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Infineon Technologies CY7C1371KV33-100AXCT

Part No.:
CY7C1371KV33-100AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1371KV33-100AXCT.pdf
Description:
IC SRAM 18MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,592

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Product details

Overview

CY7C1371KV33-100AXCT from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM with NoBL™ architecture and on-chip ECC, configured as 512K × 36 or 1M × 18. It supports 100 MHz bus operation (8.5 ns access), delivers zero wait-state back-to-back read/write cycles, and features registered inputs, byte write capability, and three chip enables for depth expansion. Used in high-throughput packet buffering and network switch data planes.

For engineers reviewing the CY7C1371KV33-100AXCT datasheet, CY7C1371KV33-100AXCT pinout, CY7C1371KV33-100AXCT application, or CY7C1371KV33-100AXCT equivalent, key selection criteria include burst order control (linear/interleaved), synchronous self-timed writes, ZZ sleep mode, VDDQ voltage flexibility (2.5 V/3.3 V), and ECC-enabled soft error mitigation in telecom infrastructure.

Technical Context

The device implements a synchronous flow-through architecture where all address, control, and data inputs are registered on the rising edge of CLK, with CEN qualifying clock recognition. Burst addressing is controlled by ADV/LD and MODE pins, supporting linear or interleaved sequences per JEDEC standard.

Write operations use synchronous self-timed circuitry with BWA–BWD and WE; output drivers are synchronously tristated during write data phases to prevent bus contention. ECC encoding/decoding occurs on-chip, correcting single-bit errors and detecting double-bit errors without external logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (512K × 36 or 1M × 18 organization)
Max Clock Frequency 100 MHz - enables deterministic 10 ns cycle time for continuous burst transfers
Access Time (tAC) 8.5 ns - defines maximum clock-to-output delay for read operations at 100 MHz
VDDQ Supply Range 2.5 V or 3.3 V - allows interoperability with mixed-voltage system buses
ECC Function On-chip SEC-DED - corrects single-bit errors and detects double-bit errors in real time
Package 100-pin TQFP (14 × 20 × 1.4 mm) - JEDEC-standard Pb-free footprint for thermal and layout compatibility
Sleep Mode ZZ input (asynchronous active-HIGH) - reduces standby current while preserving data integrity

Pinout & Package

Package: 100-pin TQFP (14 mm × 20 mm × 1.4 mm), JEDEC-standard Pb-free, with exposed pad not electrically connected.

Pin/Terminal Circuit Role Design Meaning
CLK Synchronous clock input Qualifies all synchronous inputs; recognized only when CEN = LOW
CEN Clock enable (active LOW) Suspends clock sampling without deselecting device; extends previous cycle
CE1, CE3 Synchronous chip enables (active LOW) Combined with CE2 (active HIGH) for bank selection and depth expansion
BWA–BWD Byte write selects (active LOW) Enable independent 8-bit write to DQA–DQD groups; qualified with WE
DQPA–DQPD Data parity I/O (synchronous) Parity bits for each 36-bit word; functionally identical to DQs with ECC support
MODE Burst order configuration strap GND = linear burst; VDD/floating = interleaved burst per JEDEC JESD8-8
ZZ Asynchronous sleep control Active HIGH places device in low-power sleep while retaining memory contents

Key Features

Feature Design Value
No Bus Latency (NoBL™) architecture Eliminates dead cycles between consecutive read/write operations, enabling true back-to-back transfers
Registered synchronous interface All control and address inputs sampled on CLK rising edge, ensuring timing predictability in high-speed designs
Internal self-timed output buffer control Removes need for external OE timing management; outputs automatically tristated during write data phase
Flexible I/O voltage (VDDQ) Supports 2.5 V or 3.3 V operation independent of core VDD, easing integration with legacy and modern ASICs
Three chip enables (CE1/CE2/CE3) Enables seamless depth expansion across multiple devices without external decoding logic

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as primary frame buffer with ECC protection against cosmic-ray-induced bit flips.

Use Value: 100 MHz zero-wait-state operation sustains full line-rate throughput; on-chip ECC eliminates need for external error correction logic.

Use Scenario: Holding control-plane metadata and temporary payload buffers in carrier-grade DSLAMs and OLTs.

IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly with MIPS or ARM-based control processors via parallel bus.

Use Value: Registered inputs and predictable 8.5 ns tAC simplify timing closure; ZZ sleep mode reduces power during idle periods without data loss.

Radar Signal Processing Buffer Industrial PLC Data Exchange

Use Scenario: Temporarily storing digitized ADC samples from phased-array radar receivers prior to FFT computation.

