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Infineon Technologies CY7C1380C-133AC
- Part No.:
- CY7C1380C-133AC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1380C-133AC.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,249
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Product details
Overview
CY7C1380C-133AC from Cypress Semiconductor is a 18-Mb synchronous pipelined SRAM (512K × 36-bit organization) with registered inputs/outputs, 3.3V core supply, 2.5V/3.3V I/O compatibility, and 4.2 ns clock-to-output delay at 133 MHz - deployed in high-speed cache and buffer subsystems of network processors and telecom line cards.
For engineers reviewing the CY7C1380C-133AC datasheet, CY7C1380C-133AC pinout, CY7C1380C-133AC application, or CY7C1380C-133AC equivalent, this device requires attention to burst mode selection (MODE pin), dual chip-enable timing (CE1/CE2), byte-write control (BWA–BWD + BWE), and JTAG boundary-scan support in fBGA packages.
Technical Context
The CY7C1380C-133AC implements a two-bit synchronous burst counter controlled by ADV, ADSP/ADSC strobes, and MODE pin configuration to generate Intel Pentium-compatible interleaved or linear address sequences. All address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK.
It supports synchronous self-timed writes with user-selectable byte-width (1–4 bytes via BWx pins), global write (GW), and asynchronous output enable (OE) with tri-state control. The device integrates separate processor (ADSP) and controller (ADSC) address strobes for multiprocessor bus arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mb (512K × 36-bit) - provides full-word parallel access for 32-bit+ data buses with parity or ECC extension. |
| Max Clock Frequency | 133 MHz - defines maximum sustained burst throughput of 133 million words/sec in pipelined read/write cycles. |
| Clock-to-Output Delay | 4.2 ns - determines minimum read cycle latency from CLK edge to valid DQ output, critical for setup timing closure. |
| Core Supply Voltage | 3.3 V ± 0.3 V - powers internal logic and memory array; requires dedicated low-noise regulation and decoupling. |
| I/O Supply Voltage | 2.5 V or 3.3 V - enables direct interfacing with both LVTTL and SSTL_25 I/O standards without level shifters. |
| Burst Mode Control | MODE pin (strap) - selects Intel interleaved (VDD/floating) or linear (GND) burst sequence; must remain static during operation. |
| Byte Write Capability | Four independent byte lanes (BWA–BWD) + BWE - allows partial-word writes without read-modify-write overhead. |
Pinout & Package
Package: 100-pin TQFP (JEDEC standard, body size 14 mm × 14 mm, 0.5 mm pitch). Pinout validated per Cypress Document #38-05237 Rev. *D, Pages 4–8.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Input | 19-bit address bus sampled on CLK rise when ADSP or ADSC active; A1:A0 load burst counter. |
| DQPA–DQPD, DQA–DQD | Bidirectional Data I/O (36-bit) | 36-bit data path with separate nibble groups; direction controlled by OE; registered input/output. |
| CE1, CE2, CE3 | Synchronous Chip Enable | CE1 (active LOW) primary enable; CE2 (active HIGH), CE3 (active LOW) support depth expansion in TQFP/fBGA. |
| ADSP / ADSC | Address Strobe (Processor / Controller) | Edge-triggered strobes for address capture; ADSP takes priority when both asserted. |
| BWA–BWD, BWE, GW | Byte Write Control | BWE enables byte write; BWx select 4-byte lanes; GW overrides BWx to write all 36 bits simultaneously. |
| OE | Asynchronous Output Enable | Active LOW; tri-states DQ/DQP pins when HIGH; masked during first clock after chip deselect. |
| ZZ | Asynchronous Sleep Input | Active HIGH; reduces standby current to ~70 mA while preserving data; internal pull-down. |
| MODE | Burst Sequence Select | Static strap pin: GND = linear burst, VDD/floating = Intel interleaved; no runtime change allowed. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Synchronous Interface | Registered address/data/control inputs and outputs eliminate external latch requirements and simplify timing closure at 133 MHz. |
| Configurable Burst Order | Hardware-strapped MODE pin supports either Intel Pentium interleaved or linear burst - matches legacy CPU bus protocols without firmware overhead. |
| Flexible Byte Write Architecture | Four independent byte write enables (BWA–BWD) + global write (GW) allow precise 8/16/32/36-bit writes without read-modify-write cycles. |
| Dual I/O Voltage Support | Separate VDDQ (2.5 V or 3.3 V) enables direct connection to mixed-voltage SoCs or FPGAs without external level translators. |
| JTAG Boundary Scan (fBGA only) | TCK/TMS/TDI/TDO pins support IEEE 1149.1 compliance for board-level test and interconnect verification in high-density layouts. |
Applications
| Network Processor Cache | Telecom Line Card Buffer |
|---|---|
|
Use Scenario: High-throughput packet buffering and header processing in 10Gbps+ line cards requiring deterministic latency. IC Role / Device Role / Timing Role: Primary burst-access SRAM serving as L2 cache for multi-core NPU clusters, synchronized to system clock domain. Use Value: 4.2 ns clock-to-output and 133 MHz pipelined operation enable sub-8 ns read turnaround, meeting strict jitter budgets for real-time traffic shaping. |
Use Scenario: Frame assembly/disassembly buffers in SONET/SDH framer ASICs interfacing with SerDes PHYs. IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via ADSP/ADSC strobes for concurrent CPU and DMA access to shared memory space. Use Value: Separate processor/controller strobes and synchronous self-timed writes eliminate arbitration logic and reduce FPGA resource usage. |
