Infineon Technologies CY7C1370DV25-250AXC
- Part No.:
- CY7C1370DV25-250AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1370DV25-250AXC.pdf
- Description:
- IC SRAM 18MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1370DV25-250AXC from Cypress Semiconductor is a 18-Mbit (512 K × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom infrastructure. It supports true back-to-back read/write operations at 250 MHz with zero wait states, features 2.5 V core (VDD) and I/O (VDDQ) supplies, and delivers 2.6 ns clock-to-output timing. Used in packet buffer and cache applications requiring deterministic latency and burst data transfer.
For engineers reviewing the CY7C1370DV25-250AXC datasheet, CY7C1370DV25-250AXC pinout, CY7C1370DV25-250AXC application, or CY7C1370DV25-250AXC equivalent, key selection criteria include pipelined burst capability (linear/interleaved), byte-write control via BWa–BWd, synchronous self-timed writes, JTAG boundary scan compliance, and TQFP-100 package compatibility with ZBT™-legacy systems.
Technical Context
The device implements fully registered synchronous interfaces: all address, control, and data inputs pass through input registers on CLK rising edge; all outputs are latched by output registers on the same edge. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without pipeline stalls.
Internal self-timed output buffer control removes dependency on asynchronous OE for three-state management, while synchronous CEN allows cycle extension without deselection. Burst addressing is determined by MODE strap (interleaved when floating/high, linear when grounded), and write coherency is maintained via on-chip registry and steering logic across four 9-bit data groups (DQa–DQd + DQPa–DQPd).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512 K × 36 configuration) |
| Max Clock Frequency | 250 MHz - enables 250 million transfers per second with no wait states |
| Access Time | 2.6 ns - defines minimum clock-to-valid-output delay for timing-critical buffering |
| Core Supply Voltage | 2.5 V ±0.2 V - powers internal logic and array; requires tight regulation for signal integrity |
| I/O Supply Voltage | 2.5 V ±0.2 V - independently powers DQ/DQP pins to match system bus voltage |
| Burst Order | Selectable linear or interleaved via MODE pin - determines address sequence for burst reads/writes |
| Byte Write Control | Four independent BWa–BWd signals - enable granular 9-bit writes without masking or read-modify-write |
Pinout & Package
Available in JEDEC-standard Pb-free 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch). Pin functions validated per Cypress Document 38-05558 Rev. *G.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Input | Synchronous address bus; sampled on CLK rising edge to select one of 524,288 locations |
| BWa–BWd | Byte Write Select | Active-low synchronous controls for 9-bit data groups (DQa/DQPa through DQd/DQPd) |
| CLK | Clock Input | Rising-edge-triggered master clock; qualified by CEN to gate recognition |
| CEN | Clock Enable | Active-low synchronous signal that extends previous cycle without deselection |
| CE1, CE3 | Chip Enable (Low) | Synchronous active-low enables; used with CE2 (high) for multi-chip bank decoding |
| OE | Output Enable | Asynchronous low-enable; masked during write data phase to prevent bus contention |
| DQa–DQd / DQPa–DQPd | Data I/O / Parity I/O | 36-bit bidirectional data + 4-bit parity; direction controlled by OE and internal logic |
| ADV/LD | Address Counter Control | High advances internal burst counter; low loads new address after deselect |
| MODE | Burst Mode Strap | Static input determining burst order: floating/high = interleaved, grounded = linear |
| ZZ | Deep Sleep Control | Asynchronous entry into low-power sleep mode; reduces standby current to <100 µA |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables unlimited back-to-back read/write operations with zero wait states - eliminates pipeline bubbles in burst-intensive traffic |
| Synchronous Self-Timed Writes | On-chip write timing logic ensures reliable data capture without external write pulse width constraints |
| IEEE 1149.1 JTAG Boundary Scan | Full 119-ball BGA and 100-pin TQFP scan support enables board-level testability and interconnect verification |
| Flexible Burst Ordering | Hardware-selectable linear or interleaved burst via MODE pin - matches legacy ASIC or FPGA controller requirements |
| Low-Power ZZ Sleep Mode | Asynchronous deep-sleep entry reduces ICCSB to <100 µA - critical for power-managed network line cards |
Applications
| Packet Buffering in Switch ASICs | Line-Card Cache Memory |
|---|---|
|
Use Scenario: High-speed Ethernet switch fabric buffers ingress/egress packets at 10 Gbps+ line rates. IC Role / Device Role / Timing Role: Primary burst-access SRAM providing deterministic 2.6 ns read latency and concurrent write capability for header processing pipelines. Use Value: Enables full-rate packet queuing without stall cycles, directly supporting wire-speed forwarding in multi-port switches. |
Use Scenario: Telecom line card stores protocol stack metadata and session state for VoIP and MPLS termination. IC Role / Device Role / Timing Role: Synchronous cache for real-time control plane processors requiring zero-wait-state access to dynamic routing tables. Use Value: Eliminates software overhead from wait-state insertion, reducing jitter in time-sensitive call setup and teardown. |
