Infineon Technologies CY7C1367C-166AXC
- Part No.:
- CY7C1367C-166AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1367C-166AXC.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,893
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Product details
Overview
CY7C1367C-166AXC from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous pipelined SRAM configured as 512K × 18, operating at 166 MHz with 3.3 V core supply (VDD), 2.5 V/3.3 V I/O supply (VDDQ), and 3.5 ns clock-to-output delay. It implements registered address/data paths, synchronous self-timed writes, and user-selectable Intel Pentium™-compatible interleaved or linear burst sequences. It is used in high-speed secondary cache subsystems for x86-compatible embedded controllers.
For engineers reviewing the CY7C1367C-166AXC datasheet, CY7C1367C-166AXC pinout, CY7C1367C-166AXC application, or CY7C1367C-166AXC equivalent, key selection criteria include burst mode flexibility, depth-expansion support without wait states, JTAG boundary-scan compliance, ZZ sleep mode behavior, and dual-voltage I/O compatibility for mixed-signaling environments.
Technical Context
This SRAM uses a positive-edge-triggered CLK to register all synchronous inputs-including ADSP/ADSC address strobes, ADV, CE1–CE3, BWx, BWE, GW, and MODE-and drives outputs through registered output buffers. Its two-bit internal burst counter generates sequential addresses during burst reads/writes, with wraparound behavior controlled by the MODE pin state.
The device supports both processor-initiated (ADSP) and controller-initiated (ADSC) access protocols, with priority given to ADSP when both are asserted. Pipelined enable logic delays output buffer disable by one cycle during deselect, enabling seamless depth expansion across multiple devices without performance penalty.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (512K × 18 organization) |
| Max Clock Frequency | 166 MHz - enables 166 MT/s sustained throughput in pipelined mode |
| Access Time | 3.5 ns - clock-to-output delay at 166 MHz, critical for tight timing budgets |
| Core Supply Voltage | 3.3 V ±5% (VDD) - defines core logic voltage domain and power integrity requirements |
| I/O Supply Voltage | 2.5 V or 3.3 V (VDDQ) - allows interface to either 2.5 V or 3.3 V system buses |
| Burst Mode Control | User-selectable via MODE pin - selects Intel Pentium™ interleaved or linear address sequence |
| Sleep Mode | ZZ pin active-HIGH - reduces standby current to ≤40 mA while preserving data |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, with three chip enables (CE1, CE2, CE3) and full JTAG (TCK/TMS/TDI/TDO) support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Positive-edge-triggered master clock synchronizing all registered inputs and outputs |
| ADSP / ADSC | Address strobe inputs | Asynchronous initiation signals sampled on CLK edge; ADSP takes precedence over ADSC |
| ADV | Burst advance control | Active-LOW signal that increments internal burst counter on rising CLK edge |
| CE1, CE2, CE3 | Chip enable inputs | CE1 (active-LOW), CE2 (active-HIGH), CE3 (active-LOW); enable depth expansion with no wait states |
| OE | Output enable | Asynchronous, active-LOW control of DQ/DQP direction; tristates outputs when HIGH |
| ZZ | Sleep mode control | Asynchronous, active-HIGH entry into low-power retention mode with data integrity preserved |
| DQ A–D / DQP A–D | Data I/O lines | 18-bit bidirectional data bus (16 data + 2 parity); direction controlled by OE, registered on CLK |
| MODE | Burst sequence selector | Sampled at power-up or reset; determines interleaved vs. linear burst address order |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined DCD architecture | Enables 3-1-1-1 access rate - delivers first word in 3 clocks, subsequent words every 1 clock |
| Depth-expansion support | Eliminates wait states across multiple SRAMs using CE1–CE3 sequencing and pipelined enable register |
| Byte-write granularity | Four independent byte write enables (BWA–BWD) + global write (GW) for flexible memory update control |
| JTAG boundary scan | IEEE 1149.1-compliant test infrastructure supporting production board-level validation and debug |
| Dual-voltage I/O | VDDQ configurable for 2.5 V or 3.3 V operation - simplifies integration into mixed-voltage SoC interfaces |
Applications
| High-Performance x86 Cache | Industrial Motion Controller Memory |
|---|---|
|
Use Scenario: Secondary cache buffer between Pentium-class CPU and main DRAM in ruggedized industrial PCs. IC Role / Device Role / Timing Role: Synchronous burst-access SRAM providing deterministic 3.5 ns read latency and pipelined write response. Use Value: Enables full 166 MHz bus utilization with zero-wait-state depth expansion across four devices using CE1–CE3. |
Use Scenario: Real-time instruction and parameter storage in servo drive firmware executing position-loop algorithms. IC Role / Device Role / Timing Role: Low-latency, jitter-free memory for time-critical motion profile lookups and interrupt service routines. Use Value: ZZ sleep mode reduces idle power to ≤40 mA while retaining configuration during motor standstill phases. |
