Infineon Technologies CY7C1380KV33-167AXI

Overview

CY7C1380KV33-167AXI from Cypress Semiconductor is a 18-Mbit pipelined synchronous SRAM configured as 512K × 36, operating at 167 MHz with 3.3 V core and 2.5/3.3 V I/O supplies. It features registered inputs/outputs, synchronous self-timed write, asynchronous output enable, and supports linear or interleaved burst modes via MODE pin. Used in high-speed secondary cache subsystems for RISC and x86 processors requiring deterministic 3-1-1-1 access timing.

For engineers reviewing the CY7C1380KV33-167AXI datasheet, CY7C1380KV33-167AXI pinout, CY7C1380KV33-167AXI application, or CY7C1380KV33-167AXI equivalent, key selection criteria include burst address control (ADSP/ADSC/ADV), byte-write granularity (BWA–BWD + BWE), JTAG boundary-scan support, and dual-voltage I/O compatibility with 2.5 V or 3.3 V systems.

Technical Context

This SRAM implements a two-bit synchronous wraparound burst counter, clocked by CLK on rising edge, with address latching controlled by ADSP (processor strobe) or ADSC (controller strobe). All synchronous inputs-including A[1:0], CE1/CE2/CE3, BWX, BWE, GW, and ADV-are registered on CLK rise; OE and ZZ remain asynchronous.

Burst sequencing is determined by the static MODE pin (GND = linear, VDD/floating = interleaved), while internal self-timed write logic eliminates external write timing constraints. The device supports four-byte-wide writes with individual byte enables and global write override, all synchronized to CLK with guaranteed tCO ≤ 3.4 ns at 167 MHz.

Key Specifications

Pinout & Package

Package: 100-pin JEDEC-standard Pb-free TQFP (14 × 20 × 1.4 mm), RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed pipelined SRAM applications.

Compared with AS7C331025B-167BIN and IS61WV102432BLL-167TQLI, CY7C1380KV33-167AXI uniquely delivers dual-voltage I/O, JTAG testability, and hardware-supported ADSP/ADSC arbitration-critical for complex cache and multi-protocol buffer designs.

Availability

CY7C1380KV33-167AXI is available at Aetrix Electronics and suitable for processor cache interfaces, network packet buffers, industrial motion controllers, and ATE pattern memory requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1380KV33-167AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with expertise in SRAM, Flash, PSoC, and USB controllers.

CY7C1380KV33 belongs to Cypress's high-speed pipelined SRAM product line, engineered specifically for deterministic-latency secondary cache and burst-buffer applications in networking, computing, and industrial control.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst addressing order: tied to GND for linear burst, or to VDD/floating for interleaved burst. It is a static strap pin sampled at power-up and must remain unchanged during operation. Internal pull-up ensures safe default to interleaved mode if left unconnected. No dynamic switching is supported.

Can CY7C1380KV33-167AXI operate with 2.5 V I/O while using 3.3 V core supply?

Yes. The device requires 3.3 V on VDD (core) and supports either 2.5 V or 3.3 V on VDDQ (I/O supply). VSSQ must match VDDQ ground reference. This dual-voltage capability allows direct interfacing with 2.5 V ASICs or FPGAs without level shifters, preserving signal integrity and timing margins.

How does the ZZ sleep mode affect data retention and wake-up timing?

When ZZ is driven HIGH, the device enters non-time-critical sleep with full data retention. Core and I/O circuitry are gated, reducing current to <50 µA. Wake-up occurs synchronously on the next CLK rising edge after ZZ returns LOW; no additional stabilization delay is required, and the first valid access completes within standard tCO.

Is JTAG boundary scan available in the TQFP package of CY7C1380KV33-167AXI?

No. JTAG signals (TCK, TMS, TDI, TDO) are only present in the 165-ball FBGA package variant. The 100-pin TQFP package (including -167AXI) omits these pins entirely. Boundary scan functionality is therefore unavailable for TQFP-based designs; system-level test must rely on functional I/O testing or external scan tools.