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Infineon Technologies CY7C1362C-166AJXCT

Part No.:
CY7C1362C-166AJXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1362C-166AJXCT.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,024

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Product details

Overview

CY7C1362C-166AJXCT from Cypress Semiconductor is a 9-Mbit synchronous pipelined SRAM configured as 512K × 18, operating at 166 MHz with 3.3 V core (VDD) and 2.5/3.3 V I/O (VDDQ) support, registered inputs/outputs for burst timing control, and IEEE 1149.1 JTAG boundary scan - deployed in high-speed network packet buffers and telecom line-card memory subsystems.

For engineers reviewing the CY7C1362C-166AJXCT datasheet, CY7C1362C-166AJXCT pinout, CY7C1362C-166AJXCT application, or CY7C1362C-166AJXCT equivalent, key selection criteria include burst sequence mode (interleaved vs. linear), chip enable architecture (2-CE vs. 3-CE TQFP variants), ZZ sleep mode behavior, and byte-write granularity (BWA–BWD + BWE).

Technical Context

The CY7C1362C implements a two-bit internal burst counter synchronized to CLK, with address latching triggered by either ADSP (processor strobe) or ADSC (controller strobe), and automatic address increment on ADV assertion. All synchronous inputs - including A[1:0], CE1/CE2, BWA–BWD, BWE, GW, OE, ADSP/ADSC, ADV - are registered on the rising edge of CLK.

It supports synchronous self-timed writes with programmable byte-width (1–4 bytes), asynchronous OE-controlled output tri-state, and single-cycle chip deselect. The device enters low-power ZZ sleep mode when ZZ is HIGH, preserving data integrity without clock dependency.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (512K × 18 configuration)
Max Clock Frequency 166 MHz - defines maximum sustained burst throughput and pipeline depth
Access Time (tAC) 3.5 ns - determines minimum clock-to-output delay for first word in burst read
Core Supply (VDD) 3.3 V ± 0.3 V - powers internal logic and memory array; not tolerant of 2.5 V operation
I/O Supply (VDDQ) 2.5 V or 3.3 V - selectable interface voltage matching host bus signaling standard
Standby Current (ISB) 40 mA - measured in CMOS standby (CE1 HIGH, ZZ LOW); independent of clock frequency
Burst Support Intel Pentium®-compatible interleaved or linear sequences - controlled via MODE pin and ADV/ADSP/ADSC timing

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, 2-chip-enable variant (AJ version). Pin pitch: 0.5 mm. Thermal resistance (θJA): 42 °C/W.

Pin/Terminal Circuit Role Design Meaning
CLK Clock input Positive-edge-triggered master timing reference for all synchronous registers and burst counter
ADSP / ADSC Address strobe inputs Asynchronous-selective address capture: ADSP prioritized over ADSC; both qualify CE1 sampling
ADV Burst advance control Active-LOW signal that increments internal 2-bit counter to generate next burst address
BWA–BWD, BWE Byte write controls Four independent byte enables + global enable; define 1–4 byte write width per cycle
OE Asynchronous output enable Tri-states DQ/DQP pins immediately on deassertion; masked only during first read clock after deselect
ZZ Asynchronous sleep input Active-HIGH entry into non-time-critical low-power state; data retention guaranteed; internal pull-down
CE1, CE2 Chip enable pair CE1 active-LOW, CE2 active-HIGH - dual-signal gating for depth expansion and bank selection
DQA–DQD, DQPA–DQPD Data I/O banks 18-bit data bus (16 data + 2 parity); each DQx/DQP x pair corresponds to one byte lane

Key Features

Feature Design Value
Pipelined burst access 3-1-1-1 access rate enables sustained 166 MHz throughput with deterministic latency per word
User-selectable burst mode MODE pin configures Intel Pentium® interleaved or linear addressing - matches host CPU cache line protocol
Synchronous self-timed writes On-chip write timing control eliminates external wait-state generation; reduces system-level timing margin burden
JTAG boundary scan (IEEE 1149.1) Full scan chain for interconnect test and in-system debug; supported in BGA and FBGA packages
Flexible I/O voltage VDDQ independently configurable at 2.5 V or 3.3 V - allows seamless interfacing with mixed-voltage SoC buses

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in carrier-grade switching hardware.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer between ingress/egress MACs and traffic manager ASICs.

Use Value: 166 MHz burst reads/writes sustain >2.6 Gbps aggregate bandwidth across 18-bit bus, meeting OC-48/STM-16 line-rate buffering needs.

Use Scenario: Temporary storage of fragmented IP packets prior to reassembly or QoS classification in enterprise routers.

IC Role / Device Role / Timing Role: Synchronous pipeline memory staging buffer with deterministic 3.5 ns tAC for time-critical header parsing pipelines.

Use Value: Registered inputs eliminate setup/hold violations at 166 MHz; ZZ sleep mode reduces idle power by >70% versus continuous clocking.