| Backplane Interface Memory | Network Processor Co-Processor Buffer |
|
Use Scenario: Shared memory between dual-network processors communicating over a parallel 36-bit backplane bus. IC Role / Device Role / Timing Role: Pipelined SRAM acting as coherency-managed message queue with byte-selectable write granularity. Use Value: Supports atomic 9-bit updates to status fields without full-word read-modify-write, preserving bandwidth for payload transfers. |
Use Scenario: Offloading packet classification and filtering tasks from main NPU using dedicated microengine scratchpad. IC Role / Device Role / Timing Role: Low-latency, burst-capable working memory for microcode execution with synchronous clock domain alignment. Use Value: Matches NPU's 250 MHz clock domain natively, avoiding clock-domain-crossing logic and associated timing uncertainty. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V251L15PF | 16-Mbit (512 K × 32), 15 ns access, 3.3 V only, no MODE-selectable burst order | Lacks NoBL™ zero-wait-state operation; requires external wait-state generation in high-frequency designs | Choose only if 3.3 V system integration and lower bandwidth (<100 MHz) are acceptable |
| ISSI IS61WV102436B | 36-Mbit (1 M × 36), 2.5 V, 200 MHz max, no JTAG, no ZZ sleep mode | Higher density but slower clock rate and missing deep-sleep and boundary-scan features | Prefer when capacity >18 Mbit is required and testability/power management are secondary |
Compared with IDT72V251L15PF and IS61WV102436B, CY7C1370DV25-250AXC uniquely delivers 250 MHz zero-wait-state operation with integrated JTAG and ZZ sleep-making it optimal for next-generation telecom line cards where timing determinism, test coverage, and dynamic power scaling are mandatory.
Availability
CY7C1370DV25-250AXC is available at Aetrix Electronics and suitable for packet buffering in Ethernet switches, cache memory in telecom line cards, and backplane interface memory requiring stable component supply across long-lifecycle deployments.
Supply support for CY7C1370DV25-250AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC, and connectivity solutions for industrial and communications markets.
This device belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-bandwidth memory subsystems in networking silicon where bus latency directly impacts system throughput.
FAQ
What is the function of the MODE pin on CY7C1370DV25-250AXC?
The MODE pin selects burst address sequencing: when left floating or tied HIGH, it configures interleaved burst order; when pulled LOW, it selects linear burst order. This setting must remain static during operation and is sampled at power-up or reset. It directly maps to the burst counter logic in the address steering block and cannot be changed dynamically.
How does the ZZ (deep sleep) mode reduce power consumption?
Asserting ZZ asynchronously places the SRAM into deep sleep, disabling internal clocks, array refresh, and I/O drivers. This reduces CMOS standby current to under 100 µA - a 70% reduction versus normal standby - while preserving data in the memory array. Exit is synchronous to the next valid CLK edge after ZZ deassertion.
Can CY7C1370DV25-250AXC operate with only VDD powered and VDDQ unpowered?
No. Both VDD (2.5 V core) and VDDQ (2.5 V I/O) must be within specification before applying CLK or any input signals. Powering only VDD risks latch-up or undefined I/O behavior because DQ/DQP drivers require VDDQ for proper termination and level translation. The datasheet specifies simultaneous ramping and monotonic power sequencing.
Is the ADV/LD pin required for non-burst operations?
ADV/LD is only active during burst sequences. For single-address accesses, it may be held HIGH or LOW with no functional impact. During burst reads/writes, it advances the internal counter when HIGH; when LOW, it loads a new base address - essential for wrapping or restarting bursts after interrupt events.
CY7C1370DV25-250AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 2.6 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1370DV25-250AXC FAQ
1.How can I place an order for CY7C1370DV25-250AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1370DV25-250AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1370DV25-250AXC reliable?
The price and inventory of CY7C1370DV25-250AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1370DV25-250AXC is usually 5 days.
3.What payment methods are accepted for CY7C1370DV25-250AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1370DV25-250AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1370DV25-250AXC?
CY7C1370DV25-250AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1370DV25-250AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1370DV25-250AXC?
For technical support, including CY7C1370DV25-250AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1370DV25-250AXC requirements.
6.How does Aetrix verify that CY7C1370DV25-250AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1370DV25-250AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1370DV25-250AXC meets industry standards.
7.What is the process for return or replacement of CY7C1370DV25-250AXC?
All CY7C1370DV25-250AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1370DV25-250AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1370DV25-250AXC part is unused and in its original packaging.
Return procedure for CY7C1370DV25-250AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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