Infineon Technologies CY7C1362B-166BGC

Overview

CY7C1362B-166BGC from Cypress Semiconductor is a 9-Mbit synchronous pipelined SRAM organized as 512K × 18 bits, operating at 166 MHz with 3.3V core and 2.5V/3.3V I/O supply, registered inputs/outputs for burst-mode timing control, and JEDEC-standard 119-ball BGA packaging. It serves as high-speed buffer memory in network packet processors requiring deterministic 3-1-1-1 access rate and Intel Pentium-compatible burst sequences.

For engineers reviewing the CY7C1362B-166BGC datasheet, CY7C1362B-166BGC pinout, CY7C1362B-166BGC application, or CY7C1362B-166BGC equivalent, key selection criteria include clock-to-output time (3.5 ns), byte-write control via BWx/BWE/GW, synchronous self-timed write support, dual chip-enable architecture (CE1/CE2), and JTAG boundary-scan capability for system-level testability.

Technical Context

The CY7C1362B implements a two-bit internal burst counter synchronized to CLK's rising edge, supporting both interleaved and linear burst orders selected by the MODE strap pin. Address strobes ADSP and ADSC register A[1:0] and full address bus on clock edge, while ADV enables automatic address increment during burst reads/writes.

All synchronous inputs-including CE1, CE2, BWA–BWD, BWE, GW, ADSP, ADSC, ADV, and CLK-are registered on-chip; only OE and ZZ operate asynchronously. Output enable (OE) is masked during first-clock read recovery from chip deselect, and ZZ sleep mode preserves data integrity with non-time-critical power reduction.

Key Specifications

Pinout & Package

Package: 119-ball BGA (JEDEC MO-207AC), 1.0 mm ball pitch, 12 mm × 12 mm body size, 2-chip-enable configuration (CE1 active LOW, CE2 active HIGH), no CE3 connection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with IS61WV102418BLL-166BLI, CY7C1362B-166BGC adds JTAG testability and configurable burst modes at the cost of slightly higher pin count; versus CY7C1372B-166BGC, it omits CE3 but maintains identical performance and footprint-making it optimal for fixed-depth, test-critical applications.

Availability

CY7C1362B-166BGC is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, baseband processor cache, and industrial motion controller buffer applications requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1362B-166BGC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing signal integrity, low-power operation, and industrial reliability.

The CY7C136xB family targets high-bandwidth synchronous memory applications in networking, test instrumentation, and real-time control systems where deterministic timing and burst efficiency are critical.

FAQ

What is the function of the MODE pin on CY7C1362B-166BGC?

The MODE pin selects burst sequence type: tied to GND for linear burst (0,1,2,3…), or to VDD/floating for Intel Pentium®-compatible interleaved burst (0,2,4,6…1,3,5,7). It is a static strap pin with internal pull-up; changing its state during operation causes undefined behavior and must be avoided.

Does CY7C1362B-166BGC support asynchronous read operations?

No-CY7C1362B-166BGC is a fully synchronous SRAM. All address, data, and control inputs except OE and ZZ are registered on the rising edge of CLK. Even read data output is clock-aligned with 3.5 ns CLK-to-Q delay; true asynchronous access is not supported.

Can CE2 be left unconnected in a 2-chip-enable design?

No-CE2 must be held HIGH for normal operation. The device requires both CE1 LOW and CE2 HIGH to enable; leaving CE2 floating risks metastability or unintended disable. A pull-up resistor to VDD is recommended if not driven actively by system logic.

How does the ZZ sleep mode affect timing parameters?

In ZZ mode (pin HIGH), the device enters low-power sleep with data retention but disables internal clocks and registers. All timing parameters become invalid; recovery requires minimum 20 ns stabilization after ZZ returns LOW before first valid access. No clock cycles are required during wake-up delay.