Infineon Technologies CY7C1370KV33-200AXCT
- Part No.:
- CY7C1370KV33-200AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1370KV33-200AXCT.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1370KV33-200AXCT from Cypress Semiconductor is a 18-Mbit (512K × 36) pipelined synchronous SRAM with NoBL™ architecture, ECC support, and 3.3 V core/2.5 V I/O operation. It delivers zero-wait-state 200 MHz bus performance (3.0 ns clock-to-output), fully registered I/O, byte-write capability, and on-chip ECC for soft error mitigation - deployed in high-throughput network packet buffers and telecom line cards.
For engineers reviewing the CY7C1370KV33-200AXCT datasheet, CY7C1370KV33-200AXCT pinout, CY7C1370KV33-200AXCT application, or CY7C1370KV33-200AXCT equivalent, key selection criteria include burst order configuration (linear/interleaved via MODE pin), synchronous self-timed write timing, JTAG boundary-scan compliance, and TQFP-100 package thermal and routing constraints.
Technical Context
This SRAM implements a fully synchronous, pipelined read/write interface with all inputs and outputs registered to the rising edge of CLK, and internal self-timed output buffer control eliminating asynchronous OE dependency. The device supports linear or interleaved burst orders selected by the MODE strap pin and includes IEEE 1149.1-compliant JTAG boundary scan for system-level testability.
It integrates on-chip ECC encoding/decoding logic to detect and correct single-bit errors, reducing soft error rate in radiation-sensitive environments. Write operations are controlled by four byte-write enables (BWa–BWd), WE, and CEN, with synchronous tri-state control of DQ/DQP lines during write data cycles to prevent bus contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 organization) |
| Max Clock Frequency | 200 MHz - enables zero-wait-state back-to-back read/write at 5 ns cycle time |
| Access Time | 3.0 ns - defines minimum clock-to-output delay for timing-critical burst reads |
| VDD / VDDQ | 3.3 V core / 2.5 V I/O - separates power domains for noise isolation and signal integrity |
| ECC Support | On-chip encoder/decoder - corrects single-bit errors per 36-bit word, critical for telecom reliability |
| Burst Capability | Linear or interleaved - configured by MODE pin; determines address increment pattern during burst sequences |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm) - JEDEC-standard, Pb-free, surface-mount compatible |
Pinout & Package
Package: 100-pin TQFP (14 mm × 20 mm × 1.4 mm), JEDEC-standard Pb-free, with exposed thermal pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | Synchronous address bus sampled on CLK rising edge; selects one of 512K locations |
| BWa–BWd | Byte Write Select | Active-low synchronous controls for DQa/DQPa through DQd/DQPd; enables partial-word writes |
| CLK, CEN | Clock & Enable | CLK qualified by active-low CEN; deasserting CEN extends previous cycle without deselection |
| DQa–DQd, DQPa–DQPd | Data I/O & Parity I/O | 36-bit bidirectional data + 4-bit parity; direction controlled by OE and internal write state |
| CE1, CE2, CE3 | Chip Enable | Three synchronous enables (active LOW/HIGH/LOW) for multi-bank memory mapping and bank isolation |
| MODE | Burst Order Strap | Static input setting burst sequence: HIGH = interleaved, LOW = linear; must be stable during operation |
| ZZ | Asynchronous Sleep | Active-HIGH entry into low-power sleep mode; retains data while reducing standby current |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables true back-to-back read/write with no bus latency - eliminates pipeline stalls in burst-intensive systems |
| Synchronous Self-Timed Writes | Removes external write pulse timing constraints; internal logic guarantees setup/hold compliance across voltage/temp |
| On-Chip ECC | Single-bit error correction per 36-bit word reduces SER in telecom infrastructure exposed to cosmic radiation |
| IEEE 1149.1 JTAG | Full boundary-scan support enables board-level interconnect testing without physical probe access |
| Flexible I/O Voltage | VDDQ = 2.5 V allows direct interfacing with 2.5 V logic families while maintaining 3.3 V core stability |
Applications
| Network Packet Buffer | Telecom Line Card |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as dual-port FIFO buffer between ingress/egress MACs and switching fabric. Use Value: 200 MHz zero-wait-state operation ensures deterministic 5 ns read/write turnaround, enabling full-line-rate packet processing at 10 Gbps. |
Use Scenario: Buffering TDM voice channels and control plane messages in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: ECC-protected memory for real-time signaling and payload storage where bit errors could cause call drops or misrouting. Use Value: On-chip ECC reduces uncorrectable error rate by >99% vs. non-ECC SRAM, meeting Telcordia GR-474 reliability requirements. |
| Radar Signal Processing | Industrial PLC Motion Control |
|
Use Scenario: Capturing and buffering high-speed ADC samples from phased-array radar receivers before FFT processing. IC Role / Device Role / Timing Role: Burst-mode SRAM serving as ping-pong buffer between ADC interface and DSP subsystem, synchronized to system clock domain. Use Value: Interleaved burst mode (via MODE pin) matches radar chirp timing patterns, minimizing address overhead and maximizing throughput. |
