Infineon Technologies CY7C1371KV33-133AXC
- Part No.:
- CY7C1371KV33-133AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1371KV33-133AXC.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:144
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1371KV33-133AXC from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM with NoBL™ architecture, supporting true back-to-back read/write operations at 133 MHz with zero wait states and 6.5 ns clock-to-output delay. It features on-chip ECC for soft error correction, 3.3 V/2.5 V I/O (VDDQ), and three chip enables for depth expansion - deployed in high-throughput networking packet buffers and real-time DSP memory subsystems.
For engineers reviewing the CY7C1371KV33-133AXC datasheet, CY7C1371KV33-133AXC pinout, CY7C1371KV33-133AXC application, or CY7C1371KV33-133AXC equivalent, key selection criteria include burst order control (linear/interleaved), synchronous self-timed write timing, byte-write capability, and ZZ sleep mode power management - all critical for deterministic latency in telecom and test equipment memory interfaces.
Technical Context
The device implements a synchronous flow-through architecture where all inputs (address, WE, BWx, ADV/LD) are registered on the rising edge of CLK, qualified by CEN. Internal burst logic supports linear or interleaved addressing based on MODE pin state, enabling predictable access patterns for cache-like behavior.
It integrates ECC encoding/decoding logic to detect and correct single-bit errors in real time, reducing SER without external logic. Output drivers are synchronously tristated during write data cycles and CE deselection, eliminating bus contention without requiring external OE timing coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 or 1M × 18 configuration) |
| Max Clock Frequency | 133 MHz - enables continuous data transfer every clock cycle with no dead cycles |
| Access Time (tCO) | 6.5 ns - defines minimum clock-to-valid-output delay for timing-critical read paths |
| ECC Support | On-chip single-bit error correction - maintains data integrity in neutron-rich environments |
| I/O Voltage | 3.3 V/2.5 V (VDDQ) - allows interoperability with mixed-voltage system buses |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm) - JEDEC-standard Pb-free footprint for industrial reflow compatibility |
| Sleep Mode | ZZ input (asynchronous active-HIGH) - reduces standby current while preserving memory contents |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, JEDEC-standard footprint with exposed pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK, CEN | Clock input and enable | CLK sampled only when CEN = LOW; enables cycle extension and low-power clock gating |
| A[0:1], ADV/LD | Burst address control | A[1:0] feed internal 2-bit counter; ADV/LD selects between auto-increment and address load modes |
| BWA–BWD, WE | Byte write control | Four independent byte masks + global WE allow granular 8-bit writes within 36-bit word |
| CE1, CE2, CE3 | Chip select hierarchy | Three enables support 3-state bank decoding without external logic; CE2 is active HIGH, others active LOW |
| DQ[0:35], DQP[A:D] | Data and parity I/O | 36 data + 4 parity lines operate synchronously; direction controlled by OE and internal write sequencing |
| ZZ, OE | Power and output control | ZZ places device in non-time-critical sleep; OE is asynchronous but masked during writes to prevent bus conflicts |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency (NoBL™) architecture | Eliminates dead cycles between consecutive read/write operations - enables 100% bus utilization at 133 MHz |
| Synchronous self-timed writes | Removes external write pulse timing constraints - simplifies controller design and improves timing margin |
| Configurable burst order (MODE pin) | Linear or interleaved addressing selected at power-up - matches legacy ZBT™ or modern cache-line access patterns |
| Automatic output tristating | Outputs disable synchronously during write data phase - prevents bus contention without OE timing coordination |
| Three chip enables with mixed polarity | CE1/CE3 active LOW, CE2 active HIGH - enables direct connection to FPGA/ASIC address decoders without inverters |
Applications
| Networking Packet Buffer | Real-Time DSP Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/25G Ethernet line cards with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as dual-port-accessible buffer between MAC and traffic manager ASICs. Use Value: 6.5 ns tCO and NoBL™ architecture ensure deterministic sub-8 ns read-to-read turnaround - meeting 10 ns worst-case pipeline timing. |
Use Scenario: Serving as coefficient/data memory in radar signal processing FPGAs requiring burst-mode FFT access. IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly to FPGA DDR memory controllers with linear burst alignment. Use Value: Interleaved/linear burst mode selection via MODE pin enables optimal match to FFT butterfly memory access stride patterns. |
| Test Equipment Waveform Memory | Industrial Motion Controller Buffer |
|
