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Infineon Technologies CY7C1363C-133AXCT

Part No.:
CY7C1363C-133AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1363C-133AXCT.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,058

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Product details

Overview

CY7C1363C-133AXCT from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with 512K × 18 organization, designed for high-speed cache and buffer applications in microprocessor systems. It supports 133 MHz bus operation with 6.5 ns clock-to-output delay, operates on 3.3 V core supply (±5%/+10%), and features dual VDDQ options (2.5 V or 3.3 V) for I/O compatibility.

For engineers reviewing the CY7C1363C-133AXCT datasheet, CY7C1363C-133AXCT pinout, CY7C1363C-133AXCT application, or CY7C1363C-133AXCT equivalent, key selection criteria include burst mode flexibility (interleaved/linear), synchronous self-timed write capability, IEEE 1149.1 JTAG support, and TQFP-100 Pb-free packaging with 3-chip-enable configuration.

Technical Context

This SRAM implements a synchronous flow-through architecture with a 2-bit on-chip burst counter that captures the initial address and auto-increments for subsequent burst cycles. All address, data, and control inputs (CE1/CE2/CE3, ADSC/ADSP/ADV, BWx, BWE, GW) are registered on the rising edge of CLK.

Asynchronous signals include OE and ZZ (sleep mode), enabling low-power operation without clock dependency. Burst sequence type-interleaved (MODE = HIGH) or linear (MODE = LOW)-is user-selectable and determines address progression during burst reads/writes initiated by either processor (ADSP) or controller (ADSC) strobes.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density9 Mbit (512K × 18 organization), enabling compact high-bandwidth buffer design for 18-bit data paths.
Max Clock Frequency133 MHz, supporting sustained 133 MT/s throughput in synchronous bus environments.
Access Time6.5 ns clock-to-output (tCO), ensuring minimal latency between clock edge and valid data at DQ pins.
VDD Supply Range3.3 V ±5% (min) / +10% (max), compatible with standard 3.3 V logic rails while accommodating supply tolerance.
VDDQ Options2.5 V or 3.3 V selectable I/O supply, allowing interoperability with mixed-voltage system interfaces.
Burst SupportIntel Pentium-compatible interleaved or linear sequences, configurable via MODE pin for legacy or optimized memory access patterns.
PackagePb-free 100-pin TQFP (14 × 20 × 1.4 mm), qualified for industrial temperature range and RoHS compliance.

Pinout & Package

Package: Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body, 0.5 mm pitch, 3-chip-enable variant (A version).

Pin/TerminalCircuit RoleDesign Meaning
CLKClock inputPositive-edge-triggered master timing reference for all synchronous register inputs (addresses, controls, data).
ADSP / ADSCAddress strobe inputsInitiate burst sequences: ADSP for processor-initiated bursts, ADSC for controller-initiated bursts.
ADVAddress advance controlControls internal address increment during burst; active-high to advance to next location in sequence.
MODEBurst sequence selectorHIGH enables Intel Pentium-style interleaved addressing; LOW enables linear sequential addressing.
CE1 / CE2 / CE3Chip enable inputsThree independent enables allow depth expansion and hierarchical memory mapping in multi-SRAM systems.
ZZDeep power-down controlAsynchronous entry into low-current sleep mode (<60 µA typical), independent of clock state.
OEOutput enableAsynchronous gate for output buffers; allows data hold or bus sharing without affecting internal timing.
BWx / BWEByte write enablesIndependent control of four 18-bit data nibbles (BW A–D) plus global write (BWE) for partial-word writes.

Key Features

FeatureDesign Value
Synchronous self-timed writeInternal write cycle completion detection eliminates need for external write timing control or wait-state generation.
User-selectable burst modeHardware-mode pin (MODE) directly configures interleaved vs. linear addressing-no register programming required.
JEDEC JESD8-5 I/O compatibilityEnsures interoperability with 2.5 V and 3.3 V LVTTL/LVCMOS buses without level-shifting circuitry.
IEEE 1149.1 JTAG boundary scanEnables board-level testability and interconnect verification in dense PCB layouts without physical probe access.
Flow-through read architectureEliminates pipeline stalls during consecutive reads-output data appears on next clock edge after address setup.

Applications

High-Performance CPU CacheNetwork Packet Buffer

Use Scenario: Used as Level 2 (L2) cache memory in embedded RISC processors requiring deterministic 133 MHz access and sub-7 ns latency.

IC Role / Device Role / Timing Role: Flow-through SRAM providing zero-wait-state burst reads aligned to processor clock domain via ADSP/ADSC strobes.

Use Value: Enables 2-1-1-1 access rate and eliminates glue logic for address pipelining, reducing PCB area and signal integrity risk.

Use Scenario: Implements temporary storage for variable-length Ethernet frames in Layer 2 switches before forwarding or classification.

IC Role / Device Role / Timing Role: High-bandwidth buffer interfacing with MAC controllers using synchronous burst writes and asynchronous OE-controlled read arbitration.

Use Value: Dual VDDQ support allows direct connection to 2.5 V PHY interfaces while maintaining 3.3 V core stability under traffic load spikes.

Industrial Motion Controller MemoryAvionics Data Acquisition Buffer

Use Scenario: Stores real-time position and velocity profiles in servo drive firmware, accessed by FPGA-based motion sequencers.

IC Role / Device Role / Timing Role: Synchronous SRAM synchronized to FPGA fabric clock, using ADV-driven burst writes for trajectory update packets.

Use Value: ZZ sleep mode reduces standby current to <60 µA during idle cycles, extending thermal margin in sealed enclosures.

Use Scenario: Captures time-stamped sensor samples from inertial measurement units (IMUs) in flight control computers.

IC Role / Device Role / Timing Role: High-reliability buffer with JTAG test access for DO-254-compliant board validation and in-system diagnostics.

Use Value: TQFP-100 package provides mechanical robustness and thermal performance suitable for extended temperature operation (-40°C to +85°C).

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C36256B-133JCIN512K × 18, 133 MHz, but uses 3.3 V only for VDDQ; no ZZ sleep mode; non-JTAG.Lacks deep-sleep and boundary-scan, limiting use in power-constrained or safety-critical designs.Select when JTAG testability and ultra-low standby current are not required, and cost is prioritized.
IS61WV51218BLL-133TQLI512K × 18, 133 MHz, but asynchronous output enable disabled during burst; no MODE-selectable burst type.Fixed linear burst only; requires external logic for interleaved addressing if needed by host processor.Choose when system uses only linear bursts and does not require MODE pin flexibility or ADSC/ADSP dual-strobe support.

Compared with AS7C36256B-133JCIN and IS61WV51218BLL-133TQLI, the CY7C1363C-133AXCT uniquely combines JTAG testability, hardware-selectable burst modes, and true asynchronous ZZ sleep-critical for automotive and industrial systems requiring field-testability and dynamic power management.

Availability

CY7C1363C-133AXCT is available at Aetrix Electronics and suitable for high-speed CPU cache, network packet buffering, and industrial motion control applications requiring stable component supply, long-term lifecycle assurance, and Pb-free compliance.

Supply support for CY7C1363C-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and communications markets.

This device belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in microprocessor-adjacent subsystems where deterministic timing and burst efficiency are critical.

FAQ

What is the function of the MODE pin on CY7C1363C-133AXCT?

The MODE pin selects burst address sequencing: a HIGH level configures interleaved addressing (e.g., 0, 4, 2, 6…), matching Intel Pentium protocols, while a LOW level selects linear addressing (0, 1, 2, 3…). This hardware-selectable behavior requires no initialization code and directly affects how ADV-driven burst cycles increment internal addresses.

Does CY7C1363C-133AXCT support both 2.5 V and 3.3 V I/O interfaces simultaneously?

No-it supports either 2.5 V or 3.3 V on VDDQ, selected at power-up and fixed for the duration of operation. The I/O voltage must be externally supplied to the VDDQ pins and matched to the host interface voltage; mixing voltages across DQ pins is not permitted and may damage the device.

How does the ZZ (sleep) mode reduce power consumption?

When ZZ is driven LOW asynchronously, the device enters deep power-down mode, disabling internal clocks, sense amplifiers, and output drivers. Typical standby current drops to less than 60 µA-over 600× lower than active standby-while retaining full data retention and enabling instant wake-up on CE or CLK activity.

Can CY7C1363C-133AXCT be used with a 100 MHz clock in a 133 MHz-rated part?

Yes-the 133 MHz rating guarantees correct operation up to 133 MHz; running at 100 MHz is fully compliant and reduces timing margin pressure. Electrical characteristics including tCO (6.5 ns) and setup/hold times remain valid, and all features-including burst modes, JTAG, and ZZ sleep-operate identically at lower frequencies.

CY7C1363C-133AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1363C-133AXCT FAQ

1.How can I place an order for CY7C1363C-133AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1363C-133AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1363C-133AXCT reliable?

The price and inventory of CY7C1363C-133AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1363C-133AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1363C-133AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1363C-133AXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1363C-133AXCT?

CY7C1363C-133AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1363C-133AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1363C-133AXCT?

For technical support, including CY7C1363C-133AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1363C-133AXCT requirements.

6.How does Aetrix verify that CY7C1363C-133AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1363C-133AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1363C-133AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1363C-133AXCT?

All CY7C1363C-133AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1363C-133AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1363C-133AXCT part is unused and in its original packaging.

Return procedure for CY7C1363C-133AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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