Infineon Technologies CY7C1371KV33-100AXC

Overview

CY7C1371KV33-100AXC from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM with NoBL™ architecture and on-chip ECC, configured as 512K × 36 or 1M × 18. It supports 100 MHz bus operation (8.5 ns access), delivers zero wait-state back-to-back read/write cycles, and features registered inputs, byte write capability, and three chip enables for depth expansion. Used in high-throughput networking buffers and packet-switching ASIC interfaces.

For engineers reviewing the CY7C1371KV33-100AXC datasheet, CY7C1371KV33-100AXC pinout, CY7C1371KV33-100AXC application, or CY7C1371KV33-100AXC equivalent, key selection criteria include burst order control (linear/interleaved), synchronous self-timed write timing, ZZ sleep mode behavior, and VDDQ = 3.3 V/2.5 V I/O compatibility with legacy ZBT™ systems.

Technical Context

The device implements a synchronous flow-through architecture where all address, data, and control inputs are registered on the rising edge of CLK, qualified by CEN. Burst addressing is managed by an internal two-bit counter driven by A[1:0], with MODE pin selecting linear or interleaved sequence.

Write operations use synchronous self-timed circuitry with BWx/WE qualification; output drivers are synchronously tristated during write data phases to prevent bus contention. ECC encoding/decoding occurs on-chip to correct single-bit errors and detect double-bit errors, reducing SER without external logic.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (14 mm × 20 mm × 1.4 mm), RoHS-compliant, JEDEC standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IDT72V2115L10PF and IS61WV102432BLL-10TLI, CY7C1371KV33-100AXC uniquely combines NoBL™ zero-wait-state operation, on-die SEC-DED ECC, and dual ×36/×18 configurability - making it optimal for mission-critical, high-throughput embedded memory subsystems.

Availability

CY7C1371KV33-100AXC is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfacing, and radar signal processing applications requiring stable component supply and long-term industrial availability.

Supply support for CY7C1371KV33-100AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets.

CY7C1371KV33 belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, burst-oriented memory subsystems in networking, test equipment, and real-time signal processing platforms.

FAQ

What is the function of the MODE pin on CY7C1371KV33-100AXC?

The MODE pin selects burst addressing order: tied to GND for linear burst sequence (e.g., 0,1,2,3), or to VDD/floating for interleaved burst (e.g., 0,2,4,6). This setting is sampled at power-up and remains static during operation. It directly determines how the internal two-bit burst counter increments A[1:0] during burst reads/writes.

How does the ZZ pin interact with CE and CEN during low-power operation?

ZZ is asynchronous and active-HIGH; asserting ZZ places the device in sleep mode regardless of CE or CEN state, reducing ICC to ≤5 mA while preserving data. CE deassertion deselects the device but does not reduce power as aggressively. CEN suspension halts clock recognition but maintains full VDD bias - ZZ is the only method for significant standby current reduction.

Can CY7C1371KV33-100AXC operate with VDDQ = 2.5 V while VDD = 3.3 V?

Yes - VDD (core) and VDDQ (I/O) are independent supplies. The device supports VDD = 3.3 V ±0.3 V and VDDQ = 2.5 V ±0.2 V simultaneously, enabling direct interfacing with 2.5 V FPGAs or ASICs while maintaining full 3.3 V core performance and timing specifications.

Is the ECC functionality configurable or always enabled?

ECC is hardwired and always active during read/write operations in ×36 mode; DQP[A:D] lines carry parity bits, and correction/detection occurs transparently. In ×18 mode, DQP lines become user-accessible I/Os and ECC is disabled - no register or command controls ECC activation.