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Infineon Technologies CY7C1368C-166AXC

Part No.:
CY7C1368C-166AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1368C-166AXC.pdf
Description:
IC SRAM 8MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,097

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Product details

Overview

CY7C1368C-166AXC from Cypress Semiconductor is a 9-Mbit (256K × 32) pipelined synchronous SRAM with registered I/O, 3.3V core/2.5V–3.3V I/O supplies, 3.5 ns max access time at 166 MHz, and JEDEC-standard 100-pin TQFP packaging. It serves as high-speed secondary cache memory in Pentium-class processor systems requiring burst-mode support and depth expansion without wait states.

For engineers reviewing the CY7C1368C-166AXC datasheet, CY7C1368C-166AXC pinout, CY7C1368C-166AXC application, or CY7C1368C-166AXC equivalent, key selection criteria include synchronous burst timing (interleaved/linear), double-cycle deselect behavior, byte-write granularity (BWA–BWD + BWE), 3-chip-enable depth expansion (A version), and ZZ sleep mode compatibility with low-power system states.

Technical Context

The CY7C1368C-166AXC implements a two-bit synchronous wraparound burst counter fed by A[1:0], enabling Intel Pentium interleaved or linear burst sequences selected via the static MODE pin. All address, data, and control inputs (ADSP/ADSC, CE1–CE3, BW[A:D], GW, BWE) are registered on the rising edge of CLK.

It supports dual-address-strobe operation (ADSP for processor-initiated, ADSC for controller-initiated accesses), synchronous self-timed writes, and asynchronous OE/ZZ controls. Output buffers feature pipelined enable logic that delays tri-state assertion by one clock cycle during deselect, preserving throughput in depth-expanded configurations.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (256K × 32 bits); provides full-word parallel access for cache line fills in 32-bit bus architectures.
Max Clock Frequency 166 MHz; enables 3.5 ns clock-to-output timing for deterministic read latency in synchronous pipelines.
Core Supply Voltage 3.3 V ± 0.3 V; powers internal logic and memory array; requires stable low-noise regulation per JEDEC JESD8-5.
I/O Supply Range 2.5 V or 3.3 V; allows direct interface to mixed-voltage SoCs or FPGAs without level shifters.
Burst Mode Control MODE pin selects interleaved (Pentium-compatible) or linear sequence; fixed at power-up, not runtime reconfigurable.
Write Granularity Byte-selectable via BWA–BWD + BWE; GW overrides all selects for full-word write-critical for cache coherency maintenance.
Power Management ZZ pin enables non-time-critical sleep mode with data retention; internal pull-down eliminates external bias requirement.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), JEDEC standard, lead-free (RoHS-compliant). The -166AXC suffix denotes the A version with three chip enables (CE1, CE2, CE3).

Pin Circuit Role Design Meaning
CLK Synchronous clock input Rising-edge-triggered master timing reference for all registered inputs and output registers; governs burst counter increment when ADV is active.
ADSP / ADSC Address strobe inputs ADSP prioritized over ADSC; both capture address and load A[1:0] into burst counter; CE1 must be active for ADSP to function.
CE1, CE2, CE3 Chip enable inputs CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW); enable depth expansion across multiple devices with independent bank control.
BWA–BWD, BWE, GW Write control inputs Byte-write select (BWA–BWD), enable (BWE), and global override (GW); support partial-word writes essential for cache line updates.
OE Asynchronous output enable Active LOW; tri-states DQs immediately when deasserted-enables bus sharing without clock-domain alignment.
ZZ Asynchronous sleep input Active HIGH; places device in low-current retention state (≤40 mA standby); internal pull-down permits floating for normal operation.
DQ[0:31] Bidirectional data I/O Common I/O architecture; direction controlled by OE; automatically tri-stated during any write cycle regardless of OE state.
MODE Burst sequence selector Static strap pin: GND = linear burst, VDD/floating = interleaved burst; must remain stable during operation.

Key Features

Feature Design Value
Double-cycle deselect Output tri-state occurs one clock after deselect assertion-eliminates wait states in multi-SRAM depth expansions.
Pipelined enable register Delays output buffer disable by one clock cycle during deselect, maintaining pipeline continuity in burst-read sequences.
User-selectable burst order Interleaved (Pentium/i486) or linear via MODE pin-enables drop-in compatibility across x86 and custom processor platforms.
Synchronous self-timed writes On-chip write timing control removes external write-pulse generation; simplifies FPGA/CPLD interface logic.
Independent I/O voltage supply (VDDQ) Supports 2.5 V or 3.3 V I/O rails-enables direct connection to legacy or low-voltage peripherals without level translation.
Three-chip-enable architecture CE1/CE2/CE3 allow hierarchical bank decoding for >256K-depth systems while preserving single-cycle address setup.

Applications

Intel Pentium-Based Cache Subsystem Industrial Real-Time Controller Memory

Use Scenario: Secondary cache in embedded Pentium MMX or Celeron-based motion control PLCs operating at 166 MHz bus speed.

IC Role / Device Role / Timing Role: Synchronous burst SRAM providing 32-bit cache line fills with interleaved addressing and sub-4 ns tCO.

Use Value: Eliminates wait states during depth expansion across four CY7C1368C devices using CE1–CE3, sustaining full 166 MHz throughput.

