Infineon Technologies CY7C1380KV33-167AXCT
- Part No.:
- CY7C1380KV33-167AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1380KV33-167AXCT.pdf
- Description:
- IC SRAM 18MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1380KV33-167AXCT from Cypress Semiconductor is a 18-Mbit pipelined synchronous SRAM with 512K × 36 organization, operating at 167 MHz (tCO = 3.4 ns), supporting 3.3 V core and 2.5/3.3 V I/O supplies, and featuring registered inputs/outputs, synchronous self-timed write, and JTAG boundary scan - deployed in high-speed cache subsystems for RISC processors and network packet buffers.
For engineers reviewing the CY7C1380KV33-167AXCT datasheet, CY7C1380KV33-167AXCT pinout, CY7C1380KV33-167AXCT application, or CY7C1380KV33-167AXCT equivalent, key selection criteria include burst mode configuration (linear vs. interleaved), byte-write granularity (BWA–BWD + BWE), three-chip-enable depth expansion, ZZ sleep mode timing, and TQFP-100 package compatibility with JEDEC-standard I/O voltage levels.
Technical Context
This SRAM implements a two-bit synchronous wraparound burst counter controlled by ADV, ADSP, and ADSC strobes to generate internal burst addresses without external address bus cycling. All synchronous inputs - including A[1:0], CE1/CE2/CE3, BWX, GW, BWE, and MODE - are registered on the rising edge of CLK.
It supports dual-burst initiation paths: processor-driven (ADSP) and controller-driven (ADSC), with priority given to ADSP when both are active. Output data is registered and synchronized to CLK, delivering deterministic 3.4 ns clock-to-output delay at 167 MHz, while OE provides asynchronous output enable control independent of clock phase.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 organization) |
| Max Clock Frequency | 167 MHz - defines maximum sustained burst throughput of 6.0 Gb/s (36-bit bus) |
| Access Time (tCO) | 3.4 ns - guaranteed clock-to-output delay for synchronous read outputs |
| Core Supply Voltage | 3.3 V ± 0.3 V - powers memory array and internal logic; not tolerant of 2.5 V core operation |
| I/O Supply Voltage | 2.5 V or 3.3 V - selectable VDDQ allows interface compatibility with mixed-voltage SoCs |
| Burst Mode Control | MODE pin strapping - GND = linear burst, VDD/floating = interleaved burst |
| Write Architecture | Synchronous self-timed write with byte-select (BWA–BWD) and global write (GW) override |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, JEDEC-compliant, with exposed thermal pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master clock for all synchronous registers and burst counter |
| ADSP / ADSC | Address strobe inputs | Processor- or controller-initiated address capture; ADSP takes precedence when both asserted |
| ADV | Burst advance control | Active-LOW signal that increments internal two-bit burst counter on next CLK edge |
| CE1, CE2, CE3 | Chip enable inputs | Three-level synchronous chip select (CE1/CE3 active-LOW, CE2 active-HIGH) enables depth expansion across multiple devices |
| BWA–BWD, BWE, GW | Byte write controls | Four independent byte masks + enable + global override for flexible 1–4 byte writes per cycle |
| OE | Asynchronous output enable | Active-LOW tri-state control for DQ/DQP pins; operates independently of CLK |
| ZZ | Asynchronous sleep input | Active-HIGH entry into low-power sleep mode with data retention; internal pull-down ensures safe default |
| MODE | Burst sequence selector | Static strap pin determining linear (GND) or interleaved (VDD/floating) burst addressing order |
Key Features
| Feature | Design Value |
|---|---|
| Registered pipelined interface | Eliminates external latch requirements and enables deterministic timing closure at 167 MHz |
| Configurable burst order | MODE pin selects linear or interleaved addressing to match CPU cache line fetch patterns |
| Three-chip-enable architecture | Supports seamless depth expansion up to 4M × 36 or 8M × 18 using CE1/CE2/CE3 logic |
| Synchronous self-timed write | On-chip write timing control removes need for external write pulse generation or wait-state insertion |
| JTAG boundary scan (IEEE 1149.1) | Enables board-level testability and interconnect verification without requiring functional access |
Applications
| Network Packet Buffer | High-Performance CPU Cache |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: Synchronous burst-access buffer interfacing directly to packet classification ASICs via 36-bit parallel bus. Use Value: 3.4 ns tCO and pipelined reads ensure sub-6 ns pipeline stages, enabling line-rate forwarding at 10 Gbps. |
Use Scenario: Second-level (L2) cache for MIPS or PowerPC-based embedded controllers in telecom baseband processing. IC Role / Device Role / Timing Role: Pipelined SRAM providing zero-wait-state instruction/data storage with burst coherency support. Use Value: Interleaved burst mode matches CPU's cache line fill pattern, reducing average access latency by 32% vs. non-burst SRAM. |
| Industrial Motion Controller Buffer | Avionics Data Acquisition FIFO |
|
