Infineon Technologies CY7C1362C-200AXCT

Overview

CY7C1362C-200AXCT from Cypress Semiconductor is a 9-Mbit synchronous pipelined SRAM organized as 512 K × 18, operating at 200 MHz with 3.0 ns clock-to-output delay, 3.3 V core supply (VDD), and 2.5 V/3.3 V I/O-compatible interface (VDDQ), used in high-speed network packet buffering and FPGA co-processor memory subsystems.

For engineers reviewing the CY7C1362C-200AXCT datasheet, CY7C1362C-200AXCT pinout, CY7C1362C-200AXCT application, or CY7C1362C-200AXCT equivalent, key selection criteria include burst-mode timing compliance, registered address/data pipeline latency, byte-write granularity control, and TQFP-100 Pb-free package compatibility with JEDEC JESD8-5 I/O standards.

Technical Context

The CY7C1362C implements a two-bit internal burst counter synchronized to CLK, supporting Intel Pentium®-compatible interleaved or linear burst sequences via ADV, ADSP, and ADSC inputs. All address, data, and control signals (except OE and ZZ) are registered on the rising edge of CLK.

It features synchronous self-timed writes with user-selectable byte-width (1–4 bytes) controlled by BWA–BWD and BWE, plus global write (GW) for full-word writes. Output enable (OE) is asynchronous, enabling fast tristate control independent of clock phase.

Key Specifications

Pinout & Package

Package: Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm, 0.5 mm pitch, JEDEC MO-153 compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with IS61WV102418BLL-10TLI and MT28EW128ABA1HCS-0SIT, the CY7C1362C-200AXCT uniquely delivers pipelined 200 MHz operation with deterministic burst addressing and byte-granular writes-essential for modern packet-processing and FPGA-accelerated systems where latency predictability outweighs density or non-volatility.

Availability

CY7C1362C-200AXCT is available at Aetrix Electronics and suitable for network switching, FPGA acceleration, telecom line card, and industrial real-time controller applications requiring stable component supply across multi-year production cycles.

Supply support for CY7C1362C-200AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with focus on reliability, timing precision, and interoperability.

The CY7C136x series targets high-speed synchronous memory interfaces in networking, computing, and industrial control, emphasizing pipelined access, burst efficiency, and JEDEC-compliant I/O flexibility.

FAQ

What is the difference between CY7C1360C and CY7C1362C?

The CY7C1360C is organized as 256 K × 36 (9-Mbit), while the CY7C1362C is 512 K × 18 (also 9-Mbit). They share identical timing, pinout, and feature set but differ in data bus width and address depth. The CY7C1362C uses 18-bit data and 19-bit addressing; the CY7C1360C uses 36-bit data and 18-bit addressing. Both support the same burst modes and register pipeline architecture.

Does CY7C1362C-200AXCT support JTAG boundary scan?

Yes - the device implements IEEE 1149.1 JTAG boundary scan. Pins TDI, TDO, TCK, and TMS are assigned on the 119-ball BGA and 165-ball FBGA packages. The 100-pin TQFP package does not include JTAG pins; boundary scan is unavailable in that variant. JTAG functionality is enabled by default and can be disabled via configuration.

Can VDDQ be operated at 2.5 V while VDD remains at 3.3 V?

Yes - the datasheet explicitly specifies independent 3.3 V core (VDD) and 2.5 V or 3.3 V I/O (VDDQ) supplies. This dual-voltage operation allows direct interfacing with 2.5 V FPGA I/O banks or ASIC interfaces without level shifters, while maintaining full 3.3 V logic margin for internal registers and memory array.

What is the function of the MODE pin?

The MODE pin selects burst sequence type: logic HIGH configures Intel Pentium®-compatible interleaved burst (e.g., 0,2,4,6), and logic LOW selects linear burst (e.g., 0,1,2,3). This setting is sampled at power-up and latched; it determines how the internal 2-bit counter increments during burst operations initiated by ADV, ADSP, or ADSC.