| Telecom Line Card Buffer | Avionics Data Acquisition Buffer |
|
Use Scenario: Packet buffering in multi-port Ethernet line cards requiring burst-aligned access for DMA engines. IC Role / Device Role / Timing Role: Interleaved-burst SRAM interfacing directly to FPGA-based packet processors with ADSP/ADSC protocol support. Use Value: MODE-selectable burst order ensures compatibility with both legacy i486 and modern FPGA DMA controllers. |
Use Scenario: High-integrity sensor data staging in flight control computers where data retention during brownout is mandatory. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM with neutron soft error immunity, used for pre-flight calibration table storage. Use Value: Asynchronous ZZ sleep and OE enable deterministic power-down sequencing without data loss during voltage sag events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-166BIN | Same 512K × 18 density and 166 MHz speed, but uses single 3.3 V supply (no VDDQ separation); lacks JTAG and ZZ sleep | Targeted at cost-sensitive consumer electronics; not suitable for mixed-voltage or test-critical systems | Select only if JTAG, dual-VDDQ, or low-power sleep are not required |
| IS61WV51218BLL-166BLI | 166 MHz, 512K × 18, but asynchronous output enable and no pipelined enable register; higher 5.5 ns access time | Used in simpler microcontroller-based systems without depth expansion or strict timing closure needs | Choose only when system does not require zero-wait-state multi-SRAM expansion or sub-4 ns read latency |
Compared with AS7C362000B-166BIN and IS61WV51218BLL-166BLI, the CY7C1367C-166AXC uniquely combines JTAG testability, dual-voltage I/O, ZZ sleep, and pipelined depth expansion-making it the only option for safety-critical or high-assurance embedded cache designs requiring traceable validation and power-aware operation.
Availability
CY7C1367C-166AXC is available at Aetrix Electronics and suitable for high-speed secondary cache, industrial motion control, telecom line card buffering, and avionics data acquisition requiring stable component supply and long-term lifecycle support.
Supply support for CY7C1367C-166AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for the former Cypress SRAM portfolio.
This device belongs to Infineon's high-performance synchronous SRAM product line, designed specifically for deterministic, low-latency memory subsystems in x86-compatible and real-time embedded computing platforms.
FAQ
What is the function of the MODE pin, and how is it sampled?
The MODE pin selects burst address sequence: LOW enables Intel Pentium™-compatible interleaved addressing, HIGH selects linear addressing. It is sampled only at power-up or hardware reset-not dynamically during operation-and latches the burst mode for the device's entire runtime until next reset.
Can CY7C1367C-166AXC operate with VDDQ = 2.5 V while VDD = 3.3 V?
Yes. The device is explicitly rated for simultaneous 3.3 V core supply (VDD) and 2.5 V I/O supply (VDDQ). This dual-supply operation is validated per JEDEC JESD8-5 and supports direct interfacing to 2.5 V FPGAs or ASICs without level shifters.
How does the pipelined enable register improve depth expansion?
The pipelined enable register delays output buffer disable by one clock cycle after chip deselect. This eliminates the need for wait states when chaining multiple CY7C1367C devices using CE1–CE3, allowing continuous burst transfers across device boundaries at full 166 MHz throughput.
Is JTAG boundary scan functional in ZZ sleep mode?
No. JTAG operation requires the device to be fully powered and active. When ZZ is asserted HIGH, the TAP controller and boundary-scan logic are disabled. JTAG testing must be performed in normal operation mode with ZZ held LOW or floating.
CY7C1367C-166AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1367C-166AXC FAQ
1.How can I place an order for CY7C1367C-166AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1367C-166AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1367C-166AXC reliable?
The price and inventory of CY7C1367C-166AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1367C-166AXC is usually 5 days.
3.What payment methods are accepted for CY7C1367C-166AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1367C-166AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1367C-166AXC?
CY7C1367C-166AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1367C-166AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1367C-166AXC?
For technical support, including CY7C1367C-166AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1367C-166AXC requirements.
6.How does Aetrix verify that CY7C1367C-166AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1367C-166AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1367C-166AXC meets industry standards.
7.What is the process for return or replacement of CY7C1367C-166AXC?
All CY7C1367C-166AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1367C-166AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1367C-166AXC part is unused and in its original packaging.
Return procedure for CY7C1367C-166AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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