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Infineon Technologies CY7C1371KVE33-100AXI

Part No.:
CY7C1371KVE33-100AXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1371KVE33-100AXI.pdf
Description:
IC SRAM 18MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,138

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Product details

Overview

CY7C1371KVE33-100AXI from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM (512K × 36 or 1M × 18) with NoBL™ architecture and on-chip ECC, designed for high-throughput memory buffering in networking and telecom data paths. It supports 100 MHz zero-wait-state operation, delivers 6.5 ns clock-to-output delay, and features registered inputs, byte-write capability, and three chip enables for depth expansion.

For engineers reviewing the CY7C1371KVE33-100AXI datasheet, CY7C1371KVE33-100AXI pinout, CY7C1371KVE33-100AXI application, or CY7C1371KVE33-100AXI equivalent, key selection criteria include burst order configuration (linear/interleaved), VDDQ voltage tolerance (2.5 V/3.3 V), ZZ sleep mode behavior, and ECC correction coverage for soft error mitigation in mission-critical systems.

Technical Context

This SRAM implements a synchronous, clocked interface with all address, control, and data inputs registered on the rising edge of CLK. Its NoBL™ architecture eliminates bus latency by enabling true back-to-back read/write cycles without dead cycles - data transfers occur on every clock edge.

The device integrates on-chip ECC encoding/decoding for single-bit error correction and double-bit error detection, uses internal self-timed write circuitry, and supports both linear and interleaved burst orders via the MODE strap pin. Output drivers are synchronously tristated during write data phases to prevent bus contention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density18 Mbit (512K × 36 or 1M × 18 configuration)
Max Clock Frequency100 MHz - enables zero-wait-state operation in synchronous bus systems
Access Time (tAC)8.5 ns - maximum clock-to-output delay at 100 MHz, defining real-time data availability
ECC SupportOn-chip SEC-DED - corrects single-bit errors and detects double-bit errors in stored data
VDDQ Supply Range2.5 V or 3.3 V - configurable I/O voltage for compatibility with mixed-voltage system interfaces
Burst OrderSelectable via MODE pin - linear or interleaved addressing for cache-line or DMA-aligned access patterns
Power-Down ModeZZ sleep input - reduces standby current while preserving data integrity without external refresh

Pinout & Package

Package: 100-pin TQFP (14 mm × 20 mm × 1.4 mm, JEDEC-standard Pb-free).

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputSynchronous address bus sampled on CLK rising edge; A[1:0] drive internal 2-bit burst counter
BWA–BWDByte Write EnableActive-low synchronous controls for selective 8-bit writes within 36-bit data word
CLK, CENClock & EnableCLK qualified by CEN; CEN HIGH suspends clock recognition and extends previous cycle
CE1, CE2, CE3Chip Enable GroupThree synchronous enables (CE1/CE3 active LOW, CE2 active HIGH) for bank selection and depth expansion
DQPA–DQPDData Parity I/OFour parity bits (one per 9-bit byte) supporting ECC encoding/decoding across full 36-bit bus
MODEBurst ConfigurationStrap pin: GND = linear burst; VDD/floating = interleaved burst - sets address increment pattern
ZZAsynchronous SleepActive-HIGH input placing device in low-power sleep with data retention; internal pull-down ensures safe default

Key Features

FeatureDesign Value
No Bus Latency (NoBL™)Enables consecutive read/write operations with no dead cycles - critical for packet buffering in line-rate switches
Registered Synchronous InterfaceAll control and address inputs latched on CLK rising edge - simplifies timing closure in high-speed PCB layouts
On-Chip ECC (SEC-DED)Reduces soft error rate in radiation-prone environments without requiring external error-handling logic
Flexible Burst OrderingHardware-selectable linear or interleaved burst via MODE pin - matches CPU cache or DMA controller expectations
Multi-VDDQ CompatibilitySupports 2.5 V or 3.3 V I/O signaling - allows integration into legacy and next-gen FPGA/ASIC memory subsystems

Applications

High-Speed Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress Ethernet or SONET frames in multi-gigabit line cards where deterministic latency is required.

IC Role / Device Role / Timing Role: Primary flow-through buffer between SERDES and traffic manager ASIC, operating at 100 MHz with zero wait states.

Use Value: NoBL™ architecture ensures back-to-back frame writes and reads without pipeline stalls, maintaining full line-rate throughput.

Use Scenario: Serving as shared memory for channelized TDM switching in carrier-grade base station controllers.

IC Role / Device Role / Timing Role: Dual-port-accessible SRAM used for time-slot assignment tables and jitter buffers in synchronous digital hierarchy (SDH) systems.

Use Value: On-chip ECC protects against cosmic-ray-induced bit flips in outdoor equipment, reducing uncorrectable frame loss.

