Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1370KV33-167AXIT

Part No.:
CY7C1370KV33-167AXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1370KV33-167AXIT.pdf
Description:
IC SRAM 18MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,029

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1370KV33-167AXIT from Cypress Semiconductor is a 18-Mbit (512K × 36) pipelined synchronous SRAM with NoBL™ architecture and on-chip ECC, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 167 MHz with 3.4 ns maximum access time, supports zero-wait-state back-to-back read/write cycles, and uses 3.3 V core (VDD) and 3.3 V/2.5 V I/O (VDDQ) supplies.

For engineers reviewing the CY7C1370KV33-167AXIT datasheet, CY7C1370KV33-167AXIT pinout, CY7C1370KV33-167AXIT application, or CY7C1370KV33-167AXIT equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write select mapping to DQ/DQP groups, synchronous self-timed write timing, JTAG boundary-scan support, and ECC-enabled soft error mitigation in mission-critical buffers.

Technical Context

This SRAM implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven through output registers synchronized to CLK. The internal burst logic supports linear or interleaved addressing based on the MODE strap pin state.

It integrates on-chip ECC encoding/decoding for single-bit error correction and double-bit error detection, reducing soft error rate in radiation-sensitive environments. Synchronous self-timed writes eliminate external write pulse width constraints, while CEN enables clock gating without chip deselection.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density18 Mbit (512K × 36 organization)
Max Clock Frequency167 MHz - enables sustained 167 MT/s throughput with no wait states
Access Time3.4 ns - defines minimum clock-to-output delay for timing closure
VDD Supply3.3 V ±0.3 V - core power rail requiring tight regulation for stable register operation
VDDQ Supply3.3 V or 2.5 V - selectable I/O voltage supporting mixed-voltage system interfacing
ECC SupportOn-chip SEC-DED - corrects single-bit errors and detects double-bit errors in real time
Burst ModeConfigurable via MODE pin - linear or interleaved addressing per JEDEC standard

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, Pb-free.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputSynchronous address bus sampled on CLK rising edge; selects one of 512K locations
BWa–BWdByte Write SelectActive-low synchronous controls for DQa/DQPa, DQb/DQPb, DQc/DQPc, DQd/DQPd respectively
CLK, CENClock & EnableCLK qualified by CEN; CEN HIGH suspends clock recognition without deselecting device
CE1, CE2, CE3Chip EnableThree-level synchronous enable hierarchy for bank isolation in multi-SRAM systems
DQa–DQd, DQPa–DQPdData I/O36-bit data + 4-bit parity bidirectional bus; direction controlled by OE and internal write sequencing
MODEConfiguration StrapStatic input setting burst order (HIGH = interleaved, LOW = linear); must be stable during operation
ZZAsynchronous SleepActive-HIGH entry into low-power sleep mode; retains data but disables I/O drivers and core clocks

Key Features

FeatureDesign Value
NoBL™ ArchitectureEnables true back-to-back read/write operations with zero bus latency - eliminates pipeline stalls in burst-intensive traffic
Synchronous Self-timed WritesRemoves dependency on external write pulse width timing - simplifies controller design and improves timing margin
JTAG Boundary Scan (IEEE 1149.1)Supports in-system testability and interconnect verification without additional test fixtures
Programmable Burst OrderLinear or interleaved addressing selected at power-up via MODE pin - matches legacy ZBT or modern cache-line alignment needs
ZZ Sleep ModeReduces active power by >90% during idle periods while preserving memory contents - critical for thermal-constrained line cards

Applications

Packet Buffer MemorySwitch Fabric Lookup Table

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet switches before classification and forwarding.

IC Role / Device Role / Timing Role: High-speed, low-latency buffer providing deterministic 167 MT/s read/write throughput with ECC protection against cosmic-ray-induced bit flips.

Use Value: Enables lossless packet queuing under full line-rate traffic while maintaining data integrity across extended uptime.

Use Scenario: Holding forwarding table entries and ACL rules in modular chassis-based routers with distributed forwarding engines.

IC Role / Device Role / Timing Role: Pipelined SRAM serving as a synchronous lookup engine with burst-access capability for parallel rule matching.

Use Value: Delivers sub-4 ns clock-to-output latency and zero-wait-state operation to sustain >100 million lookups per second (MLPS).

Baseband Processing CacheRadar Signal Processing Buffer

Use Scenario: Acting as L2 cache for FPGA-based baseband processors in 5G massive MIMO radio units handling real-time FFT and channel estimation.

IC Role / Device Role / Timing Role: Low-jitter, fully registered memory interface synchronized to FPGA fabric clock with byte-write granularity for coefficient updates.

Use Value: Supports concurrent read-modify-write of complex IQ samples without pipeline bubbles, improving spectral efficiency.

Use Scenario: Buffering digitized IF samples in airborne synthetic aperture radar (SAR) systems prior to DSP-based pulse compression.

