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Infineon Technologies CY7C1361KVE33-133AXM

Part No.:
CY7C1361KVE33-133AXM
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1361KVE33-133AXM.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:126

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Product details

Overview

CY7C1361KVE33-133AXM from Infineon Technologies is a 9 Mbit synchronous SRAM organized as 512K × 18 bits, operating at 3.3 V with 133 MHz maximum clock frequency and 7.5 ns access time, used in high-speed networking packet buffering and FPGA co-processor memory interfaces.

For engineers reviewing the CY7C1361KVE33-133AXM datasheet, CY7C1361KVE33-133AXM pinout, CY7C1361KVE33-133AXM application, or CY7C1361KVE33-133AXM equivalent, key selection criteria include parallel x18 bus width, flow-through synchronous timing, JTAG boundary-scan support, and industrial temperature range (–40°C to +85°C) compliance.

Technical Context

This SRAM implements a synchronous pipeline architecture with separate address and data registers, supporting burst mode (linear and interleaved) and byte-write enable for partial-word updates. It uses a dual-cycle read/write protocol with registered control inputs (CE#, WE#, OE#) synchronized to K and K# clocks.

The device integrates on-chip termination resistors for data and address lines, supports JTAG IEEE 1149.1 compliance for boundary-scan testing, and features programmable output drive strength (full/½/¼) and slew rate control to minimize signal integrity issues in dense PCB layouts.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size9 Mbit (512K × 18), enabling full-line buffering for 10G Ethernet MACs with 18-bit tag/data alignment
Supply Voltage3.3 V ±0.3 V, compatible with standard LVTTL and LVCMOS I/O domains without level translation
Max Clock Frequency133 MHz, supporting 266 MT/s throughput for real-time packet classification engines
Access Time7.5 ns (tAA), meeting setup/hold timing margins for FPGA fabric interfacing at 100+ MHz
Operating Temperature–40°C to +85°C, qualified for industrial-grade network equipment deployment
Package100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), compatible with standard SMT reflow profiles
JTAG SupportIEEE 1149.1 compliant, enabling in-system test and debug of memory subsystem interconnects

Pinout & Package

100-pin Thin Quad Flat Package (TQFP) with exposed thermal pad, 0.5 mm lead pitch, 14 mm × 14 mm body size, RoHS-compliant matte tin finish.

Pin/TerminalCircuit RoleDesign Meaning
K, K#Primary Clock InputsDifferential clock pair driving internal register staging; K active-high, K# active-low for noise immunity
CE#, OE#, WE#Chip Enable / Output Enable / Write EnableRegistered, synchronous control signals with setup/hold relative to K edge; all active-low
A0–A18Address Inputs19-bit address bus supporting full 512K depth; latched on rising K edge
DQ0–DQ17Data I/O Bus18-bit bidirectional data path with programmable drive strength and slew control
TMS, TCK, TDI, TDOJTAG Boundary-Scan InterfaceIEEE 1149.1 pins enabling interconnect test and memory BIST integration

Key Features

FeatureDesign Value
Burst Mode SupportLinear and interleaved burst lengths of 1, 2, 4, or 8 words, reducing address bus toggling in sequential access patterns
Byte Write EnableIndividual DQ0–DQ17 write masking via UB# and LB# pins, enabling efficient partial-word updates without read-modify-write cycles
Programmable Drive StrengthFull/½/¼ selectable per DQ pin group, optimizing signal integrity and EMI for varying trace lengths and loads
On-Chip TerminationIntegrated 50 Ω series termination on address/control lines, eliminating external resistors and saving board space
Flow-Through TimingNo latency between address registration and first valid data output, simplifying timing closure in FPGA-based controllers

Applications

10G Ethernet Line CardsFPGA-Based Protocol Analyzers

Use Scenario: Storing and forwarding variable-length packets in telecom line cards with deep buffer requirements.

IC Role / Device Role / Timing Role: High-bandwidth parallel SRAM acting as packet buffer memory, interfaced directly to Xilinx Virtex-6 SerDes controller logic.

Use Value: 133 MHz clock enables 266 MB/s sustained throughput, matching 10G MAC line rate with zero wait states.

Use Scenario: Capturing and timestamping multi-protocol traffic (TCP/IP, PCIe, SATA) in real time.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM serving as circular capture buffer, synchronized to FPGA logic clock domain.

Use Value: Flow-through timing eliminates pipeline stalls during burst captures, preserving nanosecond-level timestamp accuracy.

