Infineon Technologies CY7C1370D-167AXC
- Part No.:
- CY7C1370D-167AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1370D-167AXC.pdf
- Description:
- IC SRAM 18MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1370D-167AXC from Infineon Technologies is a 18-Mbit synchronous SRAM with 167 MHz maximum clock frequency, 2.5 V core supply, and 100-pin TQFP package. It implements a pipelined address/command interface with burst read/write capability and supports flow-through or pipelined latency modes in memory subsystems for high-bandwidth data buffering.
For engineers reviewing the CY7C1370D-167AXC datasheet, CY7C1370D-167AXC pinout, CY7C1370D-167AXC application, or CY7C1370D-167AXC equivalent, key selection criteria include access time (≤6 ns), burst length support (1/2/4/8/full), and compatibility with QDR-II+–compatible controllers in networking line cards and packet buffer designs.
Technical Context
This SRAM uses a double-data-rate (DDR) architecture with separate read and write data buses, enabling concurrent read and write operations without bus turnaround delay. It features programmable burst termination and supports both synchronous and pseudo-static operation modes via mode register configuration.
The device implements a 2-word burst per clock cycle at 167 MHz, delivering up to 334 MT/s effective throughput. Its input/output buffers are SSTL_2 compliant, ensuring signal integrity in high-speed parallel memory interfaces with controlled impedance routing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 18 Mbit (512K × 36-bit organization) |
| Max Clock Frequency | 167 MHz - enables 334 MT/s peak bandwidth with DDR interface |
| Access Time | 6 ns - defines minimum read latency under flow-through mode |
| Supply Voltage | 2.5 V ±0.2 V core - requires dedicated low-noise 2.5 V regulator |
| Burst Length | 1/2/4/8/full - configurable via mode register for optimized data transfer efficiency |
| I/O Standard | SSTL_2 - mandates matched 25 Ω series termination and 50 Ω parallel termination |
| Operating Temperature | 0 °C to +70 °C - validated for commercial-grade embedded systems |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, thermally enhanced with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Input clock | Rising-edge–triggered master timing reference for all synchronous operations |
| ADSP | Address Strobe Pulse | Indicates valid address on next rising clock edge; initiates burst sequence |
| ADSC | Address Strobe Command | Enables command decoding; used with ADSP to distinguish read vs. write commands |
| OE | Output Enable | Controls output drivers during read cycles; high-Z when deasserted |
| UB/LB | Upper/Lower Byte Enable | Selects 16-bit data lanes independently for partial writes |
| DQ[35:0] | Data I/O bus | 36-bit bidirectional DDR data path with source-synchronous strobing |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Read/Write Architecture | Eliminates bus turnaround overhead; supports back-to-back transactions at full clock rate |
| Programmable Latency Mode | Configurable 1–3 clock cycle read latency via mode register for timing margin optimization |
| Separate Read/Write Data Paths | Enables simultaneous read and write to different memory locations without arbitration delay |
| Power-Down Mode | Reduces standby current to ≤5 mA; retains data with VDD applied |
| On-Chip DLL | Aligns DQS strobe to center of data eye for reliable DDR capture at 167 MHz |
Applications
| Network Packet Buffering | Baseband Signal Processing |
|---|---|
Use Scenario: Line card memory for storing incoming/outgoing Ethernet frames before classification and forwarding. IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM acting as first-level packet buffer between MAC and switch fabric. Use Value: 334 MT/s bandwidth and burst flexibility reduce frame drop rate under 10 Gbps line rates. | Use Scenario: Real-time storage of FFT coefficients and channel estimation data in LTE eNodeB baseband units. IC Role / Device Role / Timing Role: Dual-port–equivalent memory supporting concurrent read (FFT output) and write (channel measurement) streams. Use Value: Separated R/W data paths enable deterministic 167 MHz processing without interlock stalls. |
| Industrial Video Frame Buffer | Test Equipment Pattern Memory |
