Infineon Technologies CY7C1380KV33-167BZI

Overview

CY7C1380KV33-167BZI from Cypress Semiconductor is a 18-Mbit pipelined synchronous SRAM with 512K × 36 organization, operating at 167 MHz (t_CO = 3.4 ns), supporting 3.3 V core and 2.5/3.3 V I/O supplies, and featuring registered inputs/outputs for high-speed burst-mode cache interfacing in networking line cards and telecom switching fabric.

For engineers reviewing the CY7C1380KV33-167BZI datasheet, CY7C1380KV33-167BZI pinout, CY7C1380KV33-167BZI application, or CY7C1380KV33-167BZI equivalent, key selection factors include its 100-pin TQFP package, synchronous self-timed write, interleaved/linear burst control via MODE pin, and JTAG boundary-scan support for system-level testability.

Technical Context

This SRAM implements a two-bit wraparound burst counter synchronized to CLK's rising edge, with address latching controlled by ADSP (processor strobe) or ADSC (controller strobe), and burst advancement triggered by ADV. All synchronous inputs-including A[1:0], CE1/CE2/CE3, BWA–BWD, BWE, GW, and OE-are registered on the clock edge.

It supports byte-write operations via four independent byte-write drivers (DQA/DQP A through DQD/DQP D), each controlled by corresponding BWX and BWE, plus global write (GW) that overrides all byte selects. Output enable (OE) is asynchronous, enabling fast tri-state control independent of clock timing.

Key Specifications

Pinout & Package

Package: 100-pin JEDEC-standard Pb-free TQFP (14 × 20 × 1.4 mm), RoHS-compliant, with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with AS7C331663A-167BIN and IS61WV102436B-167TQLI, CY7C1380KV33-167BZI uniquely supports dual-voltage I/O, integrated JTAG, and asynchronous ZZ sleep - making it optimal for telecom and aerospace designs demanding testability, flexibility, and power-aware operation.

Availability

CY7C1380KV33-167BZI is available at Aetrix Electronics and suitable for network line card cache, telecom switch fabric buffer, and baseband processor L2 cache applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1380KV33-167BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.

CY7C1380KV33 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-mode secondary cache and packet buffer applications in carrier-grade networking and real-time signal processing systems.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst addressing order: tied to GND for linear burst, or to VDD/floating for interleaved burst. It is a static strap pin-must be set at power-up and remain unchanged during operation. Internal pull-up ensures safe default (interleaved) if left unconnected, but explicit grounding is required for linear mode.

Can CY7C1380KV33-167BZI operate with mixed 2.5 V and 3.3 V I/O interfaces on the same device?

No. VDDQ must be set to a single voltage-either 2.5 V or 3.3 V-for all I/O pins (DQx, DQP x, OE, etc.). The device does not support split I/O voltage domains. System design must ensure all connected logic shares the chosen VDDQ level to avoid contention or damage.

Is the ZZ pin compatible with automatic power-down control from an FPGA GPIO?

Yes. ZZ is asynchronous and active-HIGH, with internal pull-down. An FPGA GPIO can drive it directly-asserting HIGH enters low-power sleep (<5 mA ICC), and driving LOW returns to full operation. No external pull-up is needed, and no timing relationship to CLK is required.

Does the 100-pin TQFP package include JTAG pins?

No. TQFP packaging omits TDI, TDO, TMS, and TCK pins-JTAG boundary-scan is unavailable in this variant. Only the 165-ball FBGA package supports IEEE 1149.1. Designers requiring scan testing must select the FBGA variant or implement alternative test strategies for TQFP-based boards.