Infineon Technologies CY7C1362B-166AJC
- Part No.:
- CY7C1362B-166AJC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1362B-166AJC.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,298
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Product details
Overview
CY7C1362B-166AJC from Cypress Semiconductor is a 9-Mbit synchronous pipelined SRAM organized as 512K × 18 bits, operating at 166 MHz with 3.3V core and 2.5V/3.3V I/O supplies. It features registered inputs/outputs, synchronous self-timed writes, asynchronous output enable, and single-cycle chip deselect - deployed in high-speed networking line cards and embedded processor cache buffers.
For engineers reviewing the CY7C1362B-166AJC datasheet, CY7C1362B-166AJC pinout, CY7C1362B-166AJC application, or CY7C1362B-166AJC equivalent, key selection criteria include burst mode configuration (interleaved vs. linear), byte-write control granularity (BWA–BWD + BWE), clock-to-output timing (3.5 ns), and JEDEC-standard 100-pin TQFP package compatibility with 2-chip-enable architecture.
Technical Context
The CY7C1362B implements a two-bit internal burst counter synchronized to CLK's rising edge, supporting Intel Pentium®-compatible interleaved or linear burst sequences via the MODE strap pin. Address strobes ADSP (processor) and ADSC (controller) are sampled synchronously, enabling dual-bus system integration.
All data, address, and control inputs (CE1, CE2, GW, BWE, BWx, ADV) are registered on the rising edge of CLK; only OE and ZZ operate asynchronously. Byte write width (1–4 bytes) is controlled by BWA–BWD and BWE, while GW enables full-word writes independent of byte-select states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (512K × 18) - supports 18-bit wide data paths in RISC/DSP memory subsystems. |
| Max Clock Frequency | 166 MHz - enables 166 million synchronous operations per second for burst-mode memory access. |
| Access Time | 3.5 ns - defines minimum clock-to-valid-output delay for read cycles at rated speed. |
| Core Supply Voltage | 3.3 V ± 0.3 V - powers internal logic and memory array; requires stable low-noise regulation. |
| I/O Supply Voltage | 2.5 V or 3.3 V - configurable interface voltage matching host processor I/O domain. |
| Burst Mode Control | MODE pin (strap) - selects interleaved (VDD/floating) or linear (GND) addressing sequence for cache-line fills. |
| Byte Write Capability | Four independent byte lanes (BWA–BWD) + BWE - allows partial-word writes without read-modify-write overhead. |
Pinout & Package
Package: 100-pin TQFP (AJ version, 2-chip-enable variant), RoHS-compliant, body size 14 mm × 14 mm, 0.5 mm pitch.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | 18-bit address bus sampled on CLK rising edge when ADSP or ADSC active; A1/A0 load burst counter. |
| CE1, CE2 | Synchronous Chip Enable | CE1 active LOW, CE2 active HIGH - dual-enable decoding for multi-SRAM bank selection. |
| ADSP / ADSC | Address Strobe (Processor / Controller) | Edge-triggered address capture; ADSP takes priority if both asserted - supports split-bus architectures. |
| BWA–BWD, BWE | Byte Write Control | Four byte-lane enables + global enable - configures 1–4 byte write width without external logic. |
| GW | Global Write Enable | Active LOW on CLK edge forces write to all 18 bits regardless of BWx states - simplifies full-word updates. |
| OE | Asynchronous Output Enable | Active LOW enables DQ outputs; HIGH places pins in high-impedance - supports shared bus contention management. |
| ZZ | Asynchronous Sleep Input | Active HIGH reduces dynamic current to ≤30 mA standby; data retained; internal pull-down ensures safe default. |
| DQA–DQD, DQPA–DQPD | Synchronous Bidirectional Data I/O | 18-bit data bus (DQA/DQPA = bit 0–8, DQB/DQPB = bit 9–17); direction controlled by OE, registered on CLK rise. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Synchronous Interface | Registered address/data/control inputs eliminate external latch timing constraints and reduce setup/hold violations. |
| Configurable Burst Sequence | MODE pin selects Intel Pentium®-compatible interleaved or linear burst - matches legacy CPU cache-fill behavior. |
| Flexible I/O Voltage | Separate VDDQ (2.5 V or 3.3 V) decoupling allows direct interfacing with mixed-voltage SoCs without level shifters. |
| Self-Timed Writes | Internal write cycle completion detection eliminates need for external write-strobe timing control or wait-state generation. |
| JTAG Boundary Scan | IEEE 1149.1 support (TCK/TDI/TDO/TMS) enables in-system testability and interconnect verification on dense PCBs. |
Applications
| Networking Line Cards | Industrial PLC Memory Buffers |
|---|---|
|
Use Scenario: High-throughput packet buffering in 10G Ethernet switch fabric ASIC interfaces. IC Role / Device Role / Timing Role: Pipelined SRAM acting as first-level packet descriptor store with deterministic 3.5 ns read latency. Use Value: Enables 166 MHz burst reads aligned to ASIC clock domain, eliminating glue logic and reducing PCB trace count. |
Use Scenario: Real-time I/O mapping buffer between ARM-based controller and fieldbus interface modules. IC Role / Device Role / Timing Role: Synchronous memory buffer providing atomic 18-bit register updates under deterministic interrupt latency. Use Value: Byte-write capability (BWA–BWD) allows selective update of individual I/O status registers without corrupting adjacent fields. |
