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Infineon Technologies CY7C1366C-166AXC
- Part No.:
- CY7C1366C-166AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1366C-166AXC.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,726
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Product details
Overview
CY7C1366C-166AXC from Infineon Technologies (formerly Cypress) is a 9-Mbit pipelined synchronous SRAM with 256K × 36 organization, designed for high-speed secondary cache in Pentium-class systems. It supports 166 MHz bus operation, delivers 3.5 ns clock-to-output timing, and features registered I/O, dual VDD/VDDQ supplies (3.3 V core / 2.5 V or 3.3 V I/O), and IEEE 1149.1 JTAG boundary scan - deployed in network line cards requiring deterministic burst access and depth-expansion without wait states.
For engineers reviewing the CY7C1366C-166AXC datasheet, CY7C1366C-166AXC pinout, CY7C1366C-166AXC application, or CY7C1366C-166AXC equivalent, key selection criteria include pipelined deselect timing, byte-write granularity (BWA–BWD + BWE), burst mode control (ADSP/ADSC/ADV/MODE), and TQFP-100 package compatibility with CE1/CE2/CE3 chip enable architecture.
Technical Context
This SRAM implements a two-bit synchronous burst counter, edge-triggered input/output registers, and pipelined enable logic that delays output buffer disable by one clock cycle during deselect - enabling seamless depth expansion across multiple devices. All address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK.
The device supports both interleaved (Pentium-compatible) and linear burst sequences via the MODE pin, with address advancement controlled by ADV. Write operations are self-timed and support 1–4 byte widths using BWx and BWE, while GW enables full-word writes independent of byte-select state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 configuration) |
| Max Clock Frequency | 166 MHz - defines maximum sustained burst throughput in synchronous systems |
| Access Time (tCO) | 3.5 ns - guaranteed clock-to-output delay at 166 MHz, critical for timing closure in cache interfaces |
| VDD Supply Range | 3.3 V ±5% - core power domain; requires stable low-noise regulation for SRAM cell stability |
| VDDQ Supply Range | 2.5 V or 3.3 V - selectable I/O voltage supporting mixed-voltage system interfacing |
| Burst Support | Intel Pentium interleaved or linear sequences - determined by MODE pin sampling at power-up or reset |
| Power Dissipation (Active) | 180 mA max operating current - translates to ~594 mW at 3.3 V, guiding thermal layout for dense PCBs |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, with three chip enables (CE1, CE2, CE3) and dedicated JTAG pins (TCK/TMS/TDI/TDO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Rising-edge-triggered master clock for all registered inputs/outputs and burst counter increment |
| ADSP / ADSC | Address strobe inputs | Asynchronous assertion initiates address capture; ADSP takes priority when both active - enables processor/controller coexistence |
| ADV | Burst advance control | Active-LOW signal that increments internal 2-bit counter to generate next burst address automatically |
| BWA–BWD + BWE | Byte write controls | Four independent byte enables + global byte write enable - supports partial-word writes without read-modify-write overhead |
| OE | Asynchronous output enable | Tristates DQ/DQP pins immediately when HIGH; masked only during first clock of read after deselect |
| ZZ | Asynchronous sleep mode | Active-HIGH entry into low-power retention mode; internal pull-down allows floating for normal operation |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined deselect logic | Delays output buffer disable by one clock cycle, eliminating wait states during depth expansion across multiple SRAMs |
| User-selectable burst mode | MODE pin selects Intel Pentium interleaved or linear burst sequence - no firmware or register programming required |
| Dual-supply I/O interface | VDDQ supports 2.5 V or 3.3 V operation - enables direct connection to either generation of microprocessor I/O banks |
| JTAG boundary scan | IEEE 1149.1-compliant test access port - provides board-level interconnect verification without physical probe access |
| Registered synchronous interface | All address/data/control inputs (except OE/ZZ) sampled on CLK rising edge - simplifies timing analysis and PCB routing |
Applications
| Secondary Cache for x86 Systems | High-Speed Packet Buffering |
|---|---|
|
Use Scenario: L2 cache memory in embedded Pentium MMX or i486-based industrial controllers running real-time OS. IC Role / Device Role / Timing Role: Synchronous pipelined SRAM providing deterministic 3.5 ns read latency and burst-aligned data delivery to CPU bus. Use Value: Eliminates wait states during multi-chip depth expansion, sustaining 166 MHz bus bandwidth across 4× CY7C1366C devices. |
Use Scenario: Temporary storage for ingress/egress packet headers and metadata in Layer 2/L3 switching ASIC interfaces. IC Role / Device Role / Timing Role: Burst-capable SRAM buffering data between asynchronous PHY and synchronous switch fabric clock domains. Use Value: Registered inputs/outputs and 2.5 V VDDQ support clean interfacing with 2.5 V SerDes I/O while maintaining sub-4 ns timing margin. |
| Telecom Line Card Memory | Real-Time DSP Data Buffer |
|
