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Infineon Technologies CY7C1371C-100AC

Part No.:
CY7C1371C-100AC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1371C-100AC.pdf
Description:
IC SRAM 18MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,161

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Product details

Overview

CY7C1371C-100AC from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM (512K × 36-bit organization) with NoBL™ architecture, designed for high-throughput memory subsystems requiring zero-wait-state back-to-back read/write operations at 100 MHz. It features 8.5 ns clock-to-output delay, 3.3 V core/I/O supply, and three synchronous chip enables for depth expansion in networking and telecom data buffers.

For engineers reviewing the CY7C1371C-100AC datasheet, CY7C1371C-100AC pinout, CY7C1371C-100AC application, or CY7C1371C-100AC equivalent, key selection criteria include burst order control (linear/interleaved), synchronous byte write capability, JTAG boundary scan support (BGA/fBGA), ZZ sleep mode power management, and JEDEC-standard 100-pin TQFP packaging compatibility.

Technical Context

The CY7C1371C-100AC implements a fully synchronous, clocked interface with registered address, data, and control inputs sampled on the rising edge of CLK. Its NoBL™ architecture eliminates bus latency by enabling consecutive read/write cycles without dead cycles - data transfers occur on every clock edge.

It integrates an on-chip burst counter (driven by A[1:0]), self-timed write circuitry, synchronous output buffer control (eliminating OE timing dependency), and automatic tri-state management during write data phases. The MODE pin selects linear or interleaved burst order, while CEN suspends clock recognition without deselecting the device.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 36 bits - supports wide-data-path buffering in packet-switching ASICs and FPGA co-processor interfaces.
Max Clock Frequency 100 MHz - enables sustained 100 MT/s throughput with no wait states in synchronous bus architectures.
Access Time (tCO) 8.5 ns - defines minimum clock-to-valid-output delay for timing-critical read cycles in pipeline-constrained systems.
I/O Voltage 3.3 V - compatible with LVTTL and LVCMOS logic families; requires separate VDDQ rail for I/O drive integrity.
Power Supply VDD = 3.3 V ± 0.3 V - core voltage tolerance aligned with industrial-grade 3.3 V regulator outputs.
Standby Current (ZZ mode) 70 mA - low-power sleep state preserves data while reducing system-level idle power in burst-oriented traffic.
Burst Capability Linear or interleaved - selectable via MODE pin; matches CPU cache line or DMA engine burst patterns.

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC standard, body size 14 mm × 14 mm, 0.5 mm pitch.

Pin Circuit Role Design Meaning
A0–A18 Synchronous Address Input 19-bit address bus sampled on CLK rising edge; A[1:0] drives internal 2-bit burst counter.
BWA–BWD Synchronous Byte Write Enable Four active-low signals controlling 8-bit write granularity per DQ byte group (A–D); qualified by WE.
CE1, CE2, CE3 Synchronous Chip Enable Three enable inputs (CE1/CE3 active-low, CE2 active-high) allow hierarchical bank decoding without external logic.
CLK, CEN Clock & Clock Enable CLK is gated by CEN; deasserting CEN extends previous cycle without losing synchronization or data coherency.
DQPA–DQPD Data Parity I/O Four parity bits synchronized with DQ[0:31]; each maps to corresponding byte group and respects BWx controls.
OE Asynchronous Output Enable Tri-states outputs asynchronously but masked during write data phase and post-deselect transitions.
ZZ Asynchronous Sleep Control Active-high entry into non-time-critical low-power mode; retains memory contents without refresh.

Key Features

Feature Design Value
No Bus Latency™ Architecture Enables true back-to-back read/write cycles with zero dead cycles - critical for real-time packet buffering where latency spikes cause jitter or dropouts.
Synchronous Self-Timed Writes Eliminates external write pulse width constraints; internal timing ensures reliable data capture across voltage/temperature corners.
Registered Flow-Through Operation All inputs registered on CLK rising edge - simplifies PCB layout by removing setup/hold timing violations on long traces.
Byte Write Select (BWX) Independent 8-bit write control per data byte group - enables efficient partial-word updates without read-modify-write overhead.
JTAG Boundary Scan (BGA/fBGA) IEEE 1149.1-compliant test access for interconnect verification - reduces manufacturing test time in high-density routing environments.

Applications

Telecom Line Card Buffering Network Processor Co-Processor Memory

Use Scenario: Storing incoming/outgoing ATM or Ethernet frame payloads in carrier-grade line cards with strict jitter budgets.

IC Role / Device Role / Timing Role: High-speed dual-port-like buffer providing zero-latency write-read turnaround for header processing pipelines.

Use Value: 8.5 ns tCO and NoBL™ architecture prevent pipeline stalls during frequent write-read alternation in bursty traffic.

Use Scenario: Acting as instruction/data scratchpad for multi-threaded network processors executing deep-pipeline forwarding algorithms.

IC Role / Device Role / Timing Role: Synchronous burst-access memory supporting linear/interleaved fetch patterns aligned with processor burst length.