Use Scenario: Capturing and replaying high-fidelity analog waveforms in automated test systems with >100 MS/s sampling. IC Role / Device Role / Timing Role: Flow-through SRAM buffering digitized samples between ADC and waveform generator DAC paths. Use Value: Byte-write capability (BWA–BWD) allows partial updates of waveform segments without full-word overwrite overhead. |
Use Scenario: Holding real-time position/velocity profiles and PID coefficients in servo drive microcontrollers. IC Role / Device Role / Timing Role: ECC-protected SRAM ensuring data integrity across extended operating life in factory-floor EMI environments. Use Value: On-chip ECC reduces uncorrectable bit errors by >99.9% under neutron irradiation - extending MTBF beyond 15 years. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L133PF | 18-Mbit (512K × 36), 133 MHz, no on-chip ECC, supports ZBT™ but not NoBL™ | Lacks hardware ECC - requires external error handling in radiation-sensitive deployments | Select when ECC is managed at system level and ZBT™ compatibility is mandatory |
| ISSI IS61WV102436BLL-133TQLI | 18-Mbit (1M × 18), 133 MHz, no ECC, 100-pin TQFP, compatible pinout but different BWx mapping | Supports only ×18 organization - limits flexibility in ×36 bus designs | Select for cost-sensitive ×18-only systems where ECC is unnecessary and layout reuse is prioritized |
Compared with IDT72V2115L133PF and IS61WV102436BLL-133TQLI, CY7C1371KV33-133AXC uniquely delivers integrated ECC, NoBL™ zero-latency operation, and configurable ×36/×18 organization - making it the only choice for safety-critical, high-throughput memory subsystems requiring guaranteed data integrity and deterministic timing.
Availability
CY7C1371KV33-133AXC is available at Aetrix Electronics and suitable for networking packet buffers, real-time DSP memory subsystems, and industrial motion controller buffers requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1371KV33-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC® programmable systems-on-chip, and USB-C/USB-PD solutions.
CY7C1371KV33 belongs to Cypress's NoBL™ SRAM product line, engineered for deterministic latency and unlimited back-to-back read/write throughput in telecom infrastructure and test instrumentation.
FAQ
What is the function of the MODE pin on CY7C1371KV33-133AXC?
The MODE pin is a strap input that configures burst addressing order: tied to GND for linear burst sequence (0,1,2,3…), or to VDD/floating for interleaved burst (0,2,4,6…,1,3,5,7…). It is sampled at power-up and remains static during operation - no runtime reconfiguration is supported.
How does the ZZ sleep mode affect data retention and wake-up timing?
In ZZ mode (pin driven HIGH), the device enters a non-time-critical sleep state with full data retention and reduced current draw. Wake-up occurs synchronously on the next valid CLK edge after ZZ returns LOW, with no additional latency beyond standard access timing - no initialization sequence is required.
Can CY7C1371KV33-133AXC operate with 2.5 V VDDQ while using 3.3 V VDD?
Yes - VDD (core) must be 3.3 V ±0.3 V, while VDDQ (I/O) supports 2.5 V ±0.2 V or 3.3 V ±0.3 V independently. This allows interfacing with 2.5 V FPGAs or ASICs while maintaining full 133 MHz performance and 6.5 ns tCO specification.
Is the ECC functionality optional or always active?
ECC is always active and transparent - all reads return corrected data, and all writes automatically generate updated parity bits. There is no register or pin to disable ECC; it operates at full speed with no performance penalty or additional latency.
CY7C1371KV33-133AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1371KV33-133AXC FAQ
1.How can I place an order for CY7C1371KV33-133AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1371KV33-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1371KV33-133AXC reliable?
The price and inventory of CY7C1371KV33-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1371KV33-133AXC is usually 5 days.
3.What payment methods are accepted for CY7C1371KV33-133AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1371KV33-133AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1371KV33-133AXC?
CY7C1371KV33-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1371KV33-133AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1371KV33-133AXC?
For technical support, including CY7C1371KV33-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1371KV33-133AXC requirements.
6.How does Aetrix verify that CY7C1371KV33-133AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1371KV33-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1371KV33-133AXC meets industry standards.
7.What is the process for return or replacement of CY7C1371KV33-133AXC?
All CY7C1371KV33-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1371KV33-133AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1371KV33-133AXC part is unused and in its original packaging.
Return procedure for CY7C1371KV33-133AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1371KV33-133AXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