| Industrial PLC Memory Expansion | Radar Signal Processing FIFO |
|
Use Scenario: Deterministic program/data storage extension for safety-critical motion controllers with IEC 61508 certification requirements. IC Role / Device Role / Timing Role: Nonvolatile-configured SRAM used as fast scratchpad memory with ZZ sleep mode for power-gated idle states. Use Value: 70 mA CMOS standby current and hardware sleep (ZZ) enable <100 mW quiescent power in extended low-power modes. |
Use Scenario: Real-time streaming buffer between ADC front-end and FFT accelerator in phased-array radar systems. IC Role / Device Role / Timing Role: High-bandwidth 36-bit wide memory staging FIFO accepting burst samples at 133 MHz clock rate. Use Value: 512K × 36-bit depth supports >18 Msample buffer capacity; pipelined interface sustains continuous 133 MT/s throughput without gaps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-133TQLI | 1024K × 36-bit, 3.3V core, 133 MHz, but lacks ADSP/ADSC dual-strobe and MODE-configurable burst. | Requires external logic for burst address generation; less suitable for Intel-compatible bus interfaces. | Select when deeper memory depth is required and burst protocol is fixed or handled externally. |
| MT48LC32M36A2-133:G | SDRAM-based (not SRAM); 32M × 36-bit, 133 MHz, but asynchronous command interface and refresh overhead. | Higher latency, non-deterministic timing due to refresh cycles; unsuitable for hard real-time buffering. | Select only for cost-sensitive, non-real-time applications where latency variability is acceptable. |
Compared with IS61WV102436BLL-133TQLI and MT48LC32M36A2-133:G, the CY7C1380C-133AC delivers deterministic pipelined timing, dual-address-strobe arbitration, and hardware-configurable burst - making it uniquely suited for CPU-attached cache and telecom control-plane buffers.
Availability
CY7C1380C-133AC is available at Aetrix Electronics and suitable for network processor cache, telecom line card buffer, and industrial PLC memory expansion requiring stable component supply across long-lifecycle deployments.
Supply support for CY7C1380C-133AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications infrastructure.
The CY7C1380C belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic, low-latency memory interfacing in CPU-attached and packet-processing subsystems.
FAQ
What is the function of the MODE pin on CY7C1380C-133AC?
The MODE pin is a static configuration input that selects burst address sequence: tied to GND for linear burst, or to VDD/floating for Intel Pentium interleaved burst. It must remain unchanged during device operation and has an internal pull-up resistor. This pin directly controls the two-bit burst counter's increment pattern and cannot be reconfigured dynamically.
Can CY7C1380C-133AC operate with 2.5V I/O while using 3.3V core supply?
Yes - the device supports independent VDDQ (2.5 V or 3.3 V) for I/O circuitry and VDD (3.3 V) for core logic. This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters. VDDQ and VDD must be powered in sequence per Cypress recommendations: VDD before VDDQ during power-up, and reverse during power-down.
How does the ZZ (sleep) pin affect power consumption and data retention?
When ZZ is driven HIGH, the device enters a low-power sleep state with typical standby current reduced to 70 mA while maintaining full data integrity. The internal pull-down ensures safe default (active) operation if left unconnected. No clock or address activity is required during sleep, and data remains valid indefinitely as long as VDD and VDDQ are maintained.
Is JTAG boundary scan supported on the CY7C1380C-133AC in TQFP package?
No - JTAG (TCK/TMS/TDI/TDO) is only available on the 119-ball BGA and 165-ball fBGA packages per the datasheet. The 100-pin TQFP variant (CY7C1380C-133AC) omits these pins entirely; boundary scan testing is not supported in this package option.
CY7C1380C-133AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1380C-133AC FAQ
1.How can I place an order for CY7C1380C-133AC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1380C-133AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1380C-133AC reliable?
The price and inventory of CY7C1380C-133AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1380C-133AC is usually 5 days.
3.What payment methods are accepted for CY7C1380C-133AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1380C-133AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1380C-133AC?
CY7C1380C-133AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1380C-133AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1380C-133AC?
For technical support, including CY7C1380C-133AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1380C-133AC requirements.
6.How does Aetrix verify that CY7C1380C-133AC is sourced from the original manufacturer or authorized distributors?
All CY7C1380C-133AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1380C-133AC meets industry standards.
7.What is the process for return or replacement of CY7C1380C-133AC?
All CY7C1380C-133AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1380C-133AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1380C-133AC part is unused and in its original packaging.
Return procedure for CY7C1380C-133AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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