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Infineon Technologies CY7C1363C-133AJXCT

Part No.:
CY7C1363C-133AJXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1363C-133AJXCT.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,564

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Product details

Overview

CY7C1363C-133AJXCT from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM organized as 512K × 18, designed for high-speed cache and buffer applications in microprocessor systems. It supports 133 MHz bus operation with 6.5 ns clock-to-output delay, uses 3.3 V core (±5%/+10%) and selectable 2.5 V/3.3 V I/O (VDDQ), and features synchronous self-timed write and asynchronous output enable.

For engineers reviewing the CY7C1363C-133AJXCT datasheet, CY7C1363C-133AJXCT pinout, CY7C1363C-133AJXCT application, or CY7C1363C-133AJXCT equivalent, key selection criteria include burst mode configuration (interleaved/linear via MODE pin), dual chip-enable architecture (CE1/CE2), JTAG boundary-scan support, and TQFP-100 Pb-free packaging with ZZ sleep mode.

Technical Context

This SRAM implements a synchronous flow-through architecture with a 2-bit on-chip burst counter that captures the initial address and auto-increments for subsequent burst cycles. All address, data, and control inputs (ADSP, ADSC, ADV, CE1–CE3, BWx, BWE, GW) are registered on the rising edge of CLK.

Asynchronous functions include OE-controlled output tri-state and ZZ-driven low-power sleep mode. Burst sequencing is selected by the MODE pin (HIGH = interleaved, LOW = linear), and address advancement is controlled independently by ADV, enabling flexible integration with Pentium™-compatible controllers and cache coherency logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 18 (9-Mbit total); enables compact 18-bit data path interfacing without external width conversion.
Maximum Clock Frequency 133 MHz; supports sustained burst transfers aligned with high-end CPU front-side bus timing.
Access Time (tCO) 6.5 ns (clock-to-output); guarantees sub-8 ns read latency critical for zero-wait-state cache operation.
Core Supply Voltage (VDD) 3.3 V ±5% / +10%; accommodates industrial voltage tolerance while maintaining timing integrity.
I/O Supply Voltage (VDDQ) 2.5 V or 3.3 V selectable; allows interoperability with both DDR2-compatible and legacy 3.3 V logic domains.
Burst Control Intel Pentium™-compatible interleaved/linear via MODE pin; eliminates need for external burst sequencer logic.
Sleep Mode ZZ input activates low-power state drawing ≤40 mA standby current; reduces system-level power during idle cycles.

Pinout & Package

Packaged in Pb-free 100-pin TQFP (14 × 20 × 1.4 mm), the CY7C1363C-133AJXCT uses a 2-chip-enable variant (AJ suffix) with dedicated ADSP/ADSC address strobes, separate ADV for burst advancement, and IEEE 1149.1 JTAG-compliant TAP signals (TCK/TMS/TDI/TDO).

Pin/Terminal Circuit Role Design Meaning
CLK Positive-edge-triggered system clock Synchronizes all register inputs; defines tCO and setup/hold timing windows for all synchronous controls.
ADSP / ADSC Processor / Controller address strobe Initiates burst access; selects source of first address-enables dual-bus arbitration between CPU and cache controller.
ADV Address advancement control Drives internal burst counter increment; allows precise control over burst length and address stride independent of strobes.
CE1 / CE2 Chip enable inputs (2-enable mode) Enable device only when both asserted; supports depth expansion with minimal glue logic in multi-SRAM configurations.
MODE Burst sequence selector HIGH = interleaved (e.g., Pentium L2 cache), LOW = linear; configures address generation pattern without firmware overhead.
ZZ Deep power-down control Asynchronously places SRAM in ultra-low-current sleep state; retains data but disables outputs and clocks internally.

Key Features

Feature Design Value
Synchronous self-timed write Eliminates external write pulse generation; internal timing ensures reliable data capture across voltage/temperature corners.
User-selectable burst mode Hardware-mode pin (MODE) directly configures burst addressing-no register programming or initialization sequence required.
Separate processor/controller strobes ADSP and ADSC allow concurrent or prioritized access from CPU and memory controller, improving bus utilization efficiency.
JTAG boundary scan (IEEE 1149.1) Enables PCB-level interconnect testing without physical probe access; supports production test and field diagnostics.
Flexible I/O voltage (VDDQ) 2.5 V or 3.3 V selection permits direct interface to mixed-voltage SoC designs without level-shifting components.

Applications

L2 Cache Buffer Network Packet Buffer

Use Scenario: High-speed L2 cache between CPU core and memory controller in embedded x86 or compatible processors.

IC Role / Device Role / Timing Role: Flow-through SRAM providing zero-wait-state reads at 133 MHz with burst-aligned data delivery.

Use Value: 6.5 ns tCO and 2-1-1-1 access rate eliminate pipeline stalls during sequential instruction fetch and data streaming.

Use Scenario: Temporary storage for variable-length Ethernet or PCIe packets in switch fabric or NIC ASICs.

IC Role / Device Role / Timing Role: Synchronous buffer accepting bursts from DMA engines and releasing data on demand to MAC layers.

