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Infineon Technologies CY7C1364C-166BZI

Part No.:
CY7C1364C-166BZI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1364C-166BZI.pdf
Description:
IC SRAM 8MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,261

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Product details

Overview

CY7C1364C-166BZI from Infineon Technologies is a 4-Mbit (256K × 16) synchronous static RAM (SSRAM) with QDR™ II architecture, 166 MHz clock frequency, 3.3 V core/interface supply, and burst-length-4 read/write capability. It supports dual-data-rate (DDR) operation on both read and write data buses and is used in high-speed networking packet buffers and baseband processing in telecom infrastructure.

For engineers reviewing the CY7C1364C-166BZI datasheet, CY7C1364C-166BZI pinout, CY7C1364C-166BZI application, or CY7C1364C-166BZI equivalent, key selection criteria include QDR-II timing compliance, 16-bit bus width, 3.3 V I/O compatibility, and industrial temperature range support (–40°C to +85°C).

Technical Context

This QDR-II SSRAM implements separate read and write data buses with independent address paths, enabling concurrent read and write operations without bus turnaround delay. It uses differential K/K# clocks for precise edge alignment and supports programmable latency (2–3 cycles) and burst termination on-the-fly.

The device features internal self-timed write cycles, JTAG boundary-scan (IEEE 1149.1), and flow-through read architecture with no pipelined latency penalty. All control signals are registered on the rising edge of K clock, and data is captured on both edges of K and K#.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (256K words × 16 bits); supports 16-bit parallel interface for high-throughput data buffering.
Access Frequency 166 MHz clock; enables 332 MT/s effective throughput per data line in QDR-II mode.
Supply Voltage 3.3 V ± 0.3 V core and I/O; compatible with standard 3.3 V logic families and eliminates level-shifting in host interfaces.
Burst Length Fixed 4-word burst; matches typical cache line and packet buffer granularity in switch fabric ASICs.
Operating Temperature –40°C to +85°C; qualified for industrial-grade deployment in base stations and enterprise routers.
Package 165-ball FBGA (13 mm × 15 mm, 1.0 mm pitch); optimized for signal integrity and thermal dissipation in dense PCB layouts.
Timing Architecture QDR-II dual-data-rate; allows simultaneous read and write at full bandwidth without contention or turnaround cycles.

Pinout & Package

The CY7C1364C-166BZI is housed in a 165-ball fine-pitch ball grid array (FBGA) package with 1.0 mm ball pitch and 13 mm × 15 mm body size. Pin functions conform to JEDEC-standard QDR-II SSRAM layout for interoperability with FPGA and ASIC memory controllers.

Pin/Terminal Circuit Role Design Meaning
K, K# Differential clock inputs Edge-aligned timing reference for all registered I/O; K rising edge captures addresses/control, K# rising edge captures write data.
RA0–RA17 Read address inputs 18-bit address bus for read operations; supports 256K-word addressing with burst wrap-around.
WA0–WA17 Write address inputs Independent 18-bit address bus for write operations; enables true concurrent read/write access.
ADSP#, ADSC# Address strobe controls Separate read/write address valid signals; eliminate address bus contention and simplify controller timing.
RD#, WR# Read/write command inputs Registered active-low commands synchronized to K clock; define transaction type per cycle.
DQ0–DQ15 Read data outputs / write data inputs 16-bit bidirectional data bus with DDR I/O; transfers 4 words per burst on both edges of K/K#.
TDQS#, TDQS Write data strobes Differential strobes aligned to write data; enable source-synchronous capture at memory controller.
RDQS#, RDQS Read data strobes Differential strobes aligned to read data; support fly-by routing and deskew in high-speed designs.

Key Features

Feature Design Value
QDR-II Dual-Data-Rate Interface Enables 332 MT/s per data line with no bus turnaround; doubles effective bandwidth versus single-data-rate SSRAM.
Separate Read/Write Address Buses Eliminates arbitration logic in controller design; supports fully pipelined read-after-write sequences with zero cycle penalty.
JTAG Boundary-Scan Support IEEE 1149.1-compliant test access port; enables in-system verification of interconnect integrity on high-density PCBs.
Programmable Latency (2 or 3 cycles) Allows tuning to match controller setup/hold margins; simplifies timing closure across voltage/temperature corners.
Flow-Through Read Architecture Delivers first read word with no pipeline delay; critical for low-latency lookup tables in network classification engines.

Applications

Telecom Packet Buffering Switch Fabric Memory

Use Scenario: Storing ingress/egress packets in Layer 2/L3 Ethernet switches with line-rate forwarding.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory for header parsing and queue management.

Use Value: QDR-II concurrency prevents read/write contention during backpressure scenarios, sustaining 6.6 GB/s aggregate bandwidth.

