Infineon Technologies CY7C1371DV33-133AXI

Overview

CY7C1371DV33-133AXI from Cypress Semiconductor is a 18-Mbit (512K × 36) synchronous flow-through SRAM with NoBL™ architecture, designed for zero-wait-state back-to-back read/write operations in high-speed memory subsystems. It operates at 133 MHz with 6.5 ns clock-to-output delay, supports byte write via four BWx inputs, and uses 3.3 V core and 2.5/3.3 V I/O supplies (VDDQ). Used in network packet buffers and telecom line cards requiring deterministic latency.

For engineers reviewing the CY7C1371DV33-133AXI datasheet, CY7C1371DV33-133AXI pinout, CY7C1371DV33-133AXI application, or CY7C1371DV33-133AXI equivalent, key selection criteria include burst mode control (MODE pin), synchronous self-timed writes, three chip enables for depth expansion, ZZ sleep mode power management, and JTAG boundary-scan testability.

Technical Context

The device implements a synchronous flow-through architecture where all address, control, and data inputs are registered on the rising edge of CLK, qualified by CEN. Internal burst logic-linear or interleaved per MODE strap-uses A[1:0] to generate sequential addresses without external counter logic.

NoBL™ eliminates bus latency by enabling immediate read-after-write transitions: output drivers are synchronously tristated during write data capture, and OE is masked during write cycles to prevent contention. Write operations use on-chip self-timed circuitry, decoupling write completion from clock timing.

Key Specifications

Pinout & Package

Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 165-ball FBGA (13 × 15 × 1.4 mm) packages. Both variants support identical pin functions and timing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IDT72V2115L133PFI and IS61WV102436BLL-133TQLI, the CY7C1371DV33-133AXI uniquely combines extended temperature operation, ZZ sleep mode, and JTAG testability in a pin-compatible NoBL™ package-making it optimal for telecom infrastructure and defense-grade embedded systems requiring field reliability and debug access.

Availability

CY7C1371DV33-133AXI is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, radar signal processing buffers, and industrial PLC data log applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1371DV33-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in programmable system-on-chip (PSoC), memory, and USB solutions for embedded systems.

The CY7C1371DV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for high-throughput, low-latency memory subsystems in networking, telecommunications, and real-time signal processing equipment.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin is a static strap that selects burst order: tied to GND for linear burst sequence, or to VDD/floating for interleaved burst. It is sampled only at power-up or reset; reconfiguration requires cycling VDD. Incorrect strapping causes invalid burst addressing and data corruption during burst reads/writes.

How does the ZZ sleep mode interact with data retention and wake-up timing?

When ZZ is driven HIGH, the device enters non-time-critical sleep mode with full data retention and standby current ≤70 mA. Wake-up occurs synchronously on the first valid CLK edge after ZZ returns LOW, with no additional latency beyond standard access time (6.5 ns). The internal state-including burst counter and register contents-is preserved.

Can CE2 be used as an active-low enable like CE1 and CE3?

No - CE2 is defined as active HIGH per the datasheet and pin definition table. Using it as active LOW violates timing and functional specifications. Correct operation requires CE1 and CE3 asserted LOW while CE2 is asserted HIGH; mixing polarities causes undefined chip select behavior and potential bus contention.

Is the JTAG interface enabled by default, and can it be disabled?

Yes, IEEE 1149.1 JTAG is enabled by default and cannot be permanently disabled. However, the TAP controller can be held in Test-Logic-Reset state via TMS/TCK sequencing, effectively disabling scan operations. Boundary-scan functionality remains fully accessible for production testing and field diagnostics without firmware intervention.