Use Value: MODE-selectable burst order ensures optimal alignment with NPU's internal burst addressing scheme, minimizing address decode overhead.

FPGA-Based Protocol Accelerator Industrial Real-Time Controller Cache

Use Scenario: Offloading TCP/IP checksum, encryption, or packet classification tasks using FPGA fabric with tight memory bandwidth requirements.

IC Role / Device Role / Timing Role: Low-latency, wide-bus SRAM interfaced directly to FPGA I/O banks for deterministic data staging.

Use Value: 3.3 V VDDQ compatibility and registered inputs simplify FPGA I/O timing closure; ZZ mode reduces dynamic power between bursts.

Use Scenario: Serving as deterministic response buffer in safety-critical PLC modules requiring guaranteed worst-case access timing.

IC Role / Device Role / Timing Role: Deterministic-flow-through memory ensuring bounded read/write latency under all operating conditions.

Use Value: 100 MHz operation with fixed 8.5 ns tCO provides predictable timing margins for hard real-time scheduling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L10PF 100 MHz, 512K × 36, 3.3 V, but uses ZBT™ architecture (not NoBL™); lacks MODE-selectable burst order. Requires external OE control and exhibits one-cycle latency between write-read transitions. Preferred when legacy ZBT™ compatibility is required; not suitable for zero-latency NoBL™-optimized designs.
ISSI IS61WV51236BLL-100TQLI 100 MHz, 512K × 36, 3.3 V, pin-compatible TQFP, but no JTAG support and no ZZ sleep mode. Lacks hardware sleep control and boundary-scan testability - limits use in field-upgradable or high-reliability systems. Cost-optimized alternative where JTAG and low-power sleep are non-critical; verify timing margins independently.

Compared with IDT72V2115L10PF and IS61WV51236BLL-100TQLI, the CY7C1371C-100AC uniquely delivers true zero-latency read-after-write performance, MODE-configurable burst sequencing, and integrated ZZ sleep - making it optimal for jitter-sensitive telecom and deterministic industrial control buffers.

Availability

CY7C1371C-100AC is available at Aetrix Electronics and suitable for telecom line card buffering, network processor co-processor memory, and FPGA-based protocol accelerator applications requiring stable component supply, long-lifecycle support, and JEDEC-standard TQFP packaging.

Supply support for CY7C1371C-100AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1371C belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth memory subsystems in packet-processing, switching, and real-time control applications.

FAQ

What is the function of the MODE pin on CY7C1371C-100AC?

The MODE pin selects burst addressing sequence: tied to GND for linear burst order (e.g., 0,1,2,3), or to VDD/floating for interleaved order (e.g., 0,2,1,3). This setting is latched at power-up and remains static during operation - no runtime reconfiguration is supported. It directly affects how the internal 2-bit burst counter increments A[1:0].

Does CY7C1371C-100AC require an external clock buffer for 100 MHz operation?

No external clock buffer is required. The device accepts a clean 100 MHz single-ended CMOS clock directly on the CLK pin, provided signal integrity meets tSK(CLK–CEN) < 1.5 ns skew and VIH/VIL thresholds are met. CEN gating allows clock pause without violating setup/hold on other inputs, eliminating need for complex clock tree management.

How does the ZZ pin interact with CE and CEN during power management?

ZZ is asynchronous and overrides CE/CEN: asserting ZZ HIGH forces immediate entry into low-power sleep mode regardless of CE or CEN state, preserving data without clock or enable dependencies. Exiting sleep requires ZZ LOW followed by valid CE assertion and CLK edge - no minimum ZZ pulse width is specified, but 10 ns is recommended for robustness.

Can CY7C1371C-100AC support mixed 36-bit and 18-bit data accesses?

No - the CY7C1371C is fixed at 512K × 36 organization. While the CY7C1373C variant offers 1M × 18, the -100AC suffix confirms this is the 36-bit version. Byte write enables (BWA–BWD) allow partial writes, but full-width reads/writes always involve all 36 data bits plus 4 parity bits (DQPA–DQPD).

CY7C1371C-100AC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Bag
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1371C-100AC FAQ

1.How can I place an order for CY7C1371C-100AC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1371C-100AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1371C-100AC reliable?

The price and inventory of CY7C1371C-100AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1371C-100AC is usually 5 days.

3.What payment methods are accepted for CY7C1371C-100AC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1371C-100AC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1371C-100AC?

CY7C1371C-100AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1371C-100AC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1371C-100AC?

For technical support, including CY7C1371C-100AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1371C-100AC requirements.

6.How does Aetrix verify that CY7C1371C-100AC is sourced from the original manufacturer or authorized distributors?

All CY7C1371C-100AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1371C-100AC meets industry standards.

7.What is the process for return or replacement of CY7C1371C-100AC?

All CY7C1371C-100AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1371C-100AC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1371C-100AC part is unused and in its original packaging.

Return procedure for CY7C1371C-100AC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1371C-100AC Tags

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