Infineon Technologies CY7C1372D-200AXC

Overview

CY7C1372D-200AXC from Infineon Technologies is a 1-Mbit (64K × 16) synchronous static RAM (SSRAM) with QDR™ II architecture, 200 MHz clock frequency, 3.3 V core/interface supply, and flow-through pipelined read operation. It supports burst lengths of 2, 4, or 8 and is used in high-speed networking buffers, packet classification engines, and FPGA co-processor caches.

For engineers reviewing the CY7C1372D-200AXC datasheet, CY7C1372D-200AXC pinout, CY7C1372D-200AXC application, or CY7C1372D-200AXC equivalent, key selection criteria include QDR-II timing compliance, 200 MHz double-data-rate interface, 3.3 V I/O compatibility, and flow-through vs. registered latency mode configuration.

Technical Context

This QDR-II SSRAM implements separate, independent read and write data buses to enable concurrent access-critical for full-duplex packet buffering in switch fabric controllers. Its dual-clock architecture uses K for writes and K# for reads, with programmable CAS latency (1.5 or 2.5 cycles) and burst termination on-the-fly.

The device features internal self-timed write cycles, differential clock inputs (K/K#), and LVDS-compatible output drivers. It supports byte-wide write masking (BW#) and operates across industrial temperature range (–40°C to +85°C) in a 100-pin TQFP package with 0.5 mm pitch.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm, 0.5 mm pitch, lead-free and RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SSRAM applications.

Compared with CY7C1372D-200AXC, the CY7C1371D variant adds parity support at same speed but requires parity-aware controller logic, while the AS7C362000B offers lower-cost single-ended interfacing at the expense of timing robustness in high-noise environments.

Availability

CY7C1372D-200AXC is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom line cards, FPGA-accelerated compute modules, and industrial packet inspection systems requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1372D-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, memory, and security solutions, with global R&D and manufacturing infrastructure.

CY7C1372D belongs to Infineon's legacy Cypress QDR-II SSRAM product line, designed specifically for high-bandwidth, low-latency buffering in networking and communications infrastructure.

FAQ

What is the maximum supported burst length for CY7C1372D-200AXC?

The device supports burst lengths of 2, 4, or 8 words, configured via the MODE pin at power-up. Burst length determines how many consecutive 16-bit words are transferred per read or write command and must be matched to the controller's burst capability and memory access pattern.

Does CY7C1372D-200AXC require external termination resistors?

Yes - the Q[15:0] outputs are LVDS-compatible and require 100 Ω differential termination across each pair (e.g., Q0/Q0#) at the receiver end. The device does not integrate termination; improper termination causes signal integrity degradation and timing violations above 150 MHz.

Can CY7C1372D-200AXC operate with a single-ended clock?

No - it requires true differential K/K# clock inputs. Driving K with a single-ended signal and tying K# to VDD or GND violates AC timing specifications and disables proper read path operation. A dedicated differential clock source or fanout buffer is mandatory.

Is CY7C1372D-200AXC pin-compatible with earlier CY7C137x generations?

No - while functionally similar to CY7C1370/1371, the CY7C1372D uses a distinct 100-pin TQFP footprint with relocated power/ground pins and updated control signal assignments. PCB redesign is required for migration from prior versions.