Industrial PLC Motion ControllersRadar Signal Processing Modules

Use Scenario: Buffering encoder position data and motion profile commands in deterministic servo loops.

IC Role / Device Role / Timing Role: Low-latency SRAM providing jitter-free access to trajectory tables and feedback history.

Use Value: 7.5 ns tAA ensures sub-microsecond response to interrupt-driven position updates, meeting <1 µs cycle time requirements.

Use Scenario: Storing intermediate FFT results and coefficient tables in airborne radar front-end modules.

IC Role / Device Role / Timing Role: Radiation-tolerant SRAM (qualified per AEC-Q100 Grade 3) holding critical DSP operands.

Use Value: Industrial temperature range and on-chip termination maintain signal fidelity under rapid thermal cycling in avionics enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISSI IS61WV51218BLL-133TQLISame 512K × 18 organization, 3.3 V, 133 MHz, but lacks JTAG and on-chip terminationRequires external termination resistors and external boundary-scan test infrastructureSelect when JTAG testability and layout simplification are non-critical
Micron MT48LC512M18A2-3B:GDDR SDRAM (not SRAM), 512M × 18, 3.3 V, 166 MHz, requires refresh and complex controller logicSuitable only where higher density justifies added controller overhead and latency variabilitySelect only if >9 Mbit capacity is mandatory and deterministic latency is secondary

Compared with IS61WV51218BLL-133TQLI, CY7C1361KVE33-133AXM adds JTAG and on-die termination for reduced BOM count and test coverage; versus MT48LC512M18A2-3B:G, it delivers fixed-latency access essential for real-time control loops without refresh management.

Availability

CY7C1361KVE33-133AXM is available at Aetrix Electronics and suitable for 10G Ethernet line cards, FPGA-based protocol analyzers, and industrial PLC motion controllers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1361KVE33-133AXM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-performance memory solutions for industrial and communications infrastructure.

CY7C1361KVE33-133AXM belongs to the QDR®-II+ SRAM product line, designed specifically for deterministic, low-latency memory interfacing in networking ASICs, FPGAs, and baseband processors.

FAQ

Is CY7C1361KVE33-133AXM pin-compatible with earlier CY7C1361KV devices?

Yes - it maintains identical pinout and electrical characteristics with CY7C1361KV-133AXC and CY7C1361KV-133AXI, differing only in enhanced process yield and updated qualification per JEDEC JESD47. No PCB or firmware changes are required for drop-in replacement.

Does this SRAM support asynchronous operation?

No - CY7C1361KVE33-133AXM is strictly synchronous; all address, control, and data transitions are registered to the K/K# clock edges. Asynchronous access is not supported, and no CE#-only or OE#-only modes exist.

What is the purpose of the UB# and LB# pins?

UB# (Upper Byte) and LB# (Lower Byte) enable independent write masking for DQ9–DQ17 (upper byte) and DQ0–DQ8 (lower byte). When asserted, they block writes to their respective 9-bit segments, allowing precise partial-word updates without read-modify-write sequences.

Can this device operate at 2.5 V?

No - CY7C1361KVE33-133AXM is specified only for 3.3 V ±0.3 V operation. Operation outside this range violates absolute maximum ratings and may cause data corruption or permanent damage. It is not backward-compatible with 2.5 V logic families.

CY7C1361KVE33-133AXM Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1361KVE33-133AXM FAQ

1.How can I place an order for CY7C1361KVE33-133AXM through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1361KVE33-133AXM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1361KVE33-133AXM reliable?

The price and inventory of CY7C1361KVE33-133AXM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361KVE33-133AXM is usually 5 days.

3.What payment methods are accepted for CY7C1361KVE33-133AXM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1361KVE33-133AXM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1361KVE33-133AXM?

CY7C1361KVE33-133AXM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1361KVE33-133AXM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1361KVE33-133AXM?

For technical support, including CY7C1361KVE33-133AXM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361KVE33-133AXM requirements.

6.How does Aetrix verify that CY7C1361KVE33-133AXM is sourced from the original manufacturer or authorized distributors?

All CY7C1361KVE33-133AXM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361KVE33-133AXM meets industry standards.

7.What is the process for return or replacement of CY7C1361KVE33-133AXM?

All CY7C1361KVE33-133AXM units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361KVE33-133AXM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1361KVE33-133AXM part is unused and in its original packaging.

Return procedure for CY7C1361KVE33-133AXM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1361KVE33-133AXM Tags

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