Infineon Technologies CY7C1362A-166AC

Overview

CY7C1362A-166AC from Cypress Semiconductor is a 512K × 18 synchronous pipelined burst SRAM with 166 MHz clock speed, 3.5 ns maximum access time, and 3.3 V core supply. It implements address pipelining via ADSP/ADSC, supports interleaved or linear burst sequences via MODE pin, and features byte write enables (BWa/BWb) for selective 18-bit writes - deployed in high-speed network packet buffering and real-time DSP data caches.

For engineers reviewing the CY7C1362A-166AC datasheet, CY7C1362A-166AC pinout, CY7C1362A-166AC application, or CY7C1362A-166AC equivalent, key selection criteria include burst mode control (MODE), depth expansion support via CE/CE2, JTAG testability (BG/AJ packages), and I/O voltage flexibility (2.5 V or 3.3 V VCCQ).

Technical Context

This SRAM uses synchronous, positive-edge-triggered clocking to register addresses (A0–A1), data inputs (DQa/DQb), chip enables (CE, CE2), and burst controls (ADSC, ADSP, ADV). Internal two-bit counter generates sequential burst addresses, while MODE selects interleaved or linear addressing - critical for cache line alignment in RISC processors.

Write operations are self-timed and support per-byte granularity: BWa controls DQa (bits 0–8), BWb controls DQb (bits 9–17); BWE must be LOW for byte writes, and GW enables full 18-bit writes. Asynchronous OE enables outputs, and ZZ provides low-power standby independent of clock state.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (AJ version), 14 mm × 22 mm footprint with exposed thermal pad; RoHS-compliant, lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with CY7C1362A-200AC, the -166AC trades 34 MHz clock headroom for lower power and relaxed timing margins; versus IS61LV51218AL-166TQLI, it adds burst control, pipelining, and JTAG - enabling higher-performance embedded systems with deterministic latency.

Availability

CY7C1362A-166AC is available at Aetrix Electronics and suitable for network packet buffering, DSP data caching, FPGA co-processor memory, and industrial motion controller buffer applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1362A-166AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing reliability, low power, and interface flexibility.

The CY7C136x series targets high-speed data-path applications demanding deterministic latency and burst efficiency - specifically engineered for networking, DSP, and FPGA-adjacent memory subsystems.

FAQ

What is the function of the MODE pin on CY7C1362A-166AC?

The MODE pin selects burst address sequence: LOW configures interleaved mode (0,2,4,6), matching PowerPC and older ARM cache line fetches; HIGH or NC selects linear mode (0,1,2,3), aligning with modern x86 and RISC-V implementations. This setting is sampled at power-up and remains static during operation.

Can CY7C1362A-166AC operate with 2.5 V I/O while using 3.3 V core supply?

Yes - VCCQ (pins 14, 16, 66 on TQFP) accepts 2.5 V or 3.3 V independently of VCC (3.3 V ±5%/+10%). This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters, while maintaining full 166 MHz performance and 3.5 ns access time.

Does CY7C1362A-166AC support JTAG boundary scan?

JTAG is supported only on BG (BGA) and AJ (TQFP) package versions, using TMS, TDI, TCK, and TDO pins. The A-version TQFP lacks JTAG. Pins are LVTTL/LVCMOS compatible and active only when ZZ = LOW and CE = LOW - enabling production test without functional mode interference.

How does CE2 differ from CE in depth expansion configurations?

CE is active LOW and gates ADSP; CE2 is active HIGH and enables the device independently. In depth-expanded stacks, CE selects one chip while CE2 enables others - allowing staggered activation to avoid bus contention. CE3 exists only on A-package versions and is not present in the -166AC (AJ version) configuration.