Infineon Technologies CY7C1366C-166BGCT

Overview

CY7C1366C-166BGCT from Cypress Semiconductor is a 9-Mbit pipelined synchronous SRAM configured as 256K × 36, operating at 166 MHz with 3.3 V core (VDD) and 2.5 V/3.3 V I/O (VDDQ) supplies, supporting Intel Pentium™-compatible interleaved or linear burst sequences in high-speed cache subsystems.

For engineers reviewing the CY7C1366C-166BGCT datasheet, CY7C1366C-166BGCT pinout, CY7C1366C-166BGCT application, or CY7C1366C-166BGCT equivalent, key selection criteria include pipelined DCD timing, dual-voltage I/O compatibility, JTAG boundary-scan support, and depth-expansion capability without wait states.

Technical Context

This SRAM implements a two-bit synchronous wraparound burst counter, registered address/data/write control inputs, and pipelined output enable logic to enable zero-wait-state depth expansion. All synchronous signals-including ADSP, ADSC, ADV, CE1–CE3, BWx, BWE, GW, and CLK-are sampled on the rising edge of CLK.

The device supports both processor-initiated (ADSP) and controller-initiated (ADSC) accesses, asynchronous OE and ZZ controls, and self-timed synchronous writes with byte-selectable (BWA–BWD) or global (GW) write enable. It integrates IEEE 1149.1 JTAG boundary scan for BGA package variants.

Key Specifications

Pinout & Package

Package: 119-ball BGA (14 × 22 × 2.4 mm), Pb-free, with 2 chip enables (CE1, CE2), no CE3; includes dedicated TDI/TDO/TCK/TMS pins for JTAG.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IS61WV102436BLL-166TQLI and 21L010-166JG, CY7C1366C-166BGCT uniquely combines BGA density, dual-voltage I/O, and IEEE 1149.1 testability-making it optimal for space-constrained, high-reliability industrial and networking applications requiring production test scalability.

Availability

CY7C1366C-166BGCT is available at Aetrix Electronics and suitable for Intel Pentium™ cache subsystems, high-performance network controller buffers, and industrial PLC motion control memory requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY7C1366C-166BGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC® programmable systems-on-chip, and USB-C/USB-PD solutions.

The CY7C1366C belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-mode cache and buffer applications in computing, networking, and real-time industrial control systems.

FAQ

What is the function of the MODE pin on CY7C1366C-166BGCT?

The MODE pin selects between Intel Pentium™-compatible interleaved burst addressing (MODE = LOW) and linear burst addressing (MODE = HIGH). It is sampled synchronously on the rising edge of CLK during the initial address strobe (ADSP or ADSC) and determines the internal burst counter sequence for subsequent addresses in a burst cycle.

Does CY7C1366C-166BGCT support true 2.5 V I/O operation?

Yes. The device supports 2.5 V operation on VDDQ (I/O power supply) while maintaining 3.3 V on VDD (core supply). All I/O pins-including DQ, DQP, and control signals-are JEDEC JESD8-5 compliant at 2.5 V, ensuring correct logic thresholds, drive strength, and signal integrity in mixed-voltage systems.

How does the "double-cycle deselect" feature improve system performance?

When the device is deselected (e.g., CE1 deasserted), the pipelined output enable register holds the output buffers active for one additional clock cycle. This allows the next memory device in a depth-expanded bank to begin driving the bus without inserting a wait state-preserving continuous 166 MHz burst throughput across multiple devices.

Is JTAG functionality available on the CY7C1366C-166BGCT package?

Yes. The 119-ball BGA package includes dedicated TDI, TDO, TCK, and TMS pins and fully implements IEEE 1149.1 boundary-scan. JTAG is enabled by default and can be disabled via the instruction register if needed-providing full interconnect test coverage for high-density PCB assemblies.