IC Role / Device Role / Timing Role: Radiation-tolerant memory with on-chip SEC-DED ECC protecting against neutron-induced soft errors in avionics environments.

Use Value: Ensures uninterrupted acquisition of gigasample datasets over extended flight durations without silent data corruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72V285L15PF16-Mbit (512K × 32), 150 MHz max, no on-chip ECC, 100-pin TQFPLacks ECC and operates at lower frequency; suitable only where SER immunity is not requiredSelect when cost sensitivity outweighs reliability requirements and bandwidth demand is ≤150 MT/s
ISSI IS61WV102436B36-Mbit (1M × 36), 166 MHz max, no ECC, 165-ball FBGA onlyHigher density but no ECC and incompatible package; requires PCB redesignChoose only if board space allows FBGA migration and application tolerates uncorrected bit errors

Compared with IDT72V285L15PF and IS61WV102436B, CY7C1370KV33-167AXIT uniquely delivers ECC-protected 167 MT/s operation in pin-compatible TQFP packaging - making it the sole option for drop-in replacement in existing ZBT-based designs requiring SER mitigation.

Availability

CY7C1370KV33-167AXIT is available at Aetrix Electronics and suitable for packet buffering, switch fabric lookup tables, and baseband processing caches requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant manufacturing.

Supply support for CY7C1370KV33-167AXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

CY7C1370KV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, ECC-enhanced memory subsystems in carrier-grade networking and defense electronics where deterministic timing and data integrity are non-negotiable.

FAQ

What is the function of the MODE pin on CY7C1370KV33-167AXIT?

The MODE pin is a static configuration strap that determines burst address ordering: pulled HIGH (or left floating) selects interleaved burst mode, while pulled LOW selects linear burst mode. It must be held stable during device operation and is sampled only at power-up or reset. This pin directly maps to JEDEC-standard burst behavior and cannot be changed dynamically during runtime.

Does CY7C1370KV33-167AXIT support 2.5 V I/O operation?

Yes - the VDDQ supply accepts either 3.3 V or 2.5 V, enabling direct interface with 2.5 V logic families without level shifters. When VDDQ = 2.5 V, AC timing parameters such as tAC and tOH are adjusted per datasheet specifications, and DC characteristics like VOH/VOL comply with 2.5 V LVTTL levels. Core VDD remains fixed at 3.3 V.

How does the ZZ pin affect power consumption and data retention?

Asserting ZZ HIGH places the device in asynchronous sleep mode, disabling internal clocks and I/O drivers while retaining all stored data in the SRAM array. Typical standby current drops to <50 µA. Data retention is guaranteed over the full industrial temperature range (–40°C to +85°C) as long as VDD and VDDQ remain within specification - no refresh or external intervention is required.

Can CY7C1370KV33-167AXIT be used as a direct replacement for ZBT SRAMs?

Yes - it is pin-compatible and functionally equivalent to ZBT devices (e.g., IDT72V285), supporting identical control protocols, burst orders, and timing conventions. Key differentiators include integrated ECC, NoBL™ zero-latency architecture, and dual-voltage VDDQ. No PCB or firmware changes are needed beyond verifying VDDQ compatibility and enabling ECC handling in the memory controller.

CY7C1370KV33-167AXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1370KV33-167AXIT FAQ

1.How can I place an order for CY7C1370KV33-167AXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1370KV33-167AXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1370KV33-167AXIT reliable?

The price and inventory of CY7C1370KV33-167AXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1370KV33-167AXIT is usually 5 days.

3.What payment methods are accepted for CY7C1370KV33-167AXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1370KV33-167AXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1370KV33-167AXIT?

CY7C1370KV33-167AXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1370KV33-167AXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1370KV33-167AXIT?

For technical support, including CY7C1370KV33-167AXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1370KV33-167AXIT requirements.

6.How does Aetrix verify that CY7C1370KV33-167AXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1370KV33-167AXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1370KV33-167AXIT meets industry standards.

7.What is the process for return or replacement of CY7C1370KV33-167AXIT?

All CY7C1370KV33-167AXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1370KV33-167AXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1370KV33-167AXIT part is unused and in its original packaging.

Return procedure for CY7C1370KV33-167AXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1370KV33-167AXIT Tags

  • CY7C1370KV33-167AXIT
  • CY7C1370KV33-167AXIT PDF
  • CY7C1370KV33-167AXIT Datasheet
  • CY7C1370KV33-167AXIT Specifications
  • CY7C1370KV33-167AXIT Images
  • Infineon Technologies
  • Infineon Technologies CY7C1370KV33-167AXIT
  • Buy CY7C1370KV33-167AXIT
  • CY7C1370KV33-167AXIT Price
  • CY7C1370KV33-167AXIT Distributor
  • CY7C1370KV33-167AXIT Supplier
  • CY7C1370KV33-167AXIT Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER