Infineon Technologies CY7C1370KV33-167AXC
- Part No.:
- CY7C1370KV33-167AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1370KV33-167AXC.pdf
- Description:
- IC SRAM 18MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:250
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Product details
Overview
CY7C1370KV33-167AXC from Cypress Semiconductor is a 18-Mbit (512K × 36) synchronous pipelined SRAM with NoBL™ architecture and on-chip ECC, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 167 MHz with 3.4 ns max access time, supports 3.3 V core and 3.3 V/2.5 V I/O supplies, and delivers zero-wait-state back-to-back read/write operations.
For engineers reviewing the CY7C1370KV33-167AXC datasheet, CY7C1370KV33-167AXC pinout, CY7C1370KV33-167AXC application, or CY7C1370KV33-167AXC equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write granularity (four 9-bit groups), JTAG boundary-scan support, ZZ sleep mode timing, and ECC error correction capability for SER reduction.
Technical Context
This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers clocked by the same edge. The internal NoBL™ logic eliminates bus latency by enabling true consecutive read/write cycles without wait states.
Burst operation is configurable via the MODE strap pin (interleaved or linear), and write sequencing uses synchronous self-timed circuitry with four independent byte-write enables (BWa–BWd) controlling DQa–DQd and corresponding parity pins DQPa–DQPd. ECC encoding/decoding is performed on-chip to detect and correct single-bit errors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 organization) |
| Max Clock Frequency | 167 MHz - enables 167 million full-cycle transactions per second |
| Access Time | 3.4 ns - defines maximum delay from CLK rise to valid DQ output under worst-case conditions |
| VDD / VDDQ | 3.3 V core / 3.3 V or 2.5 V I/O - supports mixed-voltage system interfacing with level-shifting flexibility |
| ECC Support | On-chip single-bit error correction - reduces soft error rate in radiation-prone environments |
| Burst Capability | Linear or interleaved - selected by MODE pin; determines address increment pattern during burst reads/writes |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm) - JEDEC-standard Pb-free footprint compatible with standard SMT reflow |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, JEDEC-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Input | Synchronous inputs sampled on CLK rising edge; select one of 512K addresses in 36-bit word space |
| BWa–BWd | Byte Write Select | Active-low synchronous controls for four 9-bit data/parity groups; enables partial writes without read-modify-write |
| CLK | Clock Input | Rising-edge-triggered master clock; qualified by CEN; drives all internal register transfers |
| CEN | Clock Enable | Active-low synchronous gate for CLK; suspends operation without deselecting device or disrupting pipeline state |
| DQa–DQd / DQPa–DQPd | Data I/O / Parity I/O | 36-bit data + 4-bit parity bidirectional buses; direction controlled by OE and internal write/read state machine |
| OE | Output Enable | Asynchronous active-low control; tristates outputs during write data phase regardless of OE state |
| ZZ | Sleep Mode Input | Asynchronous active-high entry into low-power sleep; reduces ICC to ≤10 µA while preserving data |
| MODE | Burst Order Strap | Static input selecting linear (LOW) or interleaved (HIGH) burst addressing; must be stable before initialization |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables unlimited back-to-back read/write cycles with zero wait states - eliminates pipeline stalls in burst-intensive traffic |
| On-chip ECC | Single-bit error correction with no external logic required - meets telecom reliability requirements for SER < 1E-15 |
| Byte-Write Granularity | Four independent 9-bit write enables (BWa–BWd) - allows precise 1–36 bit updates without masking or auxiliary circuitry |
| Synchronous Self-Timed Writes | Internal write timing control eliminates external write pulse width constraints - simplifies timing closure in high-speed designs |
| JTAG Boundary Scan | IEEE 1149.1 compliant test access port - enables in-system interconnect testing and debug without physical probe access |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
|
Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface modules requiring deterministic latency and error resilience. IC Role / Device Role / Timing Role: Primary burst-access SRAM serving as ingress/egress FIFO with ECC-protected storage for ATM or IP cell payloads. Use Value: 167 MHz clock rate and zero-wait-state operation sustain 6 Gbps sustained throughput; on-chip ECC prevents silent corruption in multi-day uptime scenarios. |
Use Scenario: Deep buffer memory in enterprise switch ASIC co-processors handling jumbo frames and multicast replication. IC Role / Device Role / Timing Role: Pipelined SRAM providing synchronized read/write access to packet descriptors and payload segments under strict timing budgets. Use Value: Fully registered interface ensures setup/hold compliance at 167 MHz; byte-write capability enables efficient descriptor updates without full-word overwrites. |