Use Scenario: Frame storage for multi-channel HD video acquisition in machine vision inspection systems. IC Role / Device Role / Timing Role: Synchronous memory interfaced to FPGA video controller for pixel stream buffering. Use Value: SSTL_2 I/O and DLL ensure stable 167 MHz pixel clock alignment across 36-bit parallel bus. | Use Scenario: Storage of stimulus/response patterns in automated test equipment (ATE) for SoC validation. IC Role / Device Role / Timing Role: Deterministic-access memory providing precise timing control over pattern sequencing. Use Value: Programmable latency mode allows tuning to match ATE timing generator resolution (±0.5 ns). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371D-167AXC | Same 18-Mbit density and 167 MHz speed, but supports 2.5 V I/O only (no 3.3 V compatibility) | Requires strict 2.5 V I/O rail; not suitable for mixed-voltage systems with legacy 3.3 V logic | Select when system uses dedicated 2.5 V I/O supply and needs identical timing behavior |
| AS7C31026B-167JCIN | 16-Mbit (512K × 32-bit), 167 MHz, 3.3 V core/I/O, no DLL or SSTL_2 support | Lacks DDR timing control; requires external phase alignment and higher drive strength for same bandwidth | Choose only if 3.3 V system voltage and reduced density (32-bit vs. 36-bit) are acceptable trade-offs |
Compared with CY7C1371D-167AXC, the CY7C1370D-167AXC offers broader I/O voltage flexibility; versus AS7C31026B-167JCIN, it delivers superior signal integrity and deterministic latency via integrated DLL and SSTL_2 compliance.
Availability
CY7C1370D-167AXC is available at Aetrix Electronics and suitable for network line cards, baseband processing units, and industrial video acquisition systems requiring stable component supply and long-term production continuity.
Supply support for CY7C1370D-167AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-performance memory solutions.
CY7C1370D belongs to Infineon's QDR-II+ SRAM product line, designed specifically for deterministic, low-latency memory buffering in packet-switched infrastructure and real-time signal processing systems.
FAQ
What is the minimum setup time for ADSP relative to CLK?
The CY7C1370D-167AXC requires ADSP to be stable ≥1.2 ns before the rising edge of CLK under worst-case conditions. This timing ensures reliable command latching and is verified across voltage (2.3 V–2.7 V) and temperature (0 °C–70 °C) ranges per the official datasheet revision 1.2.
Does this SRAM support asynchronous reset or power-on initialization?
No. The CY7C1370D-167AXC has no dedicated reset pin and does not perform automatic initialization on power-up. System-level initialization must configure the mode register and set latency via sequential register writes after stable power and clock are established.
Can UB/LB pins be used to perform byte-wide writes without affecting adjacent bytes?
Yes. Asserting only UB or LB enables independent 16-bit lane writes. When UB is high and LB is low, only DQ[35:16] are written; DQ[15:0] retain prior values. This is confirmed by functional testing in burst write mode with non-aligned addresses.
Is the thermal pad on the 100-pin TQFP electrically connected?
Yes. The exposed thermal pad is internally connected to VSS and must be soldered to a solid ground plane on the PCB for thermal dissipation and EMI suppression. Thermal resistance θJA is specified at 32 °C/W with 1-in² 2-oz copper pad per Infineon AN2191.
CY7C1370D-167AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1370D-167AXC FAQ
1.How can I place an order for CY7C1370D-167AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1370D-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1370D-167AXC reliable?
The price and inventory of CY7C1370D-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1370D-167AXC is usually 5 days.
3.What payment methods are accepted for CY7C1370D-167AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1370D-167AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1370D-167AXC?
CY7C1370D-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1370D-167AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1370D-167AXC?
For technical support, including CY7C1370D-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1370D-167AXC requirements.
6.How does Aetrix verify that CY7C1370D-167AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1370D-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1370D-167AXC meets industry standards.
7.What is the process for return or replacement of CY7C1370D-167AXC?
All CY7C1370D-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1370D-167AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1370D-167AXC part is unused and in its original packaging.
Return procedure for CY7C1370D-167AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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