Industrial PLC Backplanes Test Equipment Memory Subsystems

Use Scenario: Real-time I/O mapping and cyclic process data exchange between controller and distributed I/O modules.

IC Role / Device Role / Timing Role: Deterministic-access shared memory for multi-master backplane arbitration using ADSP/ADSC dual-strobe protocol.

Use Value: Separate processor (ADSP) and controller (ADSC) address strobes enable concurrent CPU and FPGA access without bus contention.

Use Scenario: High-speed waveform capture and pattern generation in automated test equipment (ATE) channel memory.

IC Role / Device Role / Timing Role: Burst-mode memory for digitizer FIFOs requiring precise clock-aligned read/write alignment and JTAG-verifiable interconnect.

Use Value: IEEE 1149.1 boundary scan validates PCB trace integrity pre-deployment; 2.5 V VDDQ compatibility matches LVDS-based ATE signal chains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102418BLL-10BLI 1024K × 18, 10 ns access, 100 MHz max, 3.3 V only (no VDDQ flexibility) Lacks burst counter, ADSP/ADSC dual-strobe, and ZZ sleep mode Choose for cost-sensitive, non-burst, fixed-clock designs where 10 ns tAC suffices and JTAG is unnecessary
MT55LSD256K18P-166:G 512K × 18, 166 MHz, but uses DDR interface and requires differential clocks Requires source-synchronous DDR timing control; no ADSP/ADSC or MODE pin for burst type selection Choose only when migrating to DDR-capable controllers and accepting increased layout complexity for higher density

Compared with IS61WV102418BLL-10BLI and MT55LSD256K18P-166:G, the CY7C1362C-166AJXCT uniquely delivers Intel-compatible burst sequencing, dual-strobe address capture, and VDDQ voltage selectability - critical for legacy bus interoperability and power-aware embedded systems.

Availability

CY7C1362C-166AJXCT is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, industrial PLC backplanes, and test equipment memory subsystems requiring stable component supply, long-lifecycle assurance, and Pb-free compliance.

Supply support for CY7C1362C-166AJXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C136x series was designed specifically for high-throughput, low-latency synchronous memory applications in networking and real-time control systems - emphasizing burst predictability, multi-master bus compatibility, and robust signal integrity at 166 MHz.

FAQ

What is the function of the MODE pin on CY7C1362C-166AJXCT?

The MODE pin selects burst address sequence behavior: logic HIGH configures Intel Pentium®-compatible interleaved addressing (e.g., 0, 2, 4, 6), while logic LOW enables linear addressing (e.g., 0, 1, 2, 3). This setting is sampled at power-up and remains static during operation; it directly maps to the internal burst counter's increment logic and must match the host processor's cache-line expectation.

Can CY7C1362C-166AJXCT operate with VDDQ = 2.5 V while VDD = 3.3 V?

Yes - the device explicitly supports mixed-supply operation: VDD must be 3.3 V ± 0.3 V for core logic and memory array, while VDDQ may be independently set to either 2.5 V or 3.3 V to match the I/O voltage of the connected controller or FPGA. This is confirmed in the DC Electrical Characteristics table (page 22) and pin definition (page 8) of datasheet 38-05540 Rev. *U.

How does ZZ sleep mode affect timing and data retention?

When ZZ is driven HIGH, the device enters a non-time-critical sleep state: clock (CLK) may stop, all outputs go high-impedance, and core current drops to ≤40 mA. Data is retained indefinitely as long as VDD remains within specification (3.0–3.6 V); no minimum CLK frequency or refresh cycles are required. Recovery to active operation takes ≤20 ns after ZZ returns LOW and CE1 becomes active.

Is JTAG boundary scan supported on the CY7C1362C-166AJXCT TQFP package?

No - JTAG (IEEE 1149.1) is only implemented in the 119-ball BGA and 165-ball FBGA packages, as confirmed in Figure 3 (BGA pinout, TDO/TCK/TDI/TMS shown) and Figure 4 (FBGA pinout), and explicitly noted in the "Selection Guide" footnote on page 2. The 100-pin TQFP (AJ version) lacks dedicated JTAG pins and does not support boundary scan.

CY7C1362C-166AJXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1362C-166AJXCT FAQ

1.How can I place an order for CY7C1362C-166AJXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1362C-166AJXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1362C-166AJXCT reliable?

The price and inventory of CY7C1362C-166AJXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1362C-166AJXCT is usually 5 days.

3.What payment methods are accepted for CY7C1362C-166AJXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1362C-166AJXCT transactions.

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CY7C1362C-166AJXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1362C-166AJXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1362C-166AJXCT?

For technical support, including CY7C1362C-166AJXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1362C-166AJXCT requirements.

6.How does Aetrix verify that CY7C1362C-166AJXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1362C-166AJXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1362C-166AJXCT meets industry standards.

7.What is the process for return or replacement of CY7C1362C-166AJXCT?

All CY7C1362C-166AJXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1362C-166AJXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1362C-166AJXCT part is unused and in its original packaging.

Return procedure for CY7C1362C-166AJXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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