Use Scenario: Storing motion trajectory tables and real-time I/O status in CNC controllers requiring deterministic microsecond response. IC Role / Device Role / Timing Role: Deterministic-access memory for servo loop look-up tables and encoder position history, accessed under hard real-time deadlines. Use Value: Fully registered I/O and 3.0 ns access time guarantee sub-50 ns read latency, enabling 20 kHz servo update rates with jitter < 100 ns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L10PFI | 10 ns access, 100 MHz max, 512K × 36, no ECC, LVDS-compatible I/O | Lacks on-chip ECC and NoBL architecture; requires external timing control for burst sequencing | Preferred where LVDS signaling or lower power at reduced speed suffices, but not for ECC-critical telecom use |
| ISSI IS61WV102436BLL-150TQLI | 150 MHz, 3.3 V only (no VDDQ separation), no JTAG, no MODE-selectable burst order | Fixed linear burst only; no boundary-scan test support; higher VDDQ noise coupling risk in mixed-signal systems | Cost-optimized for industrial control where JTAG and ECC are non-mandatory, but not suitable for telecom certification paths |
Compared with IDT72V2115L10PFI and IS61WV102436BLL-150TQLI, CY7C1370KV33-200AXCT uniquely combines 200 MHz zero-wait-state operation, configurable burst order, on-chip ECC, and JTAG - making it the only option meeting simultaneous requirements for telecom packet buffering, radiation tolerance, and production testability.
Availability
CY7C1370KV33-200AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card design, radar signal capture, and industrial motion control applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1370KV33-200AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and communications markets.
CY7C1370KV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-throughput data buffering in telecom infrastructure and real-time embedded systems demanding ECC and JTAG testability.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin is a static strap input that selects burst address order: HIGH enables interleaved burst, LOW enables linear burst. It must be held stable before initialization and remain unchanged during operation. Floating defaults to HIGH (interleaved). This pin is not sampled dynamically - its state sets the burst counter behavior at power-up and cannot be altered mid-operation without reset.
Does CY7C1370KV33-200AXCT support true dual-port operation?
No - it is a synchronous single-port SRAM with pipelined read/write capability. While it supports back-to-back reads and writes with zero wait states, it lacks independent read and write ports. Data contention is prevented by synchronous tri-state control of DQ/DQP lines during write cycles, not by physical port separation.
How does the ZZ pin interact with the CEN pin during low-power operation?
ZZ is asynchronous and forces immediate entry into sleep mode, halting internal clocks and reducing ICC to ~50 µA. CEN is synchronous and only gates CLK recognition - the device remains selected and retains state. Using ZZ provides deeper power savings; using CEN alone maintains readiness for immediate wake-up but draws higher standby current (~12 mA).
Can the ECC functionality be disabled for non-critical applications?
No - ECC is hardwired and always active on CY7C1370KV33-200AXCT. All 36-bit data words include 4 parity bits (DQPa–DQPd), and the encoder/decoder operates transparently. There is no register or pin control to bypass ECC; attempting to ignore parity bits violates the device's functional specification and risks undetected multi-bit errors.
CY7C1370KV33-200AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1370KV33-200AXCT FAQ
1.How can I place an order for CY7C1370KV33-200AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1370KV33-200AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1370KV33-200AXCT reliable?
The price and inventory of CY7C1370KV33-200AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1370KV33-200AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1370KV33-200AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1370KV33-200AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1370KV33-200AXCT?
CY7C1370KV33-200AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1370KV33-200AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1370KV33-200AXCT?
For technical support, including CY7C1370KV33-200AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1370KV33-200AXCT requirements.
6.How does Aetrix verify that CY7C1370KV33-200AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1370KV33-200AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1370KV33-200AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1370KV33-200AXCT?
All CY7C1370KV33-200AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1370KV33-200AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1370KV33-200AXCT part is unused and in its original packaging.
Return procedure for CY7C1370KV33-200AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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