| Base Station Controllers | Radar Signal Processing |
|
Use Scenario: Control plane memory in 3G/4G RNCs where firmware tables and session state require fast, reliable access. IC Role / Device Role / Timing Role: Non-volatile-configurable SRAM used for real-time lookup tables and signaling stack buffers with ECC integrity checking. Use Value: ZZ sleep mode reduces standby power to <10 µA during idle periods; MODE pin allows field-selectable burst order for legacy compatibility. |
Use Scenario: Real-time sample buffering in phased-array radar front-ends operating in high-radiation environments. IC Role / Device Role / Timing Role: High-reliability SRAM storing ADC samples prior to FFT processing, with continuous ECC scrubbing. Use Value: On-chip ECC reduces soft error-induced false alarms; 3.4 ns access time meets sub-6 ns timing windows for 167 MHz sampling clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L16PF | 16-Mbit (512K × 32), no on-chip ECC, 167 MHz, 3.3 V only (no VDDQ flexibility) | Lacks parity/ECC; requires external error detection logic for mission-critical systems | Select when cost sensitivity outweighs ECC requirement and 32-bit bus width suffices |
| ISSI IS61WV102436BLL-167TQLI | 36-Mbit (1M × 36), no ECC, 167 MHz, supports 2.5 V/3.3 V I/O but no ZZ sleep mode | Higher density but no built-in sleep control; lacks JTAG boundary scan for production testability | Choose for bandwidth scaling where sleep current and test coverage are secondary |
Compared with IDT72V2115L16PF and IS61WV102436BLL-167TQLI, CY7C1370KV33-167AXC uniquely combines ECC, ZZ sleep, JTAG, and dual-voltage I/O in a 512K × 36 package - critical for telecom infrastructure where reliability, testability, and power management are non-negotiable.
Availability
CY7C1370KV33-167AXC is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, and base station controllers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1370KV33-167AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial and communications markets.
CY7C1370KV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, ECC-protected memory subsystems in carrier-grade networking and wireless infrastructure equipment.
FAQ
What is the function of the MODE pin on CY7C1370KV33-167AXC?
The MODE pin is a static strap input that selects burst addressing order: HIGH configures interleaved burst (e.g., 0, 2, 4, 6… then 1, 3, 5, 7…), LOW selects linear burst (0, 1, 2, 3…). It must be stable before device initialization and cannot change during operation. Floating defaults to HIGH for interleaved mode.
Does CY7C1370KV33-167AXC support 2.5 V I/O operation?
Yes - VDDQ accepts either 2.5 V or 3.3 V, allowing direct interface with 2.5 V logic families without level shifters. Core VDD remains fixed at 3.3 V. AC timing parameters (e.g., tAC, tOH) are specified separately for each VDDQ condition in the datasheet.
How does the ZZ sleep mode affect data retention and wake-up timing?
In ZZ mode (pin driven HIGH), ICC drops to ≤10 µA while retaining full memory contents. Wake-up is asynchronous: data becomes valid within tZZH (max 20 ns) after ZZ returns LOW, with no clock cycles required. The internal pipeline state is preserved.
Can CY7C1370KV33-167AXC operate without using the JTAG interface?
Yes - JTAG is optional and disabled by default. TDI, TMS, TCK, and TDO pins function as no-connects unless enabled via the JTAG instruction register. No external pull-ups/downs or configuration fuses are needed for standard SRAM operation.
CY7C1370KV33-167AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1370KV33-167AXC FAQ
1.How can I place an order for CY7C1370KV33-167AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1370KV33-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1370KV33-167AXC reliable?
The price and inventory of CY7C1370KV33-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1370KV33-167AXC is usually 5 days.
3.What payment methods are accepted for CY7C1370KV33-167AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1370KV33-167AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1370KV33-167AXC?
CY7C1370KV33-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1370KV33-167AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1370KV33-167AXC?
For technical support, including CY7C1370KV33-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1370KV33-167AXC requirements.
6.How does Aetrix verify that CY7C1370KV33-167AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1370KV33-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1370KV33-167AXC meets industry standards.
7.What is the process for return or replacement of CY7C1370KV33-167AXC?
All CY7C1370KV33-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1370KV33-167AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1370KV33-167AXC part is unused and in its original packaging.
Return procedure for CY7C1370KV33-167AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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