Infineon Technologies CY7C1371KV33-100AXCT
- Part No.:
- CY7C1371KV33-100AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1371KV33-100AXCT.pdf
- Description:
- IC SRAM 18MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,592
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1371KV33-100AXCT from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM with NoBL™ architecture and on-chip ECC, configured as 512K × 36 or 1M × 18. It supports 100 MHz bus operation (8.5 ns access), delivers zero wait-state back-to-back read/write cycles, and features registered inputs, byte write capability, and three chip enables for depth expansion. Used in high-throughput packet buffering and network switch data planes.
For engineers reviewing the CY7C1371KV33-100AXCT datasheet, CY7C1371KV33-100AXCT pinout, CY7C1371KV33-100AXCT application, or CY7C1371KV33-100AXCT equivalent, key selection criteria include burst order control (linear/interleaved), synchronous self-timed writes, ZZ sleep mode, VDDQ voltage flexibility (2.5 V/3.3 V), and ECC-enabled soft error mitigation in telecom infrastructure.
Technical Context
The device implements a synchronous flow-through architecture where all address, control, and data inputs are registered on the rising edge of CLK, with CEN qualifying clock recognition. Burst addressing is controlled by ADV/LD and MODE pins, supporting linear or interleaved sequences per JEDEC standard.
Write operations use synchronous self-timed circuitry with BWA–BWD and WE; output drivers are synchronously tristated during write data phases to prevent bus contention. ECC encoding/decoding occurs on-chip, correcting single-bit errors and detecting double-bit errors without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 or 1M × 18 organization) |
| Max Clock Frequency | 100 MHz - enables deterministic 10 ns cycle time for continuous burst transfers |
| Access Time (tAC) | 8.5 ns - defines maximum clock-to-output delay for read operations at 100 MHz |
| VDDQ Supply Range | 2.5 V or 3.3 V - allows interoperability with mixed-voltage system buses |
| ECC Function | On-chip SEC-DED - corrects single-bit errors and detects double-bit errors in real time |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm) - JEDEC-standard Pb-free footprint for thermal and layout compatibility |
| Sleep Mode | ZZ input (asynchronous active-HIGH) - reduces standby current while preserving data integrity |
Pinout & Package
Package: 100-pin TQFP (14 mm × 20 mm × 1.4 mm), JEDEC-standard Pb-free, with exposed pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Qualifies all synchronous inputs; recognized only when CEN = LOW |
| CEN | Clock enable (active LOW) | Suspends clock sampling without deselecting device; extends previous cycle |
| CE1, CE3 | Synchronous chip enables (active LOW) | Combined with CE2 (active HIGH) for bank selection and depth expansion |
| BWA–BWD | Byte write selects (active LOW) | Enable independent 8-bit write to DQA–DQD groups; qualified with WE |
| DQPA–DQPD | Data parity I/O (synchronous) | Parity bits for each 36-bit word; functionally identical to DQs with ECC support |
| MODE | Burst order configuration strap | GND = linear burst; VDD/floating = interleaved burst per JEDEC JESD8-8 |
| ZZ | Asynchronous sleep control | Active HIGH places device in low-power sleep while retaining memory contents |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency (NoBL™) architecture | Eliminates dead cycles between consecutive read/write operations, enabling true back-to-back transfers |
| Registered synchronous interface | All control and address inputs sampled on CLK rising edge, ensuring timing predictability in high-speed designs |
| Internal self-timed output buffer control | Removes need for external OE timing management; outputs automatically tristated during write data phase |
| Flexible I/O voltage (VDDQ) | Supports 2.5 V or 3.3 V operation independent of core VDD, easing integration with legacy and modern ASICs |
| Three chip enables (CE1/CE2/CE3) | Enables seamless depth expansion across multiple devices without external decoding logic |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as primary frame buffer with ECC protection against cosmic-ray-induced bit flips. Use Value: 100 MHz zero-wait-state operation sustains full line-rate throughput; on-chip ECC eliminates need for external error correction logic. |
Use Scenario: Holding control-plane metadata and temporary payload buffers in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly with MIPS or ARM-based control processors via parallel bus. Use Value: Registered inputs and predictable 8.5 ns tAC simplify timing closure; ZZ sleep mode reduces power during idle periods without data loss. |
| Radar Signal Processing Buffer | Industrial PLC Data Exchange |
|
Use Scenario: Temporarily storing digitized ADC samples from phased-array radar receivers prior to FFT computation. IC Role / Device Role / Timing Role: Flow-through SRAM providing deterministic latency for time-critical sample streaming with burst read/write alignment. Use Value: Linear/interleaved burst modes match FFT memory access patterns; ECC ensures reliability in radiation-prone environments. |
