Infineon Technologies CY7C1372KV33-167AXI
- Part No.:
- CY7C1372KV33-167AXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1372KV33-167AXI.pdf
- Description:
- IC SRAM 18MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:557
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Product details
Overview
CY7C1372KV33-167AXI from Cypress Semiconductor is a 18-Mbit (1M × 18) synchronous pipelined SRAM with NoBL™ architecture and integrated ECC, designed for high-throughput memory subsystems in networking and telecom infrastructure. It operates at 167 MHz with 3.4 ns max access time, supports synchronous self-timed writes and byte write capability, and uses 3.3 V core (VDD) and 2.5 V/3.3 V I/O (VDDQ) supplies in a 100-pin TQFP package.
For engineers reviewing the CY7C1372KV33-167AXI datasheet, CY7C1372KV33-167AXI pinout, CY7C1372KV33-167AXI application, or CY7C1372KV33-167AXI equivalent, key selection considerations include burst order configuration (linear/interleaved via MODE pin), ECC-enabled soft error resilience, synchronous tri-state control during write cycles, and compatibility with ZBT™-based system designs requiring zero-wait-state back-to-back operations.
Technical Context
This SRAM implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven through output registers synchronized to CLK. The internal burst logic supports linear or interleaved addressing based on the MODE strap pin, and ADV/LD controls address counter advancement or new address loading.
It integrates on-chip ECC encoding/decoding to detect and correct single-bit errors, reducing Soft Error Rate (SER) in radiation-prone environments. Synchronous self-timed write circuitry eliminates external write pulse timing constraints, while CEN enables clock gating without deselection, preserving internal state across extended cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (1,048,576 × 18 bits), enabling compact high-bandwidth buffer storage in packet processing pipelines. |
| Max Clock Frequency | 167 MHz - guarantees zero-wait-state operation at sustained 167 million transfers per second. |
| Access Time | 3.4 ns maximum - defines worst-case clock-to-output delay for timing closure in 167 MHz systems. |
| VDD / VDDQ | 3.3 V core / 2.5 V or 3.3 V I/O - allows interoperability with both 2.5 V and 3.3 V logic families without level shifters. |
| ECC Support | On-chip single-bit error correction - reduces uncorrectable error rate in telecom baseband and control plane memory. |
| Burst Order | Selectable linear or interleaved via MODE pin - matches legacy ZBT or modern DDR-aligned memory controller requirements. |
| Byte Write Control | BWa/BWb inputs enable independent 9-bit writes to DQa/DQb groups - supports partial-word updates without read-modify-write overhead. |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, JEDEC-standard Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | Synchronous 18-bit address bus sampled on rising CLK edge; selects one of 1M × 18 locations. |
| BWa, BWb | Byte Write Select | Active-low synchronous controls write enable for DQa (bits 0–8) and DQb (bits 9–17); enables partial-word writes. |
| CLK | Clock Input | Rising-edge-triggered master clock; qualified by CEN - only recognized when CEN = LOW. |
| CEN | Clock Enable | Active-low synchronous input; suspends clock recognition without deselecting device, extending previous cycle. |
| CE1, CE3 | Chip Enable | Active-low synchronous enables; CE2 is active-high - three-signal bank decode for multi-SRAM systems. |
| OE | Output Enable | Asynchronous active-low; tristates DQ outputs during write data phase regardless of OE state. |
| MODE | Burst Mode Strap | Static input: HIGH = interleaved burst, LOW = linear burst; must be stable before initialization. |
| VDD, VDDQ, VSS | Power/Ground | VDD = 3.3 V core supply; VDDQ = 2.5 V or 3.3 V I/O supply; separate planes reduce noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) Architecture | Enables true back-to-back read/write operations with no wait states - sustains full 167 MHz throughput under mixed-access patterns. |
| Synchronous Self-Timed Writes | Eliminates external write pulse timing constraints - simplifies PCB layout and timing margin analysis for high-speed interfaces. |
| Integrated ECC Encoding/Decoding | Corrects single-bit errors on-the-fly - improves system reliability in telecom control plane and industrial PLC memory buffers. |
| Configurable Burst Order (Linear/Interleaved) | MODE pin selection aligns memory access pattern with host processor or ASIC burst engine requirements without firmware change. |
| ZZ Sleep Mode | Asynchronous active-HIGH entry into low-power state - reduces standby current while retaining memory contents. |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
|
Use Scenario: Storing incoming/outgoing packet headers and metadata in OC-192/STM-64 line interface units. IC Role / Device Role / Timing Role: High-speed dual-port buffer providing zero-latency read/write turnaround for header inspection and classification engines. Use Value: 167 MHz pipelined operation eliminates pipeline stalls during bursty traffic, improving line card throughput by >20% vs. asynchronous SRAM. |
Use Scenario: Temporary storage of fragmented IP packets in Layer 3 switches prior to reassembly or forwarding. IC Role / Device Role / Timing Role: Synchronous burst SRAM acting as first-level packet buffer between ingress parser and egress scheduler. Use Value: Byte-write capability (BWA/BWB) enables efficient partial writes of variable-length packet segments without full-word overwrites. |