Network Processor Co-Processor MemoryRadar Signal Processing Buffer

Use Scenario: Offloading packet classification and lookup table storage from network processors in enterprise firewalls.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory accessed via burst reads/writes synchronized to NP's internal clock domain.

Use Value: Byte-write capability and three CE pins allow efficient partitioning of memory space across multiple functional blocks.

Use Scenario: Capturing and staging pulse-Doppler radar return samples before FFT processing in airborne avionics systems.

IC Role / Device Role / Timing Role: Low-latency, deterministic-access buffer interfacing directly with ADC output and DSP input buses.

Use Value: ZZ sleep mode enables power gating between radar sweeps, cutting idle power by >80% without data loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C331025B-100BINNo on-chip ECC; 100 MHz, 32M × 36 density; different burst control scheme (no MODE pin)Lacks hardware-based error correction - requires external ECC logic for SER-sensitive deploymentsChoose when cost sensitivity outweighs reliability requirements and system-level ECC is already implemented
IS61WV102432BLL-100BLI100 MHz, 32M × 32 density; no NoBL™ architecture - introduces 1-cycle latency between read/write transitionsLower bandwidth efficiency in mixed-access workloads due to mandatory dead cyclesPrefer only if pinout compatibility with legacy IS61WV designs is mandatory and latency budget permits

Compared with AS7C331025B-100BIN and IS61WV102432BLL-100BLI, CY7C1371KVE33-100AXI uniquely combines NoBL™ zero-latency operation, integrated SEC-DED ECC, and flexible burst ordering - making it optimal for telecom infrastructure where both throughput and data integrity are non-negotiable.

Availability

CY7C1371KVE33-100AXI is available at Aetrix Electronics and suitable for high-reliability networking equipment, telecom line cards, and radar signal processing systems requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1371KVE33-100AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.

CY7C1371KVE33-100AXI belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, low-latency memory buffering in packet-switched and time-sensitive signal processing systems.

FAQ

What is the function of the MODE pin on CY7C1371KVE33-100AXI?

The MODE pin selects burst addressing order: tied to GND for linear burst (sequential increment), or to VDD/floating for interleaved burst (bit-swapped increment). This setting is sampled at power-up and remains fixed until reset. It directly determines how the internal burst counter generates successive addresses during burst accesses, aligning with CPU cache or DMA controller expectations.

Does CY7C1371KVE33-100AXI require an external clock buffer for 100 MHz operation?

No external clock buffer is required. The device accepts a clean, single-ended CMOS clock signal directly on the CLK pin, provided setup/hold times (≥1.5 ns) and jitter (<0.15 UI) specifications are met. Input clock conditioning is handled internally via synchronous register sampling, and CEN provides precise clock gating without introducing skew.

How does the ZZ sleep mode interact with ongoing burst operations?

Asserting ZZ HIGH during an active burst sequence completes the current access but places the device in sleep mode immediately afterward. Data integrity is preserved, and no refresh is needed. All outputs go high-impedance, and internal clocks halt. Resuming operation requires deasserting ZZ and waiting one clock cycle before issuing new commands - no initialization sequence is required.

Can CY7C1371KVE33-100AXI operate with VDD = 3.3 V and VDDQ = 2.5 V simultaneously?

Yes. VDD powers the core logic (3.3 V nominal), while VDDQ independently supplies the I/O buffers (2.5 V or 3.3 V). This dual-supply design allows direct interfacing with 2.5 V FPGAs or ASICs while maintaining full 3.3 V core performance. Both supplies must be ramped monotonically during power-up, with VDDQ reaching regulation before or concurrently with VDD.

CY7C1371KVE33-100AXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1371KVE33-100AXI FAQ

1.How can I place an order for CY7C1371KVE33-100AXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1371KVE33-100AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1371KVE33-100AXI reliable?

The price and inventory of CY7C1371KVE33-100AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1371KVE33-100AXI is usually 5 days.

3.What payment methods are accepted for CY7C1371KVE33-100AXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1371KVE33-100AXI transactions.

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4.How is shipping managed for CY7C1371KVE33-100AXI?

CY7C1371KVE33-100AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1371KVE33-100AXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1371KVE33-100AXI?

For technical support, including CY7C1371KVE33-100AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1371KVE33-100AXI requirements.

6.How does Aetrix verify that CY7C1371KVE33-100AXI is sourced from the original manufacturer or authorized distributors?

All CY7C1371KVE33-100AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1371KVE33-100AXI meets industry standards.

7.What is the process for return or replacement of CY7C1371KVE33-100AXI?

All CY7C1371KVE33-100AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1371KVE33-100AXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1371KVE33-100AXI part is unused and in its original packaging.

Return procedure for CY7C1371KVE33-100AXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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