| Medical Imaging Frame Stores | Avionics Display Controllers |
|
Use Scenario: Intermediate frame storage in digital X-ray detector processing pipelines. IC Role / Device Role / Timing Role: Low-jitter, pipeline-aligned memory staging buffer between ADC sampling engine and FPGA image processor. Use Value: Registered inputs suppress clock-domain crossing metastability; ZZ sleep mode cuts power during idle scan intervals. |
Use Scenario: Graphics command queue in DO-254-certifiable cockpit display systems. IC Role / Device Role / Timing Role: Deterministic-access SRAM storing GPU command lists with guaranteed 3.5 ns max read latency. Use Value: JTAG boundary scan supports structural test coverage required for airborne hardware certification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362B-200AJC | 200 MHz max frequency; 3.0 ns clock-to-output; 220 mA operating current. | Higher bandwidth required for >166 MHz bus clocks; tighter timing margins. | Select when system clock exceeds 166 MHz and board layout supports faster signal integrity. |
| IS61LV51218-10TL | 10 ns async access; no pipelining, burst, or JTAG; 3.3 V only I/O; 100-pin TQFP. | Legacy designs lacking burst control or synchronous timing requirements. | Choose only for cost-sensitive, non-pipelined applications where deterministic latency is not required. |
Compared with CY7C1362B-166AJC, the -200AJC delivers 20% higher throughput but demands stricter PCB routing and power delivery; IS61LV51218-10TL offers lower cost and simpler timing but lacks burst modes, byte-write flexibility, and JTAG testability essential for high-reliability systems.
Availability
CY7C1362B-166AJC is available at Aetrix Electronics and suitable for networking line cards, industrial PLC memory buffers, medical imaging frame stores, and avionics display controllers requiring stable component supply across extended production lifecycles.
Supply support for CY7C1362B-166AJC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial and communications markets.
The CY7C136x family was designed specifically for high-bandwidth, low-latency synchronous memory subsystems in embedded processors and network ASICs - emphasizing pipelined operation, flexible burst control, and robust signal integrity.
FAQ
What is the function of the MODE pin on CY7C1362B-166AJC?
The MODE pin is a static configuration input that selects burst addressing order: tied to GND for linear burst (sequential increment), or to VDD/floating for interleaved burst (Intel Pentium®-compatible pattern). It must remain stable during operation and has an internal pull-up resistor - no external bias required for interleaved mode.
Can CY7C1362B-166AJC operate with 2.5 V I/O while using 3.3 V core supply?
Yes. The device supports independent VDDQ (I/O supply) at either 2.5 V or 3.3 V while VDD (core) remains at 3.3 V. This allows direct interfacing with 2.5 V logic families without level shifters. VDDQ pins require dedicated decoupling, and I/O timing parameters (e.g., tAA, tOH) are specified separately for each VDDQ condition.
How does the ZZ (Sleep) pin affect power consumption and data retention?
When ZZ is driven HIGH, the device enters low-power sleep mode with typical standby current ≤30 mA - independent of clock activity. All stored data is retained, and the part resumes normal operation within one clock cycle after ZZ returns LOW. The pin has an internal pull-down, so floating defaults to active operation.
Is JTAG boundary scan supported on the CY7C1362B-166AJC in TQFP package?
No. JTAG signals (TDO, TDI, TCK, TMS) are only available on BGA and fBGA packages (119-ball and 165-ball variants). The 100-pin TQFP package (including AJ version) does not route JTAG pins - this is confirmed by pinout tables and package-specific documentation in Rev. *C datasheet.
CY7C1362B-166AJC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1362B-166AJC FAQ
1.How can I place an order for CY7C1362B-166AJC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1362B-166AJC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1362B-166AJC reliable?
The price and inventory of CY7C1362B-166AJC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1362B-166AJC is usually 5 days.
3.What payment methods are accepted for CY7C1362B-166AJC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1362B-166AJC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1362B-166AJC?
CY7C1362B-166AJC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1362B-166AJC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1362B-166AJC?
For technical support, including CY7C1362B-166AJC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1362B-166AJC requirements.
6.How does Aetrix verify that CY7C1362B-166AJC is sourced from the original manufacturer or authorized distributors?
All CY7C1362B-166AJC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1362B-166AJC meets industry standards.
7.What is the process for return or replacement of CY7C1362B-166AJC?
All CY7C1362B-166AJC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1362B-166AJC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1362B-166AJC part is unused and in its original packaging.
Return procedure for CY7C1362B-166AJC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1362B-166AJC Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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