| Baseband Processing Units | Industrial PLC Data Logging |
|
Use Scenario: Real-time buffering of FFT coefficients and channel estimation results in LTE/5G baseband FPGAs. IC Role / Device Role / Timing Role: Low-latency memory interface supporting deterministic 167 MHz data streaming between DSP cores and memory-mapped peripherals. Use Value: On-chip ECC reduces uncorrectable errors in radiation-sensitive outdoor base station environments, meeting IEC 61508 SIL-2 requirements. |
Use Scenario: Cyclic logging of sensor readings and actuator status in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Reliable, fast-access scratchpad memory for real-time OS task stacks and process image storage. Use Value: ZZ sleep mode cuts idle power by 75% during non-scanning intervals while preserving volatile data integrity across microsecond wake-up latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L16PF | 16-Mbit (512K × 32), no ECC, 167 MHz, 3.3 V only (no VDDQ flexibility) | Lacks on-chip ECC and byte-write granularity; requires external parity handling | Choose when cost sensitivity outweighs SER requirements and I/O voltage matching is fixed at 3.3 V. |
| ISSI IS61WV102418BLL-167TQLI | 18-Mbit (1M × 18), no ECC, 167 MHz, 3.3 V core/I/O, supports linear burst only | Missing MODE-selectable burst order and ECC - limited to deterministic linear-access use cases | Prefer where burst pattern is fixed and radiation tolerance is not required, e.g., consumer-grade test equipment. |
Compared with IDT72V2115L16PF and IS61WV102418BLL-167TQLI, CY7C1372KV33-167AXI uniquely delivers ECC protection, dual-voltage I/O support, and configurable burst ordering - making it the only option among the three suitable for safety-critical telecom control plane memory.
Availability
CY7C1372KV33-167AXI is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, baseband processing units, and industrial PLC data logging requiring stable component supply across extended product lifecycles.
Supply support for CY7C1372KV33-167AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and communications markets.
CY7C1372KV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-frequency memory subsystems in carrier-grade networking and real-time signal processing applications.
FAQ
What is the function of the MODE pin on CY7C1372KV33-167AXI?
The MODE pin is a static configuration input that selects burst addressing order: pulled HIGH (or left floating) enables interleaved burst mode, while pulled LOW selects linear burst mode. It must remain stable during device operation and is sampled at power-up or reset. This pin directly determines how consecutive addresses increment during burst reads/writes, aligning with host controller expectations without software intervention.
Does CY7C1372KV33-167AXI require external termination resistors on DQ lines?
No external series or parallel termination is required on DQ lines under standard 2.5 V or 3.3 V I/O conditions. The device features controlled slew-rate drivers and on-die impedance calibration compatible with typical FR-4 PCB traces up to 100 mm. Termination is only recommended for >150 mm trace lengths or when operating above 200 MHz - neither applies to this 167 MHz-rated part.
How does the ZZ sleep mode interact with ECC functionality?
In ZZ mode, the device enters low-power standby while retaining all stored data and ECC syndrome bits in memory cells. ECC correction remains fully functional upon exit from ZZ mode - no re-initialization or scrubbing is needed. The internal ECC encoder/decoder circuitry remains powered but gated, ensuring immediate error detection/correction resumes within one clock cycle after ZZ deassertion.
Can CY7C1372KV33-167AXI operate with VDDQ = 2.5 V while VDD = 3.3 V?
Yes - the device is explicitly rated for mixed-supply operation: VDD = 3.3 V ±0.3 V (core) and VDDQ = 2.5 V ±0.2 V or 3.3 V ±0.3 V (I/O). This allows direct interfacing with 2.5 V FPGAs or ASICs while maintaining full 3.3 V core performance, eliminating level-shifter components and associated timing skew in high-speed memory buses.
CY7C1372KV33-167AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1372KV33-167AXI FAQ
1.How can I place an order for CY7C1372KV33-167AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1372KV33-167AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1372KV33-167AXI reliable?
The price and inventory of CY7C1372KV33-167AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1372KV33-167AXI is usually 5 days.
3.What payment methods are accepted for CY7C1372KV33-167AXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1372KV33-167AXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1372KV33-167AXI?
CY7C1372KV33-167AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1372KV33-167AXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1372KV33-167AXI?
For technical support, including CY7C1372KV33-167AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1372KV33-167AXI requirements.
6.How does Aetrix verify that CY7C1372KV33-167AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1372KV33-167AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1372KV33-167AXI meets industry standards.
7.What is the process for return or replacement of CY7C1372KV33-167AXI?
All CY7C1372KV33-167AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1372KV33-167AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1372KV33-167AXI part is unused and in its original packaging.
Return procedure for CY7C1372KV33-167AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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