Use Scenario: Frame alignment and header processing buffer in E1/T1 or STM-1 framer modules within carrier-grade access equipment. IC Role / Device Role / Timing Role: Pipelined DCD SRAM acting as time-critical scratchpad for framer microcode execution and payload reassembly. Use Value: ZZ sleep mode reduces standby current to ≤40 mA during idle frames, improving power efficiency without data loss. |
Use Scenario: Coefficient and sample storage for fixed-point FFT engines in radar signal processors operating at 100+ MSPS. IC Role / Device Role / Timing Role: Low-latency, burst-access memory supplying consecutive 36-bit words to parallel MAC units per clock cycle. Use Value: 3-1-1-1 access rate and 166 MHz clock enable four consecutive 36-bit reads in five cycles - matching pipeline depth of TI C6000-class DSPs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3616A-166JCIN | 256K × 36, 166 MHz, but uses single 3.3 V supply (no VDDQ separation); no JTAG; no ZZ sleep mode | Lacks dual-voltage I/O and boundary scan - unsuitable for mixed-voltage or high-reliability test environments | Select only if system uses uniform 3.3 V I/O and JTAG testing is not required. |
| IS61WV25636BLL-166BLI | 256K × 36, 166 MHz, supports 2.5 V/3.3 V VDDQ, but lacks pipelined deselect and ADSP/ADSC dual-strobe architecture | No depth-expansion optimization - requires external wait-state insertion when stacking multiple devices | Prefer when simpler control logic suffices and multi-SRAM depth expansion is not implemented. |
Compared with AS7C3616A-166JCIN and IS61WV25636BLL-166BLI, CY7C1366C-166AXC uniquely combines pipelined deselect, dual-strobe addressing, and JTAG - making it the only choice for Pentium-compatible cache subsystems requiring zero-wait-state scalability and production testability.
Availability
CY7C1366C-166AXC is available at Aetrix Electronics and suitable for telecom line cards, x86-compatible embedded controllers, and high-speed packet buffering systems requiring stable component supply, long-lifecycle support, and Pb-free compliance.
Supply support for CY7C1366C-166AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including synchronous SRAMs for mission-critical infrastructure.
CY7C1366C belongs to the Cypress DCD Sync SRAM product line, engineered specifically for deterministic burst access in CPU cache and networking datapath applications where timing predictability and multi-device scalability are essential.
FAQ
What is the function of the MODE pin on CY7C1366C-166AXC?
The MODE pin selects burst address sequence behavior at power-up or reset: LOW configures Intel Pentium interleaved burst order (0,2,4,6,1,3,5,7), HIGH selects linear order (0,1,2,3,4,5,6,7). This setting is latched internally and remains active until next power cycle or hardware reset - no software register access is involved.
Can CY7C1366C-166AXC operate with only two chip enables?
No - the CY7C1366C-166AXC variant in 100-pin TQFP requires CE1 (active LOW), CE2 (active HIGH), and CE3 (active LOW) for full functionality. CE3 is bonded and functional in this package; omitting CE3 assertion violates timing specifications and may cause unpredictable address decoding or data corruption during depth expansion.
Is VDDQ required to be the same voltage as VDD?
No - VDDQ may be independently set to either 2.5 V or 3.3 V while VDD remains at 3.3 V ±5%. This allows interfacing with 2.5 V processor I/O banks without level shifters. However, VDDQ must be stable before VDD reaches 2.0 V during power-up, per the absolute maximum ratings table in Rev. *O datasheet.
Does the ZZ pin require an external pull-down resistor?
No - the ZZ pin has an internal pull-down resistor (typical 100 kΩ), so it may be left floating for normal operation (logic LOW). An external pull-down is unnecessary and could increase leakage current; only an external pull-up is needed if active-HIGH sleep mode must be asserted under system control.
CY7C1366C-166AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1366C-166AXC FAQ
1.How can I place an order for CY7C1366C-166AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1366C-166AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1366C-166AXC reliable?
The price and inventory of CY7C1366C-166AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1366C-166AXC is usually 5 days.
3.What payment methods are accepted for CY7C1366C-166AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1366C-166AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1366C-166AXC?
CY7C1366C-166AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1366C-166AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1366C-166AXC?
For technical support, including CY7C1366C-166AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1366C-166AXC requirements.
6.How does Aetrix verify that CY7C1366C-166AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1366C-166AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1366C-166AXC meets industry standards.
7.What is the process for return or replacement of CY7C1366C-166AXC?
All CY7C1366C-166AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1366C-166AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1366C-166AXC part is unused and in its original packaging.
Return procedure for CY7C1366C-166AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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