Infineon Technologies CY7C1372KV33-200AXC

Overview

CY7C1372KV33-200AXC from Cypress Semiconductor is a 18-Mbit (1M × 18) synchronous pipelined SRAM with NoBL™ architecture and on-chip ECC, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 200 MHz with zero wait states, supports synchronous self-timed writes, and features 3.3 V core (VDD) and 2.5 V/3.3 V I/O (VDDQ) supplies.

For engineers reviewing the CY7C1372KV33-200AXC datasheet, CY7C1372KV33-200AXC pinout, CY7C1372KV33-200AXC application, or CY7C1372KV33-200AXC equivalent, key selection considerations include burst order configuration (linear/interleaved via MODE pin), byte-write control (BWa–BWb), clock enable (CEN) for cycle extension, and ZZ sleep mode for power management in burst-intensive systems.

Technical Context

This SRAM implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. The internal burst logic supports linear or interleaved addressing based on the MODE strap pin, enabling compatibility with legacy ZBT™-based bus protocols.

It integrates on-chip ECC encoding/decoding to detect and correct single-bit errors, reducing soft error rate in radiation-sensitive environments. Synchronous self-timed write circuitry eliminates external write pulse timing constraints, while internally controlled output buffer timing removes dependency on asynchronous OE for clean bus handoff during read-to-write transitions.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (JEDEC-standard Pb-free, 14 mm × 20 mm × 1.4 mm body height).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IDT72V2115L10PF and IS61WV102418BLL-100TQLI, CY7C1372KV33-200AXC delivers 2× higher bandwidth, deterministic zero-wait-state operation, and integrated ECC - making it uniquely suited for next-generation telecom and defense systems demanding reliability and throughput.

Availability

CY7C1372KV33-200AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, industrial PLC data logging, and radar signal processing applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1372KV33-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1372KV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth memory interfacing in packet-switched infrastructure and real-time embedded systems.

FAQ

What is the function of the MODE pin on CY7C1372KV33-200AXC?

The MODE pin is a static configuration input that selects burst addressing order: pulled HIGH for interleaved burst (e.g., 0x0000, 0x0002, 0x0001, 0x0003), or LOW for linear burst (e.g., 0x0000, 0x0001, 0x0002, 0x0003). It must be set before initialization and held stable during operation; floating defaults to HIGH. This setting directly maps to host processor burst expectations without software intervention.

Does CY7C1372KV33-200AXC require external termination resistors on DQ lines?

No external series or parallel termination is required on DQ or DQP lines. The device incorporates programmable output drive strength and slew rate control per I/O bank, and its 100-pin TQFP layout complies with JEDEC impedance guidelines for 50 Ω trace routing. System-level termination should follow board stack-up and length-based SI analysis, not device specification.

Can CY7C1372KV33-200AXC operate with VDDQ = 2.5 V while VDD = 3.3 V?

Yes - VDDQ is independently supplied and rated for 2.5 V ±0.2 V or 3.3 V ±0.3 V, while VDD is strictly 3.3 V ±0.3 V. This dual-voltage I/O enables direct interfacing with 2.5 V FPGAs or ASICs without level shifters, provided VDDQ stability is maintained within spec during all operational modes including ZZ sleep.

How does the ZZ sleep mode interact with ongoing burst transfers?

Asserting ZZ HIGH terminates all internal operations immediately: clock is ignored, outputs go high-Z, and core current drops to <50 µA. Any incomplete burst transfer is aborted - no data corruption occurs, but the host must reinitialize the burst sequence after ZZ deassertion. This behavior is documented in the "Sleep Mode" section of the datasheet (Rev. *H, Page 10).