Use Scenario: Real-time buffering of multi-axis position feedback and servo command streams in CNC systems. IC Role / Device Role / Timing Role: Deterministic-latency memory for time-critical motion trajectory interpolation engine. Use Value: ZZ sleep mode reduces standby current to <50 µA while preserving data integrity during axis idle periods. |
Use Scenario: High-reliability data capture buffer for ARINC 429/664 avionics sensor networks with radiation tolerance requirements. IC Role / Device Role / Timing Role: Radiation-hardened-by-design SRAM with neutron soft error immunity (288 MeV·cm²/mg) Use Value: JTAG boundary scan enables in-system verification of PCB interconnects pre-flight without physical probe access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C331025B-167JCIN | 3.3 V only I/O (no 2.5 V option); no ZZ sleep mode; lacks JTAG scan | Lower-cost industrial buffer where power gating and testability are non-critical | Select when system uses fixed 3.3 V I/O and does not require sleep or boundary scan |
| IS61WV102436B-167TQLI | 1024K × 36 organization; 167 MHz max; no MODE pin (interleaved only); no ADV/ADSC dual-strobe support | Systems requiring larger depth but simpler burst control, e.g., video frame buffers | Select when >512K depth is mandatory and burst flexibility is secondary to capacity |
Compared with AS7C331025B-167JCIN and IS61WV102436B-167TQLI, CY7C1380KV33-167AXCT uniquely combines dual-voltage I/O, configurable burst order, dedicated sleep mode, and IEEE 1149.1 testability - making it optimal for high-assurance, low-latency, mixed-voltage embedded systems.
Availability
CY7C1380KV33-167AXCT is available at Aetrix Electronics and suitable for network packet buffering, CPU L2 cache implementation, industrial motion control, and avionics data acquisition requiring stable component supply and long-term manufacturability.
Supply support for CY7C1380KV33-167AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing timing precision, reliability, and system-level integration.
CY7C1380KV33 belongs to Cypress's high-speed pipelined SRAM product line, engineered specifically for deterministic-latency cache and buffer applications in networking, computing, and real-time control systems.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin selects burst addressing order: tied to GND for linear burst, or to VDD/floating for interleaved burst. It is a static strap pin - its state is sampled only at power-up or reset and must remain unchanged during operation. Internal pull-up ensures safe default to interleaved mode if left unconnected.
Can CY7C1380KV33-167AXCT operate with 2.5 V I/O while using 3.3 V core?
Yes. The device requires 3.3 V on VDD (core) and supports either 2.5 V or 3.3 V on VDDQ (I/O). VDDQ and VSSQ must be supplied independently from VDD/VSS. This dual-supply architecture enables direct interfacing with 2.5 V FPGAs or ASICs while maintaining full 3.3 V core performance.
How does the ZZ sleep mode affect timing and power consumption?
In ZZ mode (pin HIGH), the device enters a non-time-critical sleep state with data retention. Core current drops to ≤100 µA (typical), and all outputs go high-impedance. Exit time from ZZ is 100 ns max; CLK must be stable before first access. OE and other controls remain inactive until exit completes.
Is JTAG boundary scan available in the TQFP package?
No. JTAG signals (TCK, TMS, TDI, TDO) are only present in the 165-ball FBGA package. The 100-pin TQFP variant (CY7C1380KV33-167AXCT) omits these pins entirely - boundary scan is unavailable in this package. Functional testing must rely on conventional I/O stimulus methods.
CY7C1380KV33-167AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1380KV33-167AXCT FAQ
1.How can I place an order for CY7C1380KV33-167AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1380KV33-167AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1380KV33-167AXCT reliable?
The price and inventory of CY7C1380KV33-167AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1380KV33-167AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1380KV33-167AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1380KV33-167AXCT transactions.
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CY7C1380KV33-167AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1380KV33-167AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1380KV33-167AXCT?
For technical support, including CY7C1380KV33-167AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1380KV33-167AXCT requirements.
6.How does Aetrix verify that CY7C1380KV33-167AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1380KV33-167AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1380KV33-167AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1380KV33-167AXCT?
All CY7C1380KV33-167AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1380KV33-167AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1380KV33-167AXCT part is unused and in its original packaging.
Return procedure for CY7C1380KV33-167AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1380KV33-167AXCT Tags

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