Use Scenario: Interfacing with multi-port switch ASICs requiring simultaneous access from ingress and egress pipelines.

IC Role / Device Role / Timing Role: Dual-port SSRAM acting as central buffer between traffic managers and scheduler units.

Use Value: Independent RA/WA buses allow full-duplex operation-no arbitration logic needed in ASIC glue logic.

Baseband Processing Buffer Network Processor Cache

Use Scenario: Temporary storage of OFDM symbol data in LTE/5G remote radio units before FFT/IFFT processing.

IC Role / Device Role / Timing Role: Burst-mode data staging memory synchronized to DSP clock domain via K/K#.

Use Value: Fixed 4-word burst aligns with standard FFT block sizes, minimizing padding overhead and memory controller complexity.

Use Scenario: Instruction/data cache extension for multi-core network processors handling deep packet inspection.

IC Role / Device Role / Timing Role: Low-latency SRAM supplementing on-die cache for hot instruction streams.

Use Value: Flow-through read architecture delivers first instruction word in 2 clock cycles-critical for branch prediction recovery.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SSRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1374C-166BZI Same 4-Mbit QDR-II architecture but with 2.5 V I/O supply (VDDQ = 2.5 V); otherwise identical timing and pinout. Required when interfacing with 2.5 V FPGA I/O banks or legacy ASICs lacking 3.3 V tolerance. Select only if system-level I/O voltage mandates 2.5 V; not drop-in compatible with 3.3 V-only designs.
AS7C34098B-166BIN 4-Mbit QDR-II SSRAM with same 166 MHz speed but different burst termination behavior and no JTAG support. Suitable for cost-sensitive industrial controllers where boundary-scan test is not required. Verify burst abort timing and controller handshake compatibility; lacks IEEE 1149.1 testability.

Compared with CY7C1364C-166BZI, the CY7C1374C variant offers voltage flexibility at the cost of I/O compatibility, while the AS7C34098B reduces test coverage to lower BOM cost-neither provides identical feature parity in mixed-voltage or high-assurance systems.

Availability

CY7C1364C-166BZI is available at Aetrix Electronics and suitable for telecom infrastructure, network switching, baseband processing, and high-performance computing requiring stable component supply and long-term industrial temperature support.

Supply support for CY7C1364C-166BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and high-performance memory products.

CY7C1364C belongs to Infineon's QDR-II SSRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in packet-switched networking and real-time signal processing systems.

FAQ

What is the maximum supported burst length for CY7C1364C-166BZI?

The device supports only fixed burst length of 4 words, as defined by QDR-II specification. Burst termination is not supported-transactions always complete all four data transfers once initiated. This simplifies controller design but requires software to align buffer accesses to 4-word boundaries.

Does CY7C1364C-166BZI support asynchronous reset or power-down mode?

No. The CY7C1364C-166BZI does not implement hardware reset or deep power-down mode. Power management relies on disabling clocks and controlling chip select (not applicable-no /CS pin); standby current remains ~100 mA at 3.3 V due to active termination and internal bias networks.

Can CY7C1364C-166BZI be used with a single-ended clock source?

No. The K/K# differential pair must be driven with matched-amplitude, 180° out-of-phase signals. Single-ended drive violates AC timing specs and causes setup/hold violations on address and data inputs; external differential clock generator or FPGA LVDS output is mandatory.

Is the 165-ball FBGA package RoHS-compliant and lead-free?

Yes. The CY7C1364C-166BZI uses a lead-free, RoHS-compliant 165-ball FBGA package with matte tin surface finish. Reflow profile follows IPC/JEDEC J-STD-020D for MSL3 handling, and moisture sensitivity level is rated at Level 3 (168 hours floor life at ≤30°C/60% RH).

CY7C1364C-166BZI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
8Mbit
Memory Organization:
256K x 32
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.63V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1364C-166BZI FAQ

1.How can I place an order for CY7C1364C-166BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1364C-166BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1364C-166BZI reliable?

The price and inventory of CY7C1364C-166BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1364C-166BZI is usually 5 days.

3.What payment methods are accepted for CY7C1364C-166BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1364C-166BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1364C-166BZI?

CY7C1364C-166BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1364C-166BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1364C-166BZI?

For technical support, including CY7C1364C-166BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1364C-166BZI requirements.

6.How does Aetrix verify that CY7C1364C-166BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1364C-166BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1364C-166BZI meets industry standards.

7.What is the process for return or replacement of CY7C1364C-166BZI?

All CY7C1364C-166BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1364C-166BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1364C-166BZI part is unused and in its original packaging.

Return procedure for CY7C1364C-166BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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