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Infineon Technologies CY7C1363A-100AC
- Part No.:
- CY7C1363A-100AC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1363A-100AC.pdf
- Description:
- IC SRAM 9MBIT 100MHZ 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,968
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Product details
Overview
CY7C1363A-100AC from Cypress Semiconductor is a 512K × 18 synchronous flow-through burst SRAM with 100 MHz clock speed, 8.0 ns maximum access time, and 3.3 V core supply. It implements pipelined address registration, interleaved/linear burst addressing via MODE/ADV/ADSC/ADSP, and supports byte-wide (BWa/BWb) or global (GW) writes. Used in high-speed network packet buffering and FPGA co-processor memory interfaces.
For engineers reviewing the CY7C1363A-100AC datasheet, CY7C1363A-100AC pinout, CY7C1363A-100AC application, or CY7C1363A-100AC equivalent, key selection criteria include burst mode control logic, dual chip enable support for depth expansion, JTAG boundary scan availability in BGA/AJ packages, and 2.5 V/3.3 V I/O compatibility with 5 V tolerant inputs.
Technical Context
This SRAM uses synchronous, positive-edge-triggered clocking to register addresses (A0–A1), data (DQa/DQb), and controls (CE, OE, BWa, BWb, BWE, GW, ADSC, ADSP, ADV, MODE, ZZ). Address pipelining enables overlapping address setup with prior cycle data transfer, reducing effective latency in burst sequences.
Burst operation relies on an internal two-bit binary counter driven by ADV and configured by MODE (interleaved vs. linear). Write granularity is configurable per-byte (BWa/BWb active low with BWE low) or full-word (GW low), while CE and CE2 provide hierarchical chip select for multi-SRAM depth expansion without bus contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 × 18 bits - provides 9-Mbit density optimized for 16-bit+ data buses with parity or ECC overhead. |
| Max Clock Frequency | 100 MHz - enables 10 ns clock period timing margin for synchronous interface design with FPGA or ASIC controllers. |
| Access Time | 8.0 ns - defines worst-case delay from CLK rising edge to valid Q output during read cycles with OE asserted. |
| I/O Voltage Support | 2.5 V or 3.3 V VCCQ - allows interoperability with mixed-voltage SoC/FPGA I/O banks while maintaining LVTTL signal integrity. |
| Power Supply | +3.3 V ±5% core (VCC) - ensures stable operation under industrial voltage tolerance without external regulation beyond standard 3.3 V rail. |
| Standby Current | 10 mA CMOS - enables low-power idle states during ZZ sleep mode or CE deselection in power-constrained systems. |
| Burst Mode Control | Interleaved or linear via MODE pin - determines address sequence pattern for cache-line-aligned transfers matching CPU or DMA engine expectations. |
Pinout & Package
Package: 100-pin TQFP (AJ version), 14 mm × 22 mm PBGA (119-ball). Pin-compatible with CY7C1361A-100AC but reduced I/O count (DQc/DQd, BWc/BWd omitted) due to x18 organization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1 | Synchronous Address Inputs | Registered on CLK rising edge; used as LSBs for internal burst counter; require setup/hold timing relative to CLK. |
| DQa, DQb | Bidirectional Data I/O (18-bit) | First and second 9-bit bytes; high-impedance when BWa/BWb high or BWE high; driven synchronously on read, sampled synchronously on write. |
| BWa, BWb | Byte Write Enable Inputs | Active-low per-byte write control; BWa enables DQa (bits 0–8), BWb enables DQb (bits 9–17); both require BWE low to activate. |
| CE, CE2 | Synchronous Chip Enables | CE active-low gates ADSP; CE2 active-low (A version only) or active-high (BG/AJ) enables depth expansion with one-cycle deselect. |
| ADSC, ADSP | Address Status Control Inputs | ADSP initiates new read with CE low; ADSC selects/deselects device and registers new address; both edge-sensitive on CLK rising edge. |
| ADV, MODE | Burst Sequence Control | ADV low advances internal counter; MODE low selects linear burst, high/NC selects interleaved - critical for cache line alignment. |
| ZZ | Asynchronous Sleep Input | High-Z outputs and reduced current draw when HIGH; no timing dependency on CLK; enables rapid power-state transitions. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through burst architecture | Eliminates pipeline stalls during sequential reads by outputting first word in same cycle as address registration. |
| Depth expansion support | Two independent chip enables (CE/CE2) allow stacking multiple devices without external glue logic or bus contention. |
| JTAG boundary scan (BG/AJ) | IEEE 1149.1 compliance with TMS/TDI/TCK/TDO pins enables production test and board-level fault isolation. |
| 5 V tolerant inputs | All control and address inputs accept 5 V logic levels while operating from 3.3 V supply - simplifies interface with legacy 5 V peripherals. |
| Clamp diodes on all I/O | Integrated ESD protection (±2 kV HBM) at each pin reduces need for external TVS components in rugged environments. |
Applications
| Network Packet Buffering | FPGA Co-Processor Memory |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer between MAC and switch fabric; synchronized to 100 MHz system clock with burst reads matching frame size. Use Value: 8.0 ns access + flow-through burst delivers sub-10 ns effective read latency for 4-word bursts, enabling line-rate 1 Gbps switching. |
