Infineon Technologies CY7C1366C-166AXCT
- Part No.:
- CY7C1366C-166AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1366C-166AXCT.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,318
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Product details
Overview
CY7C1366C-166AXCT from Infineon Technologies (formerly Cypress) is a 9-Mbit pipelined synchronous SRAM configured as 256K × 36, operating at 166 MHz with 3.3 V core supply (VDD), 2.5 V/3.3 V I/O supply (VDDQ), and 3.5 ns clock-to-output delay. It supports Intel Pentium™-compatible interleaved or linear burst sequences and is used in high-speed secondary cache subsystems for embedded processors and communications controllers.
For engineers reviewing the CY7C1366C-166AXCT datasheet, CY7C1366C-166AXCT pinout, CY7C1366C-166AXCT application, or CY7C1366C-166AXCT equivalent, key selection criteria include burst mode configurability (MODE pin), triple chip enable architecture (CE1/CE2/CE3), registered synchronous interface timing, and TQFP-100 Pb-free packaging compatibility with depth-expansion designs.
Technical Context
This SRAM implements a fully synchronous, pipelined interface with dual address strobes (ADSP/ADSC), on-chip two-bit burst counter, and user-selectable burst order via MODE pin. All address, data, and control inputs are registered on the rising edge of CLK, enabling deterministic timing at 166 MHz.
It features asynchronous OE and ZZ controls, synchronous byte-write capability via BWx/BWE/GW, and pipelined output enable register to eliminate wait states during depth expansion. The device uses separate VDD (3.3 V ±5%/+10%) and VDDQ (2.5 V or 3.3 V) supplies with JEDEC JESD8-5-compatible I/Os.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36 organization) |
| Max Clock Frequency | 166 MHz - enables 166 MT/s burst throughput with 3-1-1-1 access rate |
| Access Time (tCO) | 3.5 ns - guaranteed clock-to-output delay for timing-critical cache interfaces |
| VDD Supply Range | 3.3 V ±5% / +10% - supports industrial-grade core voltage tolerance |
| VDDQ Supply Options | 2.5 V or 3.3 V - allows interoperability with mixed-voltage processor buses |
| Burst Mode Control | MODE pin selects Intel Pentium™ interleaved or linear burst sequence |
| Power Dissipation | 180 mA max operating current - defines thermal budget for dense cache modules |
Pinout & Package
Package: 100-pin Pb-free Thin Quad Flat Package (TQFP), 14 × 20 × 1.4 mm, with 3 chip enables (CE1, CE2, CE3) and IEEE 1149.1 JTAG boundary scan support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Rising-edge-triggered master clock for all registered inputs/outputs and burst counter increment |
| ADSP / ADSC | Address strobe inputs | Asynchronous-selective address capture: ADSP prioritized over ADSC for processor-initiated accesses |
| ADV | Burst advance control | Active-LOW signal that increments internal two-bit burst counter during burst cycles |
| CE1, CE2, CE3 | Chip enable inputs | CE1 (active-LOW), CE2 (active-HIGH), CE3 (active-LOW): enable hierarchical depth expansion without wait states |
| OE | Asynchronous output enable | Active-LOW tristate control for DQ/DQP I/Os; masked during first read cycle after deselect |
| ZZ | Asynchronous sleep mode | Active-HIGH entry into low-power sleep with data retention; internal pull-down ensures safe default LOW state |
| BWA–BWD, BWE, GW | Byte write controls | Four independent byte write enables + global write: enables flexible partial-word writes per clock cycle |
| DQA–DQD, DQPA–DQPD | Bidirectional data I/O | 36-bit data bus (32 data + 4 parity) with synchronous registration and VDDQ-referenced output drivers |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined DCD architecture | Eliminates deselect penalty in depth-expanded systems via delayed output buffer disable |
| User-selectable burst mode | MODE pin configures Intel Pentium™ interleaved or linear burst addressing for processor alignment |
| Separate VDD/VDDQ supplies | Enables coexistence with 2.5 V or 3.3 V I/O domains while maintaining 3.3 V core stability |
| IEEE 1149.1 JTAG support | Full boundary-scan testability on 100-pin TQFP package for production-level board validation |
| Asynchronous ZZ sleep mode | Reduces standby current to ≤40 mA while preserving memory contents without external refresh |
Applications
| Secondary Cache for x86 Processors | Network Packet Buffering |
|---|---|
|
Use Scenario: High-bandwidth L2 cache for Intel Pentium™-class embedded CPUs in telecom baseband processing units. IC Role / Device Role / Timing Role: Pipelined synchronous SRAM providing 166 MT/s burst reads/writes with zero-wait-state depth expansion across multiple devices. Use Value: Enables full utilization of processor burst bandwidth without pipeline stalls, directly supporting 3-1-1-1 access pattern. |
Use Scenario: Temporary storage for variable-length packet headers and metadata in Layer 2/3 switching ASICs. IC Role / Device Role / Timing Role: Low-latency, burst-capable buffer interfacing with 32-bit/36-bit wide switch fabric controllers. Use Value: 3.5 ns tCO and registered interface ensure deterministic timing closure in multi-Gbps packet forwarding paths. |
| Industrial Motion Controller Memory | Radar Signal Processing Buffer |
|