Use Scenario: High-reliability program/data memory in railway signaling controllers requiring extended temperature operation and data retention.

IC Role / Device Role / Timing Role: Nonvolatile-configurable SRAM with ZZ sleep mode for power-gating during idle intervals without data loss.

Use Value: 40 mA max CMOS standby current at 166 MHz ensures <50 mW quiescent power in fanless enclosures.

Network Packet Buffering Medical Imaging Frame Store

Use Scenario: Line-rate packet buffering in 10/100 Mbps Ethernet switch ASICs interfacing to FPGA-based traffic managers.

IC Role / Device Role / Timing Role: Pipelined DCD SRAM acting as FIFO buffer with programmable burst depth and byte-write precision for header/body separation.

Use Value: BWA–BWD + BWE enables selective overwrite of packet headers without disturbing payload data in same 32-bit word.

Use Scenario: Real-time DICOM frame storage in portable ultrasound units with ARM-based SoCs and 2.5 V I/O interfaces.

IC Role / Device Role / Timing Role: Low-latency frame buffer supporting 32-bit pixel data writes synchronized to display engine clocks.

Use Value: VDDQ = 2.5 V compatibility eliminates level shifters between SoC and SRAM, reducing BOM count and signal integrity risk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV25632ALL-166BLI 256K × 32, 166 MHz, 3.3 V core/I/O; no ZZ sleep mode; only two chip enables (CE1/CE2); no MODE-selectable burst order. Lacks depth-expansion flexibility and Pentium interleaved burst support; suitable only for linear-burst-only systems. Select when ZZ sleep and 3-CE expansion are unnecessary and cost sensitivity outweighs feature parity.
Microchip 23LC1024-I/P 1 Mbit serial SPI SRAM; 20 MHz max clock; asynchronous interface; no burst capability; 2.7–5.5 V supply. Fundamentally different interface (serial vs. parallel), lower bandwidth, no pipelining-cannot replace in cache or high-speed buffering roles. Consider only for low-pin-count microcontroller systems where parallel bus resources are unavailable and latency tolerance >100 ns.

Compared with IS61WV25632ALL-166BLI, the CY7C1368C-166AXC delivers guaranteed Pentium interleaved burst timing and 3-CE depth scalability; versus 23LC1024-I/P, it provides 8× higher effective bandwidth and deterministic sub-4 ns read latency required for real-time cache subsystems.

Availability

CY7C1368C-166AXC is available at Aetrix Electronics and suitable for Intel Pentium-based cache subsystems, industrial real-time controllers, network packet buffering, and medical imaging frame stores requiring stable component supply across extended product lifecycles.

Supply support for CY7C1368C-166AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with expertise in synchronous SRAM, NOR Flash, and PSoC architectures.

The CY7C1368C belongs to Cypress's Pipelined DCD Sync SRAM product line, engineered specifically for low-latency, burst-capable secondary cache and high-speed buffering in x86 and real-time embedded platforms.

FAQ

What is the function of the MODE pin on CY7C1368C-166AXC?

The MODE pin is a static configuration input that selects the burst sequence type: tied to GND for linear burst order, or to VDD/floating for Intel Pentium interleaved burst order. It is sampled at power-up and must remain stable during operation-no runtime switching is supported. The internal pull-up ensures default interleaved behavior if left unconnected.

Can CY7C1368C-166AXC operate with 2.5 V I/O while using 3.3 V core supply?

Yes. The device supports independent VDDQ (2.5 V or 3.3 V) and VDD (3.3 V ± 0.3 V) supplies. This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters, while maintaining full-speed 166 MHz operation and 3.5 ns access timing. VDDQ and VSSQ pins must be decoupled separately per JEDEC layout guidelines.

How does double-cycle deselect improve system performance?

Double-cycle deselect ensures outputs remain valid for one additional clock cycle after chip enable deactivation. This eliminates the need for wait states when chaining multiple CY7C1368C devices in depth-expanded configurations, sustaining continuous burst read throughput across banks without pipeline stalls or external handshaking logic.

Is CE3 available on all CY7C1368C package variants?

No. CE3 is present only on the "A" version (e.g., CY7C1368C-166AXC), packaged in 100-pin TQFP with three chip enables. The "AJ" version omits CE3 and uses only CE1 and CE2. Pinout diagrams in the datasheet (pages 3–4) confirm CE3 is located at pin 92 for the A version and absent in the AJ variant.

CY7C1368C-166AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
8Mbit
Memory Organization:
256K x 32
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1368C-166AXC FAQ

1.How can I place an order for CY7C1368C-166AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1368C-166AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1368C-166AXC reliable?

The price and inventory of CY7C1368C-166AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1368C-166AXC is usually 5 days.

3.What payment methods are accepted for CY7C1368C-166AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1368C-166AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1368C-166AXC?

CY7C1368C-166AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1368C-166AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1368C-166AXC?

For technical support, including CY7C1368C-166AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1368C-166AXC requirements.

6.How does Aetrix verify that CY7C1368C-166AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1368C-166AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1368C-166AXC meets industry standards.

7.What is the process for return or replacement of CY7C1368C-166AXC?

All CY7C1368C-166AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1368C-166AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1368C-166AXC part is unused and in its original packaging.

Return procedure for CY7C1368C-166AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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