Use Scenario: Offloading compute-intensive tasks (e.g., CRC, encryption) from host CPU using FPGA-accelerated datapath. IC Role / Device Role / Timing Role: Local scratchpad memory for FPGA logic; interfaced via AXI or custom parallel bus with pipelined address staging. Use Value: Dual CE support allows seamless memory expansion across multiple SRAMs, scaling bandwidth to match FPGA throughput without redesign. |
| Industrial Motion Controller Cache | Medical Imaging Frame Store |
|
Use Scenario: Real-time interpolation and trajectory calculation in CNC motion controllers requiring deterministic memory access. IC Role / Device Role / Timing Role: Deterministic-latency instruction/data cache for DSP core; ZZ sleep mode reduces power between motion segments. Use Value: Asynchronous ZZ control enables microsecond-scale power gating without clock domain crossing or state loss. |
Use Scenario: Temporary storage of uncompressed ultrasound or MRI pixel data during acquisition and preprocessing. IC Role / Device Role / Timing Role: High-reliability frame buffer interfaced to ADC/DAC subsystems; 2.5 V I/O compatibility matches imaging sensor interfaces. Use Value: Clamp diodes and 10 mA standby current ensure robustness against EMI in diagnostic equipment with strict EMC requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1361A-100AC | 256K × 36 organization; includes DQc/DQd and BWc/BWd pins; higher pin count for same package. | Preferred where 32-bit+ data path or byte-parity support is required; not drop-in compatible due to pinout and width mismatch. | Select when system bus width exceeds 18 bits or requires four independent byte lanes. |
| IS61WV51218BLL-10TLI | 512K × 18, 10 ns access, 3.3 V only (no 2.5 V I/O option), no JTAG, no CE2 pin. | Lacks depth expansion flexibility and mixed-voltage I/O; suitable for cost-sensitive, single-SRAM designs without test infrastructure. | Choose for simplified BOM where JTAG and dual CE are unnecessary and 2.5 V I/O compatibility is not required. |
Compared with CY7C1363A-100AC, the CY7C1361A-100AC offers wider data path at expense of pin compatibility, while the IS61WV51218BLL-10TLI sacrifices configurability and testability for lower unit cost and smaller footprint.
Availability
CY7C1363A-100AC is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, and industrial motion controller cache applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1363A-100AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications systems.
The CY7C136x series targets high-speed synchronous memory interfaces in bandwidth-constrained systems, emphasizing burst efficiency, low-latency access, and robust signal integrity for FPGA and ASIC integration.
FAQ
What is the function of the MODE pin on CY7C1363A-100AC?
The MODE pin selects burst address sequencing: a LOW configures linear burst (0,1,2,3), while HIGH or NC selects interleaved burst (0,2,1,3). This matches CPU cache line ordering expectations and must be set statically before initialization; it is not dynamically reconfigurable during operation.
Does CY7C1363A-100AC support 2.5 V I/O operation?
Yes - VCCQ can be supplied at either 2.5 V or 3.3 V, allowing direct interface with 2.5 V FPGA I/O banks. Core logic remains at 3.3 V (VCC), and all inputs are 5 V tolerant regardless of VCCQ setting, enabling mixed-voltage system integration without level shifters.
How does CE2 differ between package versions of CY7C1363A-100AC?
CE2 is active-low in the TQFP A version (pin 92), absent in PBGA (BG) and TQFP AJ versions. In BG/AJ packages, CE2 functionality is omitted entirely; only CE is used for chip select. The A version's CE2 supports hierarchical depth expansion with zero-bus-contention deselect timing.
Is JTAG boundary scan available on all CY7C1363A-100AC packages?
No - JTAG (TMS/TDI/TCK/TDO) is implemented only in the 119-ball PBGA and TQFP AJ packages. The TQFP A version lacks JTAG pins entirely. Boundary scan capability must be verified against package marking (AJ or BG suffix) and cannot be assumed from part number alone.
CY7C1363A-100AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1363A-100AC FAQ
1.How can I place an order for CY7C1363A-100AC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1363A-100AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1363A-100AC reliable?
The price and inventory of CY7C1363A-100AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1363A-100AC is usually 5 days.
3.What payment methods are accepted for CY7C1363A-100AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1363A-100AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1363A-100AC?
CY7C1363A-100AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1363A-100AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1363A-100AC?
For technical support, including CY7C1363A-100AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1363A-100AC requirements.
6.How does Aetrix verify that CY7C1363A-100AC is sourced from the original manufacturer or authorized distributors?
All CY7C1363A-100AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1363A-100AC meets industry standards.
7.What is the process for return or replacement of CY7C1363A-100AC?
All CY7C1363A-100AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1363A-100AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1363A-100AC part is unused and in its original packaging.
Return procedure for CY7C1363A-100AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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