Use Scenario: Real-time trajectory lookup table storage in servo drive firmware executing closed-loop position updates at 20 kHz. IC Role / Device Role / Timing Role: Deterministic-access SRAM holding interpolated motion profiles accessed via burst reads synchronized to system clock. Use Value: Synchronous self-timed writes and byte-select capability allow atomic update of profile segments without bus contention. |
Use Scenario: Intermediate storage for FFT coefficient buffers in automotive radar ECU preprocessing pipelines. IC Role / Device Role / Timing Role: High-reliability, low-jitter memory staging raw ADC samples before DSP engine ingestion. Use Value: Neutron soft error immunity and ZZ sleep mode support fail-safe operation during radar idle intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102432BLL-166BLI | 1024K × 32 organization, 3.3 V only VDDQ, no ZZ sleep mode, no JTAG | Lacks burst mode selection and sleep mode; suited for simpler cache-less buffering | Select when burst flexibility and ultra-low standby power are not required |
| AS7C31026B-166PCN | 1M × 36 organization, 3.3 V core/I/O, no ADV/ADSC dual-strobe support, no MODE pin | Fixed linear burst only; lacks processor/controller address strobe differentiation | Select when interfacing with legacy controllers requiring basic synchronous SRAM without advanced burst control |
Compared with IS61WV102432BLL-166BLI and AS7C31026B-166PCN, the CY7C1366C-166AXCT uniquely delivers configurable burst sequencing, triple CE depth expansion, and integrated JTAG testability-critical for complex cache subsystems requiring design-for-test and multi-processor timing alignment.
Availability
CY7C1366C-166AXCT is available at Aetrix Electronics and suitable for secondary cache subsystems, network packet buffering, industrial motion controller memory, and radar signal processing buffers requiring stable component supply and long-term industrial lifecycle support.
Supply support for CY7C1366C-166AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the full legacy SRAM portfolio, including high-performance synchronous devices for industrial, automotive, and communications infrastructure.
This part belongs to the Cypress DCD Sync SRAM product line, designed specifically for deterministic, high-throughput cache and buffer applications in systems demanding sub-4 ns access, burst configurability, and robust signal integrity at 166 MHz.
FAQ
What is the function of the MODE pin on CY7C1366C-166AXCT?
The MODE pin selects between Intel Pentium™-compatible interleaved burst addressing and linear burst addressing. It is sampled at power-up or reset to configure the internal two-bit burst counter's wraparound sequence. This enables direct compatibility with both legacy x86 processors and newer controllers using sequential access patterns, without requiring external logic or firmware reconfiguration.
Does CY7C1366C-166AXCT support 2.5 V-only I/O operation?
Yes. The device supports 2.5 V VDDQ operation with full AC/DC specifications met, including 3.5 ns tCO and 166 MHz maximum frequency. VDDQ must be decoupled independently from VDD, and all I/O pins (DQ/DQP, BWx, OE, etc.) are JESD8-5 compliant at 2.5 V, enabling seamless integration with 2.5 V processor buses while maintaining 3.3 V core stability.
How does the pipelined enable register improve depth expansion performance?
The pipelined enable register delays output buffer disable by one clock cycle after chip deselect, allowing consecutive burst transfers across multiple devices without inserting wait states. This eliminates the traditional "deselect penalty" in stacked SRAM configurations, enabling true 3-1-1-1 access rates across depth-expanded banks-critical for sustaining peak bandwidth in cache subsystems.
Is JTAG boundary scan functional on the 100-pin TQFP package?
Yes. The 100-pin TQFP package (suffix 'XCT') includes full IEEE 1149.1 JTAG support with dedicated TCK, TMS, TDI, and TDO pins. Boundary scan is enabled by default and supports chain testing of solder joints and interconnects. The JTAG feature can be disabled via instruction if required for security or pin multiplexing, but remains active out-of-box for production test readiness.
CY7C1366C-166AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1366C-166AXCT FAQ
1.How can I place an order for CY7C1366C-166AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1366C-166AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1366C-166AXCT reliable?
The price and inventory of CY7C1366C-166AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1366C-166AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1366C-166AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1366C-166AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1366C-166AXCT?
CY7C1366C-166AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1366C-166AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1366C-166AXCT?
For technical support, including CY7C1366C-166AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1366C-166AXCT requirements.
6.How does Aetrix verify that CY7C1366C-166AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1366C-166AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1366C-166AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1366C-166AXCT?
All CY7C1366C-166AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1366C-166AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1366C-166AXCT part is unused and in its original packaging.
Return procedure for CY7C1366C-166AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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