IC Role / Device Role / Timing Role: Flow-through SRAM providing deterministic latency for time-critical sample streaming with burst read/write alignment.

Use Value: Linear/interleaved burst modes match FFT memory access patterns; ECC ensures reliability in radiation-prone environments.

Use Scenario: Serving as shared memory between motion controller FPGA and real-time I/O processor in multi-axis CNC systems.

IC Role / Device Role / Timing Role: Dual-port-capable parallel SRAM used for synchronized data exchange with precise clock-domain crossing control.

Use Value: Byte-write capability enables efficient partial updates of status registers; CE1/CE2/CE3 allow clean partitioning of memory space across subsystems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C331025B-10JIN No on-chip ECC; 10 ns access at 100 MHz; 3.3 V only VDDQ Lacks SER mitigation - unsuitable for telecom or aerospace deployments requiring soft-error resilience Select when ECC is handled externally or not required, and cost sensitivity outweighs reliability needs
IS61WV102436BLL-10MLI 10 ns tAC; supports 2.5 V/3.3 V VDDQ; no ZZ sleep mode; no MODE pin for burst order Fixed linear burst only; lacks asynchronous sleep control - limits power optimization in intermittent workloads Choose for simpler designs where burst order and low-power sleep are not design constraints

Compared with CY7C1371KV33-100AXCT, AS7C331025B-10JIN omits ECC and requires external error handling, while IS61WV102436BLL-10MLI lacks configurable burst order and ZZ sleep-making the Cypress device uniquely suited for ECC-dependent, power-aware, and burst-flexible applications.

Availability

CY7C1371KV33-100AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and radar signal processing requiring stable component supply and long-term industrial availability.

Supply support for CY7C1371KV33-100AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial markets.

This device belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput data buffering in networking and real-time signal processing systems.

FAQ

What is the function of the MODE pin on CY7C1371KV33-100AXCT?

The MODE pin selects burst addressing sequence: tied to GND for linear burst order, or to VDD/floating for interleaved burst order per JEDEC JESD8-8. This setting is sampled at power-up and remains static during operation unless reconfigured externally. It directly affects how consecutive addresses increment during burst reads/writes and must match the host controller's burst protocol.

Does CY7C1371KV33-100AXCT require an external clock buffer for 100 MHz operation?

No external clock buffer is required. The device accepts a clean, single-ended CMOS-level clock directly at the CLK pin, with setup/hold timing referenced to the rising edge. Input register synchronization and internal clock qualification via CEN ensure robust operation at 100 MHz without added buffering, provided PCB layout follows controlled-impedance routing and proper decoupling near VDD/VDDQ pins.

How does the ZZ sleep mode interact with chip enable signals?

ZZ is asynchronous and overrides CE states: when ZZ = HIGH, the device enters sleep regardless of CE1/CE2/CE3 status, reducing ICC to ≤ 50 µA while preserving data. CE signals remain functional upon wake-up (ZZ = LOW), but the device requires one full clock cycle after ZZ deassertion before accepting new commands. CE deselection alone does not achieve equivalent power savings.

Can CY7C1371KV33-100AXCT operate with VDD = 3.3 V and VDDQ = 2.5 V simultaneously?

Yes - VDD (core) and VDDQ (I/O) are independently powered. The device supports VDD = 3.3 V ± 0.3 V and VDDQ = 2.5 V ± 0.2 V concurrently, enabling direct interfacing with 2.5 V FPGAs or ASICs while maintaining 3.3 V core logic integrity. This dual-supply capability is validated in the DC characteristics table and requires separate decoupling for each rail.

CY7C1371KV33-100AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1371KV33-100AXCT FAQ

1.How can I place an order for CY7C1371KV33-100AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1371KV33-100AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1371KV33-100AXCT reliable?

The price and inventory of CY7C1371KV33-100AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1371KV33-100AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1371KV33-100AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1371KV33-100AXCT transactions.

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CY7C1371KV33-100AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1371KV33-100AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1371KV33-100AXCT?

For technical support, including CY7C1371KV33-100AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1371KV33-100AXCT requirements.

6.How does Aetrix verify that CY7C1371KV33-100AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1371KV33-100AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1371KV33-100AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1371KV33-100AXCT?

All CY7C1371KV33-100AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1371KV33-100AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1371KV33-100AXCT part is unused and in its original packaging.

Return procedure for CY7C1371KV33-100AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1371KV33-100AXCT Tags

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