Infineon Technologies CY7C1370D-200BZC
- Part No.:
- CY7C1370D-200BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1370D-200BZC.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,497
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Product details
Overview
CY7C1370D-200BZC from Infineon Technologies is a 1-Mbit (64K × 16) synchronous pipelined SRAM with QDR™ II architecture, supporting 200 MHz double-data-rate operation (400 MT/s), 1.8 V core voltage, and differential LVDS clock inputs. It serves as high-bandwidth buffer memory in network packet processing, switch fabric line cards, and telecom baseband subsystems.
For engineers reviewing the CY7C1370D-200BZC datasheet, CY7C1370D-200BZC pinout, CY7C1370D-200BZC application, or CY7C1370D-200BZC equivalent, key selection criteria include QDR-II timing compliance, LVDS clock interface integrity, read/write latency symmetry, and burst-length configurability for deterministic throughput in multi-port memory systems.
Technical Context
This QDR-II SRAM implements separate independent read and write data buses (DQ and WDQ), enabling concurrent access without bus turnaround delay. Its dual-clock architecture uses K and K# for read operations and WCK and WCK# for write operations, each with programmable phase alignment.
The device supports programmable burst lengths of 2, 4, or 8, and features on-die termination (ODT) for both read and write data buses, along with DLL-based internal timing control to maintain setup/hold margins across process-voltage-temperature (PVT) corners.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Mbit (64K × 16) - provides 16-bit-wide data path for efficient word-aligned packet buffering |
| Max Clock Frequency | 200 MHz DDR (400 MT/s) - enables sustained 6.4 GB/s aggregate bandwidth with 16-bit bus |
| Core Voltage | 1.8 V ± 0.1 V - compatible with low-power 1.8 V I/O standards and reduces dynamic power vs. 2.5 V QDR-I |
| Interface Standard | QDR-II compliant - guarantees strict tAC/tHZ/tDS/tDH timing for interoperability with FPGA/ASIC memory controllers |
| Burst Length | Programmable 2/4/8 - allows optimization between latency (short burst) and bandwidth efficiency (long burst) |
| Input/Output Type | Differential LVDS clocks (K/K#, WCK/WCK#), SSTL_18 I/O - ensures noise immunity and signal integrity at 400 MT/s |
Pinout & Package
Package: 165-ball fine-pitch BGA (13 mm × 15 mm, 0.8 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K / K# | Read clock differential pair | Edge-triggered sampling of DQ outputs; K rising edge captures data on DQ bus |
| WCK / WCK# | Write clock differential pair | Edge-triggered sampling of WDQ inputs; WCK rising edge latches write data |
| DQ[15:0] | Read data output bus | LVDS outputs driven on K# falling edge; supports source-synchronous timing with K/K# |
| WDQ[15:0] | Write data input bus | LVDS inputs sampled on WCK rising edge; independent of read data path |
| ADV/LD | Address valid/load strobe | Indicates valid address on AD[15:0]; also loads internal address register for burst start |
| OE# | Output enable (active-low) | Controls DQ driver enable; does not affect internal read operation or latency |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data buses | Eliminates bus contention and turnaround cycles-enables true simultaneous read/write at full bandwidth |
| Programmable ODT | On-die termination resistors (34 Ω, 40 Ω, 50 Ω, 60 Ω, 75 Ω, 150 Ω) configurable per DQ/WDQ group for impedance matching |
| DLL-based internal timing | Dynamic delay-locked loop maintains precise internal timing alignment across PVT variations, ensuring stable tAC and tHZ |
| Write mask capability | Individual byte write enable (BW#) pins allow selective 8-bit writes within 16-bit word-reduces unnecessary data traffic |
| Power-down mode | Standby current ≤ 50 mA at 1.8 V; enters low-power state via CEN# assertion without losing memory contents |
Applications
| Network Switch Fabric Buffer | Telecom Baseband Processing |
|---|---|
Use Scenario: High-speed packet buffering in Layer 2/3 switching ASICs requiring zero-turnaround multi-port memory access. IC Role / Device Role / Timing Role: Dual-port QDR-II SRAM acting as shared buffer between ingress and egress pipelines with deterministic 2-cycle read latency. Use Value: Enables 400 MT/s sustained throughput per port, eliminating arbitration bottlenecks in 10G/25G line cards. |
Use Scenario: Real-time FFT and channel estimation buffers in LTE/5G remote radio units (RRUs) with tight timing constraints. IC Role / Device Role / Timing Role: Low-latency, burst-capable memory for coefficient storage and intermediate result buffering in DSP chains. Use Value: Supports 8-beat bursts at 200 MHz DDR, reducing memory controller overhead and improving MAC-layer scheduling predictability. |
| High-Frequency Trading Engine | Test Equipment Pattern Memory |
Use Scenario: Ultra-low-latency order book update caching in FPGA-accelerated trading platforms where microsecond-level determinism is critical. IC Role / Device Role / Timing Role: Deterministic-access SRAM providing sub-5 ns read cycle time with no wait states under burst load. Use Value: Delivers consistent 2-cycle read latency independent of burst length-critical for time-sensitive market data replay. |
