Infineon Technologies CY7C1380C-167BZI

Overview

CY7C1380C-167BZI from Cypress Semiconductor is a 18-Mb synchronous pipelined SRAM configured as 512K × 36, operating at 167 MHz with 3.3 V core and 2.5/3.3 V I/O supply, registered inputs/outputs for burst-mode timing control, and IEEE 1149.1 JTAG boundary scan support - deployed in high-speed network packet buffers and CPU cache coherency subsystems.

For engineers reviewing the CY7C1380C-167BZI datasheet, CY7C1380C-167BZI pinout, CY7C1380C-167BZI application, or CY7C1380C-167BZI equivalent, key selection criteria include clock-to-output time (3.4 ns), byte-write granularity (BWA–BWD + BWE), dual chip-enable architecture (CE1/CE2/CE3), and JEDEC-standard 100-pin TQFP package compatibility with Intel Pentium burst protocols.

Technical Context

The CY7C1380C-167BZI implements a two-bit internal burst counter synchronized to CLK's rising edge, supporting both interleaved and linear burst sequences via the MODE pin. Address latching occurs only when ADSP or ADSC is active low and CE1 is asserted, enabling precise pipeline stage alignment across multi-cycle read/write operations.

All synchronous inputs - including A[1:0], ADV, GW, BWE, and BWx - are registered on the same clock edge, while OE and ZZ operate asynchronously to enable fast output enable assertion and low-power sleep entry without clock dependency. The device uses self-timed write cycles with user-selectable 1-, 2-, or 4-byte width controlled by BWx and BWE.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC standard, body size 14 mm × 14 mm, 0.5 mm pitch. Pin 1 marked by corner notch; thermal pad not present.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with IS61WV102436BLL-167BLI and MT55LSD256W36BG-167:J, the CY7C1380C-167BZI uniquely combines 512K × 36 density, 2.5/3.3 V I/O flexibility, hardware burst sequencing, and asynchronous sleep - making it irreplaceable in legacy Pentium-based embedded controllers requiring drop-in timing compliance.

Availability

CY7C1380C-167BZI is available at Aetrix Electronics and suitable for network packet buffering, CPU cache coherency subsystems, real-time video frame stores, and industrial motion controller buffers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1380C-167BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable logic solutions for industrial, automotive, and communications infrastructure markets.

The CY7C1380C belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic, low-latency data buffering in CPU-adjacent and packet-processing subsystems where pipeline predictability is non-negotiable.

FAQ

What is the function of the MODE pin on CY7C1380C-167BZI?

The MODE pin selects burst sequence behavior: tied to GND for linear burst (0,1,2,3…), or to VDD/floating for Intel Pentium interleaved burst (0,2,4,6… then 1,3,5,7…). It is a static strap pin - changing its state during operation causes undefined burst addressing and must be held stable throughout device use.

Can CY7C1380C-167BZI operate with only 2.5 V supplies?

No. The device requires a 3.3 V core supply (VDD/VSS) for internal logic and memory array operation. VDDQ may be 2.5 V or 3.3 V to match interfacing logic, but VDD must remain at 3.3 V ± 0.3 V; applying 2.5 V to VDD will prevent functional operation and may damage the device.

How does the ZZ pin affect power consumption and data retention?

When ZZ is driven HIGH, the device enters a low-power sleep mode drawing ≤70 mA standby current while preserving all stored data. Core clocks and I/O drivers are disabled, but memory cell charge remains intact. Data retention is guaranteed over commercial temperature range (0°C to +70°C) with no minimum refresh requirement.

Is JTAG boundary scan supported on the CY7C1380C-167BZI in TQFP package?

No. JTAG signals (TCK, TMS, TDI, TDO) are not bonded out in the 100-pin TQFP package (BZI suffix). They are available only in 119-ball BGA and 165-ball fBGA variants. For TQFP-based designs, boundary scan testing must be performed at board level using alternate methods such as bed-of-nails or flying probe.