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Infineon Technologies CY7C1367C-166AXCT
- Part No.:
- CY7C1367C-166AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1367C-166AXCT.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,376
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Product details
Overview
CY7C1367C-166AXCT from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous pipelined SRAM with 512K × 18 organization, supporting 166 MHz bus operation, 3.3 V core supply (VDD), and dual I/O voltage support (2.5 V/3.3 V via VDDQ). It features registered inputs/outputs, IEEE 1149.1 JTAG boundary scan, and is packaged in Pb-free 100-pin TQFP for high-performance cache applications in embedded controllers and communications processors.
For engineers reviewing the CY7C1367C-166AXCT datasheet, CY7C1367C-166AXCT pinout, CY7C1367C-166AXCT application, or CY7C1367C-166AXCT equivalent, key selection criteria include burst mode configuration (linear vs. interleaved), depth-expansion capability without wait states, pipelined deselect timing, byte-write granularity control (BWA–BWD + BWE), and ZZ sleep-mode power management.
Technical Context
This SRAM implements a two-bit synchronous wraparound burst counter controlled by ADV, ADSP, and ADSC signals, enabling Intel Pentium™-compatible interleaved or user-selectable linear burst sequences via the MODE pin. All address, data, and control inputs are registered on the rising edge of CLK, while OE and ZZ remain asynchronous.
The device integrates pipelined enable logic that delays output buffer disable by one clock cycle during deselect-enabling seamless depth expansion across multiple devices without performance penalty. Synchronous self-timed writes support 1–4 byte widths via BWx and BWE, with global write (GW) overriding byte enables to write all 18 bits simultaneously.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (512K × 18), enabling compact high-bandwidth cache storage for 16/32-bit processor interfaces. |
| Max Clock Frequency | 166 MHz - defines maximum sustained burst throughput of up to 166 million transfers per second. |
| Access Time | 3.5 ns - clock-to-output delay at 166 MHz, critical for meeting tight timing budgets in secondary cache paths. |
| VDD Supply Range | 3.3 V ±5% - core voltage tolerance ensuring stable operation under regulated system rail conditions. |
| VDDQ Range | 2.5 V or 3.3 V - allows direct interfacing with both 2.5 V and 3.3 V I/O domains without level shifters. |
| Burst Mode Control | User-selectable via MODE pin - selects Intel Pentium™-interleaved or linear addressing sequence for processor compatibility. |
| Power Dissipation | 180 mA max operating current - enables thermal-aware board layout in dense memory subsystems. |
Pinout & Package
Packaged in Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 × 20 × 1.4 mm, with 0.5 mm pitch. Pinout validated per Cypress document 38-05542 Rev. *O (pages 4–6).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master clock synchronizing all register inputs, burst counter, and output registers. |
| ADSP / ADSC | Address strobe (processor/controller) | Asynchronous initiation of address capture; ADSP takes priority when both asserted - supports dual-bus architectures. |
| ADV | Burst advance control | Active-LOW signal incrementing internal 2-bit counter to generate next burst address without external logic. |
| BWA–BWD, BWE, GW | Byte write controls | Enables 1–4 byte-wide writes (18-bit data bus); GW forces full-word write independent of BWx states. |
| CE1, CE2, CE3 | Chip enable inputs | Three-level hierarchical chip select (CE1 active-LOW, CE2 active-HIGH, CE3 active-LOW) for depth expansion. |
| OE | Asynchronous output enable | Tristates DQ/DQP pins immediately when HIGH; masked during first read clock after deselect to prevent bus contention. |
| ZZ | Asynchronous sleep control | Active-HIGH entry into low-power "sleep" mode with data retention; internal pull-down ensures safe default LOW state. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined deselect | Output buffers remain enabled one extra clock cycle during chip deselect - eliminates wait states in depth-expanded configurations. |
| Dual I/O voltage support | VDDQ configurable for 2.5 V or 3.3 V - enables interoperability with mixed-voltage SoCs and FPGAs without external translators. |
| JTAG boundary scan | IEEE 1149.1-compliant test interface - supports production ICT, board-level debug, and solder-joint integrity verification. |
| User-selectable burst mode | MODE pin selects Pentium™-interleaved or linear burst order - ensures compatibility with legacy and modern processor buses. |
| Synchronous self-timed writes | On-chip write timing generation - removes dependency on external write-strobe matching, simplifying controller design. |
Applications
| Processor Cache Interface | Communications Packet Buffer |
|---|---|
|
Use Scenario: Secondary cache between ARM Cortex-A9 MPCore and DDR2 memory controller in baseband processing unit. IC Role / Device Role / Timing Role: High-speed synchronous SRAM providing deterministic 3.5 ns read latency and burst-aligned data delivery to match processor pipeline stages. Use Value: Eliminates wait states during 4-word burst reads due to pipelined enable and registered outputs, sustaining 166 MT/s throughput. |
Use Scenario: Temporary packet buffering in 10-Gbps Ethernet line card with multi-core network processor. IC Role / Device Role / Timing Role: Depth-expandable SRAM bank implementing FIFO-like behavior with synchronized write-enable and burst-address generation. Use Value: ADV-controlled burst counter and CE1/CE2/CE3 hierarchy allow scalable 18-bit-wide buffer expansion across four devices without glue logic. |