Use Value: Dual strobe (ADSP/ADSC) and ADV-controlled burst advancement enable deterministic latency for packet reassembly.

Industrial PLC Memory Module Automotive ADAS Preprocessing Buffer

Use Scenario: Real-time data logging and program execution memory in programmable logic controllers operating across extended temperature ranges.

IC Role / Device Role / Timing Role: Reliable, low-latency SRAM supporting deterministic scan-cycle execution under industrial EMI conditions.

Use Value: ZZ sleep mode reduces average power by >90% during idle scan intervals; 40 mA CMOS standby meets IEC 61131-2 requirements.

Use Scenario: Frame buffering between image sensor interface and vision processor in automotive surround-view or lane-departure systems.

IC Role / Device Role / Timing Role: High-bandwidth temporary storage for raw pixel streams prior to hardware-accelerated processing.

Use Value: 3.3 V core with ±5% tolerance and automotive-grade qualification ensure robust operation in 12 V battery-supplied environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102418BLL-133TQLI 1-Mbit × 18, 133 MHz, 3.3 V core, no JTAG, non-flow-through (pipelined) architecture Lacks ADSP/ADSC dual-strobe and MODE-selectable burst; requires external burst controller for Pentium compatibility Prefer when JTAG testability and strict flow-through timing are not required; lower cost for simpler burst patterns.
MT48LC16M16A2P-6A:G 256-Mbit SDRAM, 166 MHz, 3.3 V, requires refresh and command sequencing Asynchronous initialization, multi-cycle read/write setup, no native burst mode selection via pin Choose only if higher density justifies added controller complexity and latency penalties; not drop-in compatible.

Compared with IS61WV102418BLL-133TQLI and MT48LC16M16A2P-6A:G, the CY7C1363C-133AJXCT delivers deterministic 6.5 ns flow-through latency, hardware-configurable burst behavior, and integrated JTAG - making it uniquely suited for real-time cache and deterministic buffer roles where timing predictability outweighs density or cost.

Availability

CY7C1363C-133AJXCT is available at Aetrix Electronics and suitable for L2 cache buffers, network packet buffers, and industrial PLC memory modules requiring stable component supply, long-term lifecycle support, and Pb-free compliance.

Supply support for CY7C1363C-133AJXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.

The CY7C1363C belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for high-performance, low-latency memory interfacing in microprocessor- and controller-based systems demanding deterministic timing and minimal glue logic.

FAQ

What is the function of the MODE pin on CY7C1363C-133AJXCT?

The MODE pin selects burst address sequencing: HIGH configures interleaved addressing (e.g., 0, 4, 2, 6 for 4-beat burst), matching Intel Pentium™ L2 cache protocols; LOW selects linear addressing (0, 1, 2, 3). This hardware-selectable mode eliminates firmware configuration and ensures cycle-accurate burst alignment with host controllers.

Does CY7C1363C-133AJXCT support JTAG boundary scan, and how is it enabled?

Yes, it implements IEEE 1149.1 JTAG boundary scan using dedicated TCK, TMS, TDI, and TDO pins. JTAG is enabled by default at power-up; no configuration register or fuse setting is required. The TAP controller operates at up to 25 MHz and supports full interconnect testing per JEDEC JESD-71 standards.

Can VDDQ be operated at 2.5 V while VDD remains at 3.3 V?

Yes - VDDQ is independently supplied and rated for either 2.5 V ±0.2 V or 3.3 V ±0.3 V, regardless of VDD (3.3 V ±5%/+10%). This allows direct interfacing with 2.5 V ASICs or FPGAs while maintaining full 133 MHz timing performance and 6.5 ns tCO specification.

What is the difference between ADSP and ADSC inputs?

ADSP (Address Strobe Processor) initiates bursts from the CPU side; ADSC (Address Strobe Controller) initiates bursts from cache controllers or DMA engines. Both are asynchronous inputs registered on CLK rise, enabling independent arbitration and priority handling - critical for systems with multiple bus masters sharing the same SRAM.

CY7C1363C-133AJXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1363C-133AJXCT FAQ

1.How can I place an order for CY7C1363C-133AJXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1363C-133AJXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1363C-133AJXCT reliable?

The price and inventory of CY7C1363C-133AJXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1363C-133AJXCT is usually 5 days.

3.What payment methods are accepted for CY7C1363C-133AJXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1363C-133AJXCT transactions.

Note: Certain payment methods may incur a processing fee.

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CY7C1363C-133AJXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1363C-133AJXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1363C-133AJXCT?

For technical support, including CY7C1363C-133AJXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1363C-133AJXCT requirements.

6.How does Aetrix verify that CY7C1363C-133AJXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1363C-133AJXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1363C-133AJXCT meets industry standards.

7.What is the process for return or replacement of CY7C1363C-133AJXCT?

All CY7C1363C-133AJXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1363C-133AJXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1363C-133AJXCT part is unused and in its original packaging.

Return procedure for CY7C1363C-133AJXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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