Use Scenario: Serving as shared memory between motion controller FPGA and real-time I/O processor in multi-axis CNC systems. IC Role / Device Role / Timing Role: Dual-port-capable parallel SRAM used for synchronized data exchange with precise clock-domain crossing control. Use Value: Byte-write capability enables efficient partial updates of status registers; CE1/CE2/CE3 allow clean partitioning of memory space across subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C331025B-10JIN | No on-chip ECC; 10 ns access at 100 MHz; 3.3 V only VDDQ | Lacks SER mitigation - unsuitable for telecom or aerospace deployments requiring soft-error resilience | Select when ECC is handled externally or not required, and cost sensitivity outweighs reliability needs |
| IS61WV102436BLL-10MLI | 10 ns tAC; supports 2.5 V/3.3 V VDDQ; no ZZ sleep mode; no MODE pin for burst order | Fixed linear burst only; lacks asynchronous sleep control - limits power optimization in intermittent workloads | Choose for simpler designs where burst order and low-power sleep are not design constraints |
Compared with CY7C1371KV33-100AXCT, AS7C331025B-10JIN omits ECC and requires external error handling, while IS61WV102436BLL-10MLI lacks configurable burst order and ZZ sleep-making the Cypress device uniquely suited for ECC-dependent, power-aware, and burst-flexible applications.
Availability
CY7C1371KV33-100AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and radar signal processing requiring stable component supply and long-term industrial availability.
Supply support for CY7C1371KV33-100AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial markets.
This device belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput data buffering in networking and real-time signal processing systems.
FAQ
What is the function of the MODE pin on CY7C1371KV33-100AXCT?
The MODE pin selects burst addressing sequence: tied to GND for linear burst order, or to VDD/floating for interleaved burst order per JEDEC JESD8-8. This setting is sampled at power-up and remains static during operation unless reconfigured externally. It directly affects how consecutive addresses increment during burst reads/writes and must match the host controller's burst protocol.
Does CY7C1371KV33-100AXCT require an external clock buffer for 100 MHz operation?
No external clock buffer is required. The device accepts a clean, single-ended CMOS-level clock directly at the CLK pin, with setup/hold timing referenced to the rising edge. Input register synchronization and internal clock qualification via CEN ensure robust operation at 100 MHz without added buffering, provided PCB layout follows controlled-impedance routing and proper decoupling near VDD/VDDQ pins.
How does the ZZ sleep mode interact with chip enable signals?
ZZ is asynchronous and overrides CE states: when ZZ = HIGH, the device enters sleep regardless of CE1/CE2/CE3 status, reducing ICC to ≤ 50 µA while preserving data. CE signals remain functional upon wake-up (ZZ = LOW), but the device requires one full clock cycle after ZZ deassertion before accepting new commands. CE deselection alone does not achieve equivalent power savings.
Can CY7C1371KV33-100AXCT operate with VDD = 3.3 V and VDDQ = 2.5 V simultaneously?
Yes - VDD (core) and VDDQ (I/O) are independently powered. The device supports VDD = 3.3 V ± 0.3 V and VDDQ = 2.5 V ± 0.2 V concurrently, enabling direct interfacing with 2.5 V FPGAs or ASICs while maintaining 3.3 V core logic integrity. This dual-supply capability is validated in the DC characteristics table and requires separate decoupling for each rail.
CY7C1371KV33-100AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1371KV33-100AXCT FAQ
1.How can I place an order for CY7C1371KV33-100AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1371KV33-100AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1371KV33-100AXCT reliable?
The price and inventory of CY7C1371KV33-100AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1371KV33-100AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1371KV33-100AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1371KV33-100AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1371KV33-100AXCT?
CY7C1371KV33-100AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1371KV33-100AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1371KV33-100AXCT?
For technical support, including CY7C1371KV33-100AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1371KV33-100AXCT requirements.
6.How does Aetrix verify that CY7C1371KV33-100AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1371KV33-100AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1371KV33-100AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1371KV33-100AXCT?
All CY7C1371KV33-100AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1371KV33-100AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1371KV33-100AXCT part is unused and in its original packaging.
Return procedure for CY7C1371KV33-100AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1371KV33-100AXCT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