| Industrial PLC Memory Module | Avionics Data Acquisition Buffer |
|
Use Scenario: Real-time I/O mapping and instruction caching in ruggedized programmable logic controller with extended temperature range requirements. IC Role / Device Role / Timing Role: Nonvolatile-retentive cache using ZZ sleep mode during idle cycles to reduce system power by >70% versus active standby. Use Value: 40 mA CMOS standby current and internal ZZ pull-down ensure fail-safe low-power entry without external biasing circuitry. |
Use Scenario: High-integrity sensor data staging in DO-254-compliant flight control computer with radiation-hardened design constraints. IC Role / Device Role / Timing Role: JTAG-enabled SRAM supporting boundary-scan test coverage for traceable hardware verification and field diagnostics. Use Value: IEEE 1149.1 compliance enables 100% interconnect test coverage on densely routed avionics PCBs per DO-160E Section 22. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C36256B-166JCIN | 512K × 18, 166 MHz, but lacks JTAG, ZZ sleep, and ADV-controlled burst counter; uses simpler single CE architecture. | Not suitable for depth-expanded systems requiring pipelined deselect or JTAG testability; limited to single-device implementations. | Select only if JTAG, low-power sleep, or multi-SRAM expansion are not required - lower cost but reduced system integration flexibility. |
| IS61WV51218BLL-166TQLI | 512K × 18, 166 MHz, supports ZZ sleep and 2.5/3.3 V I/O, but no JTAG and no ADSP/ADSC dual-strobe interface. | Cannot replace CY7C1367C in Pentium™-compatible or controller-processor dual-bus systems requiring separate address strobes. | Prefer where simple synchronous interface suffices and JTAG test access or dual-strobe timing is unnecessary - higher availability in distribution. |
Compared with AS7C36256B-166JCIN and IS61WV51218BLL-166TQLI, CY7C1367C-166AXCT uniquely delivers JTAG testability, dual-strobe address capture (ADSP/ADSC), and pipelined enable for zero-wait-state depth expansion - making it irreplaceable in high-integrity, multi-SRAM cache subsystems.
Availability
CY7C1367C-166AXCT is available at Aetrix Electronics and suitable for processor cache interfaces, communications packet buffering, industrial PLC memory modules, and avionics data acquisition buffers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1367C-166AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical support, and long-term supply commitment for legacy Cypress memory and microcontroller portfolios.
CY7C1367C belongs to the DCD Sync SRAM product line, designed specifically for high-performance, low-latency secondary cache and buffer applications in communications infrastructure, industrial automation, and aerospace computing systems.
FAQ
What is the function of the MODE pin on CY7C1367C-166AXCT?
The MODE pin selects burst address sequencing: logic LOW configures Intel Pentium™-compatible interleaved burst order (0, 2, 4, 6, 1, 3, 5, 7), while HIGH enables linear order (0, 1, 2, 3, 4, 5, 6, 7). This setting is sampled at power-up or reset and remains static during operation unless reconfigured externally.
Can CY7C1367C-166AXCT operate with only 2.5 V I/O supply (VDDQ) while maintaining full 166 MHz performance?
Yes - the device fully supports 2.5 V VDDQ at 166 MHz, with guaranteed 3.5 ns clock-to-output timing and compliant AC/DC electrical characteristics per datasheet Table 11 (2.5 V TAP AC Test Conditions). VDD must remain at 3.3 V ±5% regardless of VDDQ choice.
How does the ZZ pin behave during power-up, and is external pull-down required?
The ZZ pin has an internal pull-down resistor; therefore, it defaults to LOW (active) during power-up, ensuring normal operation without external components. Asserting ZZ HIGH places the device in low-power sleep mode with data retention, drawing ≤40 mA standby current.
Is JTAG boundary scan functional when the device is in ZZ sleep mode?
No - JTAG operation is disabled in ZZ sleep mode. The TAP controller halts, and TDI/TDO/TCK/TMS pins become high-impedance. Boundary scan functionality resumes only after ZZ returns LOW and the device exits sleep, requiring at least one valid CLK cycle before scan operations may proceed.
CY7C1367C-166AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1367C-166AXCT FAQ
1.How can I place an order for CY7C1367C-166AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1367C-166AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1367C-166AXCT reliable?
The price and inventory of CY7C1367C-166AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1367C-166AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1367C-166AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1367C-166AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1367C-166AXCT?
CY7C1367C-166AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1367C-166AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1367C-166AXCT?
For technical support, including CY7C1367C-166AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1367C-166AXCT requirements.
6.How does Aetrix verify that CY7C1367C-166AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1367C-166AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1367C-166AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1367C-166AXCT?
All CY7C1367C-166AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1367C-166AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1367C-166AXCT part is unused and in its original packaging.
Return procedure for CY7C1367C-166AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1367C-166AXCT Tags
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