing with CE1/CE2/CE3 bank decoding and ADSP-driven addressing. Use Value: TQFP-100 footprint matches standard PCI card layout constraints; JEDEC JESD8-5 compliance ensures signal integrity at 33 MHz PCI clock. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25636A-133TQLI | 256K × 36, 3.3 V only (no VDDQ flexibility), 6.5 ns tCDV, same TQFP-100 | Lacks dual-voltage I/O and ZZ sleep mode; requires external 3.3 V I/O rail | Select when system uses uniform 3.3 V I/O and sleep mode is unnecessary |
| AS7C325636A-133BIN | 256K × 36, 3.3 V core, 2.5 V/3.3 V VDDQ, 7.0 ns tCDV, same pinout | Slower access time limits use in 133 MHz Pentium cache; suitable for 100 MHz systems | Select when cost sensitivity outweighs marginal timing margin and 133 MHz operation is not required |
Compared with IS61LV25636A-133TQLI and AS7C325636A-133BIN, CY7C1361KVE33-133AXI uniquely combines 133 MHz timing, dual-voltage I/O, and asynchronous sleep-making it the only option for power-constrained, mixed-voltage Pentium cache designs requiring guaranteed 6.5 ns performance.
Availability
CY7C1361KVE33-133AXI is available at Aetrix Electronics and suitable for Intel Pentium L2 cache subsystems, high-speed network packet buffers, and industrial motion controller FIFOs requiring stable component supply across extended product lifecycles.
Supply support for CY7C1361KVE33-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.
The CY7C1361KVE33 belongs to Cypress's synchronous SRAM product line, engineered specifically for low-latency, burst-mode cache and buffer applications in x86-compatible and real-time embedded systems.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin selects burst address sequence: HIGH (or floating) enables interleaved addressing per Intel Pentium specification; LOW selects linear sequence. It is a static strap pin-must be set before operation and held stable during all accesses. Internal pull-up ensures default interleaved behavior if left unconnected.
Can CY7C1361KVE33-133AXI operate with 2.5 V I/O while using 3.3 V core supply?
Yes. VDD is fixed at 3.3 V ±5%/+10%, while VDDQ accepts either 2.5 V or 3.3 V. This allows direct interfacing with 2.5 V logic families (e.g., ASICs or FPGAs) without level shifters, while maintaining core stability at 3.3 V.
How does the ZZ sleep mode affect timing and data retention?
When ZZ is driven HIGH, the device enters non-time-critical sleep: core clocks halt, I/Os go high-impedance, and standby current drops significantly-but all stored data is retained. Exit to active mode requires ZZ LOW followed by one valid clock cycle before new accesses are accepted.
What is the role of ADSP versus ADSC, and when is each used?
ADSP signals processor-initiated bursts (e.g., CPU cache fill); ADSC signals controller-initiated bursts (e.g., DMA or cache controller prefetch). ADSP has priority-if both are active, only ADSP is recognized. Both are sampled synchronously on CLK rise and require CE1–CE3 active to latch addresses.
CY7C1361KVE33-133AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1361KVE33-133AXI FAQ
1.How can I place an order for CY7C1361KVE33-133AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1361KVE33-133AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1361KVE33-133AXI reliable?
The price and inventory of CY7C1361KVE33-133AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361KVE33-133AXI is usually 5 days.
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Once your CY7C1361KVE33-133AXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1361KVE33-133AXI?
For technical support, including CY7C1361KVE33-133AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361KVE33-133AXI requirements.
6.How does Aetrix verify that CY7C1361KVE33-133AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1361KVE33-133AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361KVE33-133AXI meets industry standards.
7.What is the process for return or replacement of CY7C1361KVE33-133AXI?
All CY7C1361KVE33-133AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361KVE33-133AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1361KVE33-133AXI part is unused and in its original packaging.
Return procedure for CY7C1361KVE33-133AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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