Infineon Technologies CY7C1370KV33-200AXC

Overview

CY7C1370KV33-200AXC from Cypress Semiconductor is a 18-Mbit (512K × 36) pipelined synchronous SRAM with NoBL™ architecture and integrated ECC, designed for high-throughput memory subsystems in network switches, telecom line cards, and packet buffering applications. It operates at 200 MHz with zero wait states, supports 3.3 V core and 3.3 V/2.5 V I/O supplies, and delivers 3.0 ns clock-to-output access time.

For engineers reviewing the CY7C1370KV33-200AXC datasheet, CY7C1370KV33-200AXC pinout, CY7C1370KV33-200AXC application, or CY7C1370KV33-200AXC equivalent, key selection criteria include burst mode configuration (linear/interleaved), byte-write granularity across four 9-bit data groups, synchronous self-timed write timing, JTAG boundary-scan support, and ECC-enabled soft error mitigation in radiation-sensitive environments.

Technical Context

This SRAM implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven through output registers synchronized to the same edge. The internal NoBL™ logic eliminates bus latency by enabling true back-to-back read/write cycles without wait states.

Burst addressing is controlled by ADV/LD and MODE pins, supporting both linear and interleaved orders; byte write enables (BWa–BWd) independently gate four 9-bit data/parity groups (DQa/DQPa through DQd/DQPd); ECC encoding/decoding occurs on-chip with dedicated parity I/O lines and automatic correction of single-bit errors.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, JEDEC-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed pipelined SRAM applications.

Compared with IDT72V2115L10PFI and IS61WV102436BLL-150TQLI, CY7C1370KV33-200AXC uniquely combines 200 MHz operation, on-die SEC-DED ECC, JTAG testability, and ZZ sleep - making it optimal for mission-critical infrastructure where reliability, bandwidth, and debuggability are co-constrained.

Availability

CY7C1370KV33-200AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, FPGA co-processor cache, and radar signal processing applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1370KV33-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

CY7C1370KV33-200AXC belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-reliability memory subsystems in carrier-grade networking and defense electronics.

FAQ

What is the function of the MODE pin on CY7C1370KV33-200AXC?

The MODE pin is a static strap input that selects burst addressing order: logic HIGH configures interleaved burst mode, while logic LOW selects linear burst mode. It must remain stable during device operation and defaults to HIGH if left floating. This pin directly maps to the internal burst counter logic and determines how consecutive addresses increment during burst transfers.

Does CY7C1370KV33-200AXC require external ECC circuitry?

No. CY7C1370KV33-200AXC integrates full SEC-DED (Single Error Correction, Double Error Detection) ECC logic on-die, including dedicated parity I/O pins (DQPa–DQPd) and automatic encoding/decoding. External ECC components are unnecessary, reducing BOM count and PCB area while guaranteeing bit-level error resilience per access.

Can CY7C1370KV33-200AXC operate with 2.5 V I/O voltage while using 3.3 V core supply?

Yes. The device supports independent VDD (3.3 V) and VDDQ (2.5 V or 3.3 V) supplies. When VDDQ = 2.5 V, all I/Os meet SSTL-2 specifications, enabling direct connection to 2.5 V FPGA I/O banks or ASIC interfaces without level shifters - verified in the AC switching characteristics table of the official datasheet.

How does the ZZ pin interact with clock enable (CEN) during low-power operation?

ZZ (asynchronous sleep) and CEN (synchronous clock enable) operate independently: ZZ forces deep sleep with sub-50 µA ICC and full data retention, disabling all internal clocks and I/O drivers; CEN only gates CLK recognition while preserving register state and allowing fast wake-up. Using ZZ avoids clock tree power loss; using CEN enables cycle-accurate pause/resume for deterministic timing control.