Use Scenario: Vector pattern storage in automated test equipment (ATE) for high-pin-count SoC validation at 400 MT/s. IC Role / Device Role / Timing Role: High-reliability, jitter-tolerant memory interfacing directly with ATE pattern generators using LVDS signaling. Use Value: On-die termination and DLL compensation ensure signal integrity across 16-bit wide DQ bus at full speed, minimizing pattern corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR-II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371D-200BZC | Same 1-Mbit QDR-II die but with 256-ball BGA (17 mm × 17 mm); adds JTAG boundary scan support | Required where IEEE 1149.1 test access is mandated for production board test coverage | Select when JTAG debug/test infrastructure is needed; otherwise identical timing and functionality |
| AS7C31026B-200BIN | Asynchronous SRAM (not QDR-II); 10 ns access time, single-ended CMOS I/O, no burst or differential clocks | Suitable only for non-concurrent, lower-bandwidth control-plane memory-not for data-path buffering | Only consider for cost-sensitive, non-pipelined applications where 400 MT/s throughput and dual-bus concurrency are unnecessary |
Compared with CY7C1370D-200BZC, the CY7C1371D variant adds testability at larger footprint cost, while the AS7C31026B offers simpler interface and lower cost but sacrifices QDR-II's concurrent read/write capability and LVDS noise immunity-making it unsuitable for high-speed data-path roles.
Availability
CY7C1370D-200BZC is available at Aetrix Electronics and suitable for network switch fabric buffers, telecom baseband subsystems, and high-frequency trading hardware requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.
Supply support for CY7C1370D-200BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and high-performance memory-including QDR SRAMs for infrastructure applications.
CY7C1370D belongs to Infineon's legacy Cypress QDR-II SRAM product line, designed specifically for deterministic, high-throughput packet buffering in networking and communications equipment where dual-port concurrency and sub-5 ns read latency are essential.
FAQ
What is the minimum supported burst length for CY7C1370D-200BZC?
The device supports programmable burst lengths of 2, 4, or 8. Burst length is configured via the MODE pin during reset and cannot be changed dynamically. A 2-beat burst yields lowest latency (2-cycle read access), while longer bursts improve bandwidth efficiency for sequential accesses.
Does CY7C1370D-200BZC require external termination resistors?
No. The device integrates programmable on-die termination (ODT) for both DQ and WDQ buses, configurable per byte lane via mode registers. External termination is optional and only recommended if system-level signal integrity analysis indicates insufficient margin with default ODT settings.
Can CY7C1370D-200BZC operate with single-ended clock inputs?
No. The K/K# and WCK/WCK# inputs are strictly differential LVDS. Driving them with single-ended signals violates AC specifications and risks timing violations or metastability. An external LVDS clock buffer or FPGA transceiver with differential output must be used.
Is there a drop-in replacement for CY7C1370D-200BZC with extended temperature range?
Yes: CY7C1370D-200BZI is the industrial-grade version (-40°C to +85°C), pin-compatible and electrically identical except for extended thermal qualification. It shares the same 165-ball BGA package and timing parameters, requiring no PCB or firmware changes.
CY7C1370D-200BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1370D-200BZC FAQ
1.How can I place an order for CY7C1370D-200BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1370D-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1370D-200BZC reliable?
The price and inventory of CY7C1370D-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1370D-200BZC is usually 5 days.
3.What payment methods are accepted for CY7C1370D-200BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1370D-200BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1370D-200BZC?
CY7C1370D-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1370D-200BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1370D-200BZC?
For technical support, including CY7C1370D-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1370D-200BZC requirements.
6.How does Aetrix verify that CY7C1370D-200BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1370D-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1370D-200BZC meets industry standards.
7.What is the process for return or replacement of CY7C1370D-200BZC?
All CY7C1370D-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1370D-200BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1370D-200BZC part is unused and in its original packaging.
Return procedure for CY7C1370D-200BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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