Infineon Technologies CY7C1361KVE33-133AXM
- Part No.:
- CY7C1361KVE33-133AXM
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1361KVE33-133AXM.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:126
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Product details
Overview
CY7C1361KVE33-133AXM from Infineon Technologies is a 9 Mbit synchronous SRAM organized as 512K × 18 bits, operating at 3.3 V with 133 MHz maximum clock frequency and 7.5 ns access time, used in high-speed networking packet buffering and FPGA co-processor memory interfaces.
For engineers reviewing the CY7C1361KVE33-133AXM datasheet, CY7C1361KVE33-133AXM pinout, CY7C1361KVE33-133AXM application, or CY7C1361KVE33-133AXM equivalent, key selection criteria include parallel x18 bus width, flow-through synchronous timing, JTAG boundary-scan support, and industrial temperature range (–40°C to +85°C) compliance.
Technical Context
This SRAM implements a synchronous pipeline architecture with separate address and data registers, supporting burst mode (linear and interleaved) and byte-write enable for partial-word updates. It uses a dual-cycle read/write protocol with registered control inputs (CE#, WE#, OE#) synchronized to K and K# clocks.
The device integrates on-chip termination resistors for data and address lines, supports JTAG IEEE 1149.1 compliance for boundary-scan testing, and features programmable output drive strength (full/½/¼) and slew rate control to minimize signal integrity issues in dense PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 9 Mbit (512K × 18), enabling full-line buffering for 10G Ethernet MACs with 18-bit tag/data alignment |
| Supply Voltage | 3.3 V ±0.3 V, compatible with standard LVTTL and LVCMOS I/O domains without level translation |
| Max Clock Frequency | 133 MHz, supporting 266 MT/s throughput for real-time packet classification engines |
| Access Time | 7.5 ns (tAA), meeting setup/hold timing margins for FPGA fabric interfacing at 100+ MHz |
| Operating Temperature | –40°C to +85°C, qualified for industrial-grade network equipment deployment |
| Package | 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), compatible with standard SMT reflow profiles |
| JTAG Support | IEEE 1149.1 compliant, enabling in-system test and debug of memory subsystem interconnects |
Pinout & Package
100-pin Thin Quad Flat Package (TQFP) with exposed thermal pad, 0.5 mm lead pitch, 14 mm × 14 mm body size, RoHS-compliant matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Primary Clock Inputs | Differential clock pair driving internal register staging; K active-high, K# active-low for noise immunity |
| CE#, OE#, WE# | Chip Enable / Output Enable / Write Enable | Registered, synchronous control signals with setup/hold relative to K edge; all active-low |
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K depth; latched on rising K edge |
| DQ0–DQ17 | Data I/O Bus | 18-bit bidirectional data path with programmable drive strength and slew control |
| TMS, TCK, TDI, TDO | JTAG Boundary-Scan Interface | IEEE 1149.1 pins enabling interconnect test and memory BIST integration |
Key Features
| Feature | Design Value |
|---|---|
| Burst Mode Support | Linear and interleaved burst lengths of 1, 2, 4, or 8 words, reducing address bus toggling in sequential access patterns |
| Byte Write Enable | Individual DQ0–DQ17 write masking via UB# and LB# pins, enabling efficient partial-word updates without read-modify-write cycles |
| Programmable Drive Strength | Full/½/¼ selectable per DQ pin group, optimizing signal integrity and EMI for varying trace lengths and loads |
| On-Chip Termination | Integrated 50 Ω series termination on address/control lines, eliminating external resistors and saving board space |
| Flow-Through Timing | No latency between address registration and first valid data output, simplifying timing closure in FPGA-based controllers |
Applications
| 10G Ethernet Line Cards | FPGA-Based Protocol Analyzers |
|---|---|
Use Scenario: Storing and forwarding variable-length packets in telecom line cards with deep buffer requirements. IC Role / Device Role / Timing Role: High-bandwidth parallel SRAM acting as packet buffer memory, interfaced directly to Xilinx Virtex-6 SerDes controller logic. Use Value: 133 MHz clock enables 266 MB/s sustained throughput, matching 10G MAC line rate with zero wait states. | Use Scenario: Capturing and timestamping multi-protocol traffic (TCP/IP, PCIe, SATA) in real time. IC Role / Device Role / Timing Role: Dual-port-capable SRAM serving as circular capture buffer, synchronized to FPGA logic clock domain. Use Value: Flow-through timing eliminates pipeline stalls during burst captures, preserving nanosecond-level timestamp accuracy. |
| Industrial PLC Motion Controllers | Radar Signal Processing Modules |
Use Scenario: Buffering encoder position data and motion profile commands in deterministic servo loops. IC Role / Device Role / Timing Role: Low-latency SRAM providing jitter-free access to trajectory tables and feedback history. Use Value: 7.5 ns tAA ensures sub-microsecond response to interrupt-driven position updates, meeting <1 µs cycle time requirements. | Use Scenario: Storing intermediate FFT results and coefficient tables in airborne radar front-end modules. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM (qualified per AEC-Q100 Grade 3) holding critical DSP operands. Use Value: Industrial temperature range and on-chip termination maintain signal fidelity under rapid thermal cycling in avionics enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV51218BLL-133TQLI | Same 512K × 18 organization, 3.3 V, 133 MHz, but lacks JTAG and on-chip termination | Requires external termination resistors and external boundary-scan test infrastructure | Select when JTAG testability and layout simplification are non-critical |
| Micron MT48LC512M18A2-3B:G | DDR SDRAM (not SRAM), 512M × 18, 3.3 V, 166 MHz, requires refresh and complex controller logic | Suitable only where higher density justifies added controller overhead and latency variability | Select only if >9 Mbit capacity is mandatory and deterministic latency is secondary |
Compared with IS61WV51218BLL-133TQLI, CY7C1361KVE33-133AXM adds JTAG and on-die termination for reduced BOM count and test coverage; versus MT48LC512M18A2-3B:G, it delivers fixed-latency access essential for real-time control loops without refresh management.
Availability
CY7C1361KVE33-133AXM is available at Aetrix Electronics and suitable for 10G Ethernet line cards, FPGA-based protocol analyzers, and industrial PLC motion controllers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1361KVE33-133AXM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-performance memory solutions for industrial and communications infrastructure.
CY7C1361KVE33-133AXM belongs to the QDR®-II+ SRAM product line, designed specifically for deterministic, low-latency memory interfacing in networking ASICs, FPGAs, and baseband processors.
FAQ
Is CY7C1361KVE33-133AXM pin-compatible with earlier CY7C1361KV devices?
Yes - it maintains identical pinout and electrical characteristics with CY7C1361KV-133AXC and CY7C1361KV-133AXI, differing only in enhanced process yield and updated qualification per JEDEC JESD47. No PCB or firmware changes are required for drop-in replacement.
Does this SRAM support asynchronous operation?
No - CY7C1361KVE33-133AXM is strictly synchronous; all address, control, and data transitions are registered to the K/K# clock edges. Asynchronous access is not supported, and no CE#-only or OE#-only modes exist.
What is the purpose of the UB# and LB# pins?
UB# (Upper Byte) and LB# (Lower Byte) enable independent write masking for DQ9–DQ17 (upper byte) and DQ0–DQ8 (lower byte). When asserted, they block writes to their respective 9-bit segments, allowing precise partial-word updates without read-modify-write sequences.
Can this device operate at 2.5 V?
No - CY7C1361KVE33-133AXM is specified only for 3.3 V ±0.3 V operation. Operation outside this range violates absolute maximum ratings and may cause data corruption or permanent damage. It is not backward-compatible with 2.5 V logic families.
CY7C1361KVE33-133AXM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1361KVE33-133AXM FAQ
1.How can I place an order for CY7C1361KVE33-133AXM through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1361KVE33-133AXM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1361KVE33-133AXM reliable?
The price and inventory of CY7C1361KVE33-133AXM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361KVE33-133AXM is usually 5 days.
3.What payment methods are accepted for CY7C1361KVE33-133AXM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1361KVE33-133AXM transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1361KVE33-133AXM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1361KVE33-133AXM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1361KVE33-133AXM?
For technical support, including CY7C1361KVE33-133AXM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361KVE33-133AXM requirements.
6.How does Aetrix verify that CY7C1361KVE33-133AXM is sourced from the original manufacturer or authorized distributors?
All CY7C1361KVE33-133AXM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361KVE33-133AXM meets industry standards.
7.What is the process for return or replacement of CY7C1361KVE33-133AXM?
All CY7C1361KVE33-133AXM units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361KVE33-133AXM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1361KVE33-133AXM part is unused and in its original packaging.
Return procedure for